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Circuit board manufacturing method

A manufacturing method and circuit board technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as lowering work efficiency, unreliable connection between soft boards and hard boards, and liquid inflow, so as to achieve reliable electrical characteristics and save production time. The effect of improving efficiency

Active Publication Date: 2012-06-13
SHENZHEN WUZHU TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technology, the combination of the soft board and the hard board needs to be cut twice by a cutting machine, which not only makes the process cumbersome, wastes time, reduces work efficiency, but also makes the existence of cutting grooves on the hard board make The connection between the soft board and the hard board is not reliable, which affects the electrical performance
In addition, due to the existence of cutting grooves, some liquid will flow in and affect other components on the circuit board during glue application or cleaning.

Method used

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  • Circuit board manufacturing method
  • Circuit board manufacturing method

Examples

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Embodiment Construction

[0016] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] Figure 1 to Figure 5 It is a specific manufacturing method of a circuit board of the present invention, which comprises the following steps:

[0018] First, if figure 1 As shown, a hard board 11 with a preset area is provided, and a reserved hollow area for installing a soft board is provided on the hard board 11, and a laser or a milling cutter is used to set a hollow area at a predetermined position of the reserved hollow area. Two cutting grooves 110 are spaced apart from each other, and the two cutting grooves 110 are closed figures. In this embodiment, the lengths of the two cutting grooves are equal, and the closed figure surrounded by the two and their two ends is rectangular.

[0019] Next, if figure 2 As shown, a flexible board substrate 12 is provided, and the flexible board substrate 12 is provided with a region 120 to ...

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Abstract

This invention relates to a circuit board manufacturing method which comprises the following steps: providing a hard board, wherein a hollow area is formed at a preset position on the hard board; providing a soft board, wherein the soft board is provided with a preset pattern; providing a bonding sheet for bonding the soft board to the hollow area of the hard board; and carrying out shape cutting, namely, simultaneously cutting the hard board and the soft board into a preset shape so as to obtain a circuit board. By using the method disclosed by the invention, an operation of cutting the hard board is omitted; and the soft board is directly placed at the corresponding position on the hard board, so that the manufacturing time is saved and the efficiency is improved; moreover a better connection between the hard board and the soft board can be ensured.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a soft-rigid combination board. Background technique [0002] Rigid-Flex Printed Board (or F / R PWB, Rigid-Flex Board) is a combination of FPC (Flexible Printed Circuits, flexible printed circuit board) and PCB (Printed Circuits Board, printed circuit board) The same circuit board, as an electronic part of a product, has always been widely used in military, medical, industrial instruments and other fields due to its good durability and flexibility. [0003] However, as electronic products are becoming more and more light, thin, short, small and multi-functional, rigid-flex boards have also begun to be used in other types of electronic products, such as mobile phones, notebook computers, cameras, video cameras, etc. It can not only reduce the assembly size and weight of electronic products, avoid wiring errors, but also increase assembly flex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
Inventor 徐学军
Owner SHENZHEN WUZHU TECH
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