Urethane resin composition, cured object, and photosemiconductor device using cured object
A technology of polyurethane resin and resin composition, which can be used in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., and can solve problems such as deterioration of adhesion
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Embodiment 1
[0255] 9.7 parts by mass of polyol (A1) was added to 27.1 parts by mass of isocyanate (B1) and 24.4 parts by mass of isocyanate (B2), and reacted at 80°C for 6 hours under a nitrogen atmosphere to prepare a prepolymer with residual isocyanate groups. things. 0.05 parts by mass of zinc stearate (C1) was added as a curing catalyst to the prepolymer in which isocyanate groups remained, and an isocyanate component B liquid was prepared.
[0256] Separately, 0.1 part by mass of antioxidant (D1) was added to 38.7 parts by mass of polyol (A1), and heated and stirred at 80° C. for 1 hour under a nitrogen atmosphere to prepare a transparent and uniform polyol component A liquid.
[0257] 61.25 parts by mass of the above liquid A and 38.8 parts by mass of the above liquid B were mixed and stirred at room temperature until they became transparent and uniform, thereby preparing a resin composition.
Embodiment 2
[0259] 4.5 parts by mass of polyol (A2) was added to 54.6 parts by mass of isocyanate (B3), and it was made to react at 80 degreeC for 6 hours in nitrogen atmosphere, and the prepolymer which remained isocyanate group was prepared. 0.05 parts by mass of zinc stearate (C1) was added to the prepolymer of this remaining isocyanate group to prepare an isocyanate component B liquid.
[0260] Separately, 0.1 part by mass of antioxidant (D1) was added to 40.9 parts by mass of polyol (A1), and heated and stirred at 80° C. for 1 hour under a nitrogen atmosphere to prepare a transparent and uniform polyol component A liquid.
[0261] 41 parts by mass of the above liquid A and 59.2 parts by mass of the above liquid B were mixed and stirred at room temperature until they became transparent and uniform, thereby preparing a resin composition.
Embodiment 3
[0263] 8.1 parts by mass of polyol (A2) was added to 18.1 parts by mass of polyol (A1), followed by heating and stirring to prepare a polyol component A liquid.
[0264] 1.5 parts by mass of polyol (A2) and 15.2 parts by mass of isocyanate (B1) were mixed, heated and stirred at 100° C. for 3 hours in a nitrogen atmosphere, and a prepolymer in which isocyanate groups remained was prepared. After mixing 16.7 parts by mass of the prepolymer with remaining isocyanate groups, 15.9 parts by mass of isocyanate (B4), 41.2 parts by mass of isocyanate (B5), and 0.1 part by mass of antioxidant (D1), butyl acetate was distilled off to obtain a uniform resin solution.
[0265] 0.05 mass part of zinc stearate (C1) was added as a catalyst to this resin solution, it heated and stirred, and the isocyanate component B liquid was prepared.
[0266] The above liquid A and the above liquid B were mixed and stirred at room temperature until they became transparent and homogeneous, thereby preparin...
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