Wafer testing device and method for the same

A technology of wafer testing and testing equipment, which is applied in the direction of measuring equipment, single semiconductor device testing, measuring electricity, etc., can solve the problems of probe card leakage, measurement probe accuracy influence, loop oscillation, etc., and achieve accuracy improvement Effect

Active Publication Date: 2012-06-27
WUXI ZGMICRO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the process of realizing the present invention, the inventors have found that the prior art has at least the following defects: First, the probe cards in the prior art usually have electric leakage, and when using the probe card including electric leakage for testing, if these electric leakage On the low-impedance ...

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  • Wafer testing device and method for the same
  • Wafer testing device and method for the same
  • Wafer testing device and method for the same

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Embodiment Construction

[0037] The detailed description of the present invention directly or indirectly simulates the operation of the technical solution of the present invention mainly through programs, steps, logic blocks, processes or other symbolic descriptions. In the ensuing description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. Rather, the invention may be practiced without these specific details. These descriptions and representations herein are used by those skilled in the art to effectively convey the substance of their work to others skilled in the art. In other words, for the purpose of avoiding obscuring the present invention, well-known methods, procedures, components and circuits have not been described in detail since they are readily understood.

[0038] Reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure or characteristic that can be included in at least one implementa...

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Abstract

The invention discloses a wafer testing device and a method for the same, belonging to the field of chip manufacturing. The wafer testing device comprises at least one set of measuring probe card, and the measuring probe card comprises a measuring probe for measuring a wafer signal; and the wafer testing device also comprises at least one set of fusing probe card, and the fusing probe card comprises a fusing probe for trimming or programming the wafer. In the wafer testing device, the measuring probe and the fusing probe are separately designed in different probe cards, further, the measuring probes for testing different projects also can be separately designed in different probe cards, so that the accuracy of the measurement result of the measuring probes is improved obviously, and the accuracy of the wafer testing phase is guaranteed, and the quality of the chip is improved.

Description

【Technical field】 [0001] The invention relates to the field of wafer testing, in particular to a wafer testing device and method. 【Background technique】 [0002] In the chip manufacturing process, it can be divided into four major steps: IC design, wafer manufacturing process, wafer testing and wafer packaging. [0003] Wafers are usually circular silicon wafers with diameters of 4 inches, 6 inches, 8 inches, and 12 inches. In the wafer process stage, a large number of chips that are tightly and regularly distributed will be formed on the wafer. Depending on the size of the wafer, there may be hundreds to hundreds of thousands of chips on a wafer. In the wafer test stage, a test environment is usually built by the test machine and the probe card, and the chips on the wafer are tested in this environment to ensure that the electrical characteristics and functions of each chip meet the design specifications and specifications. . Wafers that fail the test will be marked as b...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01R1/073
Inventor 王钊
Owner WUXI ZGMICRO ELECTRONICS CO LTD
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