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Phosphorus-containing phenolic resin, resin composition and cured product

A technology of phenolic resin and its meaning, applied in the field of phosphorus-containing phenolic resin and curable resin composition, can solve the problem of low adhesiveness, poor adhesiveness and heat-resistant reliability of epoxy resin cured products, and difficult to remove completely. Solvent and other problems, to achieve the effect of good compatibility and excellent flame retardancy

Active Publication Date: 2016-01-20
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are problems such as low adhesiveness. In addition, high-boiling point solvents are used in the solvent of the varnish, and the solvent solubility of the resin is not satisfactory.
Patent Document 3 also proposes a phosphorus-containing phenolic resin with improved compatibility with epoxy resins. However, since cyclohexanone with a high boiling point is used as a reaction solvent, it is difficult to completely remove the solvent during the production process of laminated boards. There is a possibility that the adhesiveness and heat resistance reliability of the epoxy resin cured product may deteriorate

Method used

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  • Phosphorus-containing phenolic resin, resin composition and cured product
  • Phosphorus-containing phenolic resin, resin composition and cured product
  • Phosphorus-containing phenolic resin, resin composition and cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Bisphenol F type epoxy resin (Nippon Steel Chemical Co., Ltd. product name YDF-170, epoxy equivalent 170g / eq.) 84.9 parts, drop into 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide (trade name HCA-HQ manufactured by Sanko Co., Ltd. , a melting point of 256° C., a phosphorus content of 9.6%, a hydroxyl equivalent of 162 g / eq.) 78.3 parts, a trishydroxyphenylmethane type novolak resin (trade name RESITOPTPM-100 manufactured by Qunei Chemical Industry Co., Ltd., a hydroxyl equivalent of 97.5 g / eq.) 50.4 parts and propylene glycol monomethyl ether acetate (PMA) 53 parts. At this time, the ratio of the phosphorus-containing phenolic compound in all phenolic compounds was 61%, and the functional group ratio of the epoxy resin to the phosphorus-containing phenolic compound and the phosphorus-free phenolic resin was 1.00:0.96:1.04. Triphenylphosphine was added thereto as a catalyst and reacted at 160° C. for 3 hours, and then diluted by adding a mixed solve...

Embodiment 2

[0088] It reacted by the method similar to Example 1 except having changed TPM-100 of Example 1 into 51.6 parts of bisphenol F (made by Honshu Chemical Industry Co., Ltd., hydroxyl equivalent: 100g / eq.). At this time, the ratio of the phosphorus-containing phenolic compound in all the phenolic compounds was 60%, and the functional group ratio of the epoxy resin, the phosphorus-containing phenolic compound and the phosphorus-free phenolic resin was 1.00:0.96:1.04. After the reaction, dilute with PGM / MEK mixed solvent. The obtained phosphorus-containing phenolic resin solution is light yellow and transparent, with a non-volatile component of 60%, a phosphorus content of 3.5%, a number average molecular weight of 1620, and a hydroxyl equivalent of 430g / eq. Table 1 shows the input amount, the input ratio, the properties of the resin, and the like.

Embodiment 3

[0090] Except that YDF-170 of embodiment 1 is changed to alkylene glycol type epoxy resin (Nippon Steel Chemical Co., Ltd. trial product name TX-0929, epoxy equivalent is 140g / eq.) 70.3 parts, pass and implement Example 1 reacted in the same way. At this time, the ratio of the phosphorus-containing phenolic compound in all the phenolic compounds was 58%, and the functional group ratio of the epoxy resin, the phosphorus-containing phenolic compound and the phosphorus-free phenolic resin was 1.00:0.92:1.08. After the reaction, dilute with PGM / MEK mixed solvent. The obtained phosphorus-containing phenolic resin solution is light yellow and transparent, with a non-volatile content of 60%, a phosphorus content of 3.6%, a number-average molecular weight of 1943, and a hydroxyl equivalent of 393g / eq. Table 1 shows the input amount, the input ratio, the properties of the resin, and the like.

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Abstract

PROBLEM TO BE SOLVED: To provide a phosphorus-containing phenol resin that can serve as a curing agent for an epoxy resin, can be easily dissolved in an organic solvent, has good compatibility with an epoxy resin, and is superior in workability, curability, and moldability. SOLUTION: The novel phosphorus-containing phenol resin having a number average molecular weight of 500-5,000 is obtained by reacting an epoxy resin with a phosphorus-containing phenol compound having a specific structure such as 10-(2, 5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide and a di- or higher functional phosphorous-free phenol compound. COPYRIGHT: (C)2012,JPO&INPIT

Description

technical field [0001] The present invention relates to a flame-retardant phosphorus-containing phenolic resin, a curable resin composition containing the phosphorus-containing phenolic resin, and a cured product of the resin composition. Background technique [0002] Utilizing its excellent heat resistance, adhesiveness, mechanical properties, electrical properties, etc., phenolic resins are used as molding materials for various substrates, adhesives for friction materials, adhesives for abrasive materials, adhesives for wood, Adhesives for casting molds, adhesives for laminated materials, coating agents, epoxy resin curing agents, etc. are widely used. [0003] In particular, when used as a laminated material for electric / electronic equipment, it is strongly required to impart flame retardancy in order to prevent combustion and control smoke emission in a fire. As a flame retardant method for resins for laminates, conventionally, bromine-based flame retardants, nitrogen-b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08L63/00C08L63/02
Inventor 森田阳子石原一男
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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