Method for manufacturing circuit boards
A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as unfavorable circuit board quality, separation of adhesive layers, and high stress on the connection part of flexible printed circuit boards.
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[0039] The manufacturing method of the circuit board provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and multiple embodiments.
[0040] The first embodiment of the technical solution provides a method for manufacturing a circuit board, which includes the following steps:
[0041] For the first step, please also refer to figure 1 with figure 2 , a flexible circuit board 10 is provided, which includes a connecting portion 11 , a first flexible substrate portion 12 and a second flexible substrate portion 13 . The connecting portion 11 is in the shape of a cuboid. The connection portion 11 includes a first connection area 110 , a second connection area 111 and a blank area 112 connected between the first connection area 110 and the second connection area 111 . At least one of the first connection area 110 and the second connection area 111 is distributed with conductive lines 14 . The conductive circui...
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