Calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and preparation method thereof

Abstract

The invention relates to a calcium-aluminum-boron-silicon glass and fused quartz low-temperature co-fired ceramic material and a preparation method thereof. In the ceramic material, the calcium-aluminum-boron-silicon low-melting-point glass phase accounts for 50-70% of the total material mass. The preparation method comprises the steps of: weighing raw materials according to the molar percentages of oxides required by the low-melting-point glass phase, maintaining the temperature at 1500-1600 DEG C for 3-5 hours, directly pouring the molten glass into deionized water to obtain glass slag, and ball-milling to obtain glass powder with average granularity of 1-3 mu m; ball-milling fused quartz to obtain fused quartz powder with average granularity of 3-5 mu m; uniformly mixing 50-70wt% of low-melting-point glass phase and high-melting-point ceramic filling phase, adding a polyvinyl alcohol adhesive accounting for 3wt% of the mixed material, granulating and carrying out dry pressing to obtain blank sheets; and sintering to obtain the low-temperature co-fired ceramic material. The obtained low-temperature co-fired ceramic material has low sintering temperature, and can be co-fired with gold, silver, copper and other conductor materials; the obtained material is high in densification degree, low porosity and lower in thermal expansion coefficient; and the process flow is simple and the cost is low.

Description

technical field [0001] The invention relates to a low-temperature co-fired ceramic material with a low thermal expansion coefficient and a preparation method thereof, belonging to the field of electronic packaging materials. Background technique [0002] With the rapid development of microelectronics technology, electronic circuits are increasingly miniaturized and integrated. However, the development of electronic packaging technology has not been matched with it, which has become a bottleneck restricting the continued development of microelectronic technology. Low temperature cofired ceramics (Low Temperature Cofired Ceramics, LTCC) technology, as a new electronic packaging technology that has emerged in recent years, has received extensive attention and research by researchers at home and abroad. It involves a wide range of fields such as circuit design, microwave technology, and material science. In particular, material technology, which plays a key role, has received ...

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Problems solved by technology

The disadvantage is that the crystallization process is difficult to control, the material properties are difficult to predict, espe

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