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Molding method

A forming method and a technology for forming holes, which are applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as cracks, deformation, and whitening in the forming edge area, and achieve the effect of improving hole cracks

Inactive Publication Date: 2012-05-16
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even if the step-by-step molding method is adopted, it will lead to cracks, whitening or deformation in the area between the hole and the forming edge after the punching is completed.

Method used

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Experimental program
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Embodiment Construction

[0043] The forming method of the technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0044] Please also refer to figure 1 and figure 2 , the molding method provided in Embodiment 1 of the technical solution includes the following steps:

[0045] First, a punched and drilled circuit board substrate 10 is provided.

[0046] The circuit board substrate 10 is a punched circuit board substrate. The circuit board substrate 10 is divided into a product area 101 and a non-product area 100 . The boundary between the product area 101 and the non-product area 100 is a forming edge 102 . The forming edge 102 is sequentially connected end to end by a first edge 111 , a second edge 112 , a third edge 113 , and a fourth edge 117 , and the appearance of the forming edge 102 is roughly rectangular. Wherein, the first sideline 111 is parallel to the third sideline 113 and is perpendicular to the second sideline 112 ...

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PUM

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Abstract

A molding method is disclosed. The method is characterized in that: a substrate is provided; the substrate possesses a product area and a non-product area; a boundary of the product area and the non-product area is a molding edge; the product area possesses at least one product unit; a plurality of product holes are existed in the product area; at least one product hole in the product holes is adjacent with the molding edge; at least one auxiliary hole is formed in the non-product area next to the at least one product hole which is adjacent with the molding edge. Molding operation is performed to the substrate along the molding edge so as to form a product unit.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a forming method of a circuit board and its accessories. Background technique [0002] With the rapid development of the electronic industry, the manufacturing technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally made of a copper-clad substrate through a series of processes such as cutting, drilling, etching, exposure, development, pressing, and molding. For details, please refer to the article "Dielectric characterization of printed circuit board substrates" published by C.H.Steer et al. in Proceedings of the IEEE, Vol.39, No.2 (August 2002). [0003] At present, in the manufacture of circuit boards, whether it is an accessory or the circuit board itself, generally a plurality of units with the same structure and function are laid out on a larger substrate. After the circ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 邹立
Owner AVARY HLDG (SHENZHEN) CO LTD