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Full-automatic release paper cutting machine

A release paper and paper cutter technology, which can be used in metal processing, sending objects, thin material processing, etc., and can solve the problems of consuming human, financial and material resources.

Inactive Publication Date: 2012-06-13
厦门市弘瀚电子科技有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

In order to facilitate the operation, the release paper must be cut into the size of the LED wafer carrier. This cutting process consumes a lot of human, financial and material resources

Method used

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Embodiment Construction

[0019] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0020] see figure 1 and figure 2 , a fully automatic release paper cutter, comprising: a frame (100), a paper cutting mechanism (200), a paper feeding mechanism (300), a paper clamping mechanism (400), a paper feeding brake mechanism (500), A paper guide mechanism (700), a paper correction mechanism (600), and a PLC and touch screen control system (800).

[0021] see figure 1 and image 3 , the paper cutting mechanism (200) is arranged above the frame (100) for cutting off the release paper; It further includes: paper cutting cylinder (201), paper cutting linear guide pair (202), upper fixing seat of paper cutting mechanism (203), floating joint (204), cutter (205), resting knife rest (206), resting Knife holder fixing seat (207); the paper cutting cylinder (201) is fixed on the paper cutting mechanism fixing seat (203) to provide power for the movement of the ...

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Abstract

The invention relates to a full-automatic release paper cutting machine. The machine comprises a frame, a paper cutting mechanism, a paper feeding mechanism, a paper clamping mechanism, a paper feeding braking mechanism, a paper guiding mechanism, a paper straightening mechanism and a programmable logic controller (PLC) and touch screen control system, wherein the paper cutting mechanism is arranged above the frame and used for cutting release paper off; the paper feeding mechanism is arranged above the frame and in front of the paper cutting mechanism and used for feeding the release paper; the paper clamping mechanism is arranged above the frame and in front of the paper feeding mechanism and used for fixing the release paper; the paper feeding braking mechanism is arranged above the frame and below the paper clamping mechanism and used for braking paper feeding; the paper straightening mechanism is arranged between the paper feeding mechanism and the paper clamping mechanism and used for straightening the release paper; the paper guiding mechanism is arranged above the paper straightening mechanism and used for guiding the release paper; and the PLC and touch screen control system is arranged on the frame and used for controlling the movement of each mechanism. The full-automatic release paper cutting machine has the characteristics that: the whole roll of paper is fed into a release paper machine type by the paper clamping mechanism, and the release paper is guided and straightened by the paper guiding mechanism and the paper straightening mechanism, so that the release paper can straightly enter the paper feeding mechanism, and is continuously and fully automatically cut off by the paper cutting mechanism, manual operation is not needed in the paper cutting process, and high automation is achieved.

Description

technical field [0001] The invention relates to the production field of LED chips, in particular to an automatic device capable of fully automatic cutting off the release paper. Background technique [0002] LED is a solid-state semiconductor device that utilizes the characteristic of converting electricity into light to realize LED light emission. The heart of the LED is a semiconductor chip, so it is very important to control the production process of the LED chip to improve the quality of the LED lamp. In the production process of LED chips, it involves the production of LED wafer carriers, and the production of LED wafer carriers is in a high-clean workshop, so a layer of release paper must be pasted on the surface of the LED wafer carrier to keep the LED Cleanliness of the wafer carrier. In order to facilitate the operation, the release paper must be cut into the size of the LED wafer carrier. This cutting process consumes a lot of human, financial and material resour...

Claims

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Application Information

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IPC IPC(8): B26D1/06B26D7/02B26D7/28B26D7/08B65H35/06
Inventor 卢传播
Owner 厦门市弘瀚电子科技有限公司
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