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Method for manufacturing circuit boards

A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as unfavorable circuit board quality, separation of adhesive layers, and high stress on the connection part of flexible printed circuit boards.

Active Publication Date: 2012-05-30
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The connection part of the flexible printed circuit board has relatively high stress and is easy to separate from the adhesive layer, which is not conducive to improving the quality of the circuit board

Method used

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  • Method for manufacturing circuit boards
  • Method for manufacturing circuit boards
  • Method for manufacturing circuit boards

Examples

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Embodiment Construction

[0039] The manufacturing method of the circuit board provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and multiple embodiments.

[0040] The first embodiment of the technical solution provides a method for manufacturing a circuit board, which includes the following steps:

[0041] For the first step, please also refer to figure 1 with figure 2 , a flexible circuit board 10 is provided, which includes a connecting portion 11 , a first flexible substrate portion 12 and a second flexible substrate portion 13 . The connecting portion 11 is in the shape of a cuboid. The connection portion 11 includes a first connection area 110 , a second connection area 111 and a blank area 112 connected between the first connection area 110 and the second connection area 111 . At least one of the first connection area 110 and the second connection area 111 is distributed with conductive lines 14 . The conductive circui...

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Abstract

A method for manufacturing circuit boards includes steps of providing a flexible circuit board which is provided with a first connecting area, a second connecting area and a blank area, manufacturing at least one opening or a plurality of through holes in the blank area, applying adhesive in the first connecting area, and bending the flexible circuit board along the extending direction of the openings or the through holes so as to lead the second connecting area to be adhered to the first connecting area through adhesives, wherein the blank area is connected between the first connecting area and the second connecting area, and conductive circuits are distributed in at least one of the first connecting area and the second connecting area.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a circuit board in which a connecting portion is firmly bonded with an adhesive. Background technique [0002] Flexible Printed Circuit Board (FPCB) is widely used in electronic products such as mobile phones due to its light, thin, short, small and bendable characteristics, and is used for electrical connection between different circuits. With the continuous development of electronic products such as folding mobile phones and slider mobile phones, higher requirements are put forward for the bending performance of FPCB. [0003] In a common flexible printed circuit board, an adhesive layer is formed at the connecting portion, and after the connecting portion is bent, different regions of the connecting portion are bonded to opposite sides of the adhesive layer respectively. The connection part of the flexible printed circuit board has a relative...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 黄凤艳
Owner AVARY HLDG (SHENZHEN) CO LTD
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