Urethane resin composition, cured object, and photosemiconductor device using cured object

A technology of polyurethane resin and resin composition, which can be used in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., and can solve problems such as deterioration of adhesion

Inactive Publication Date: 2012-07-04
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In addition, although it is considered that epoxy resin, silicone resin, polyurethane resin, etc. are used as sealing members from the viewpoint of light transmission and mechanical strength, and these resins generally have excellent adhesion to materials, but compared with silver and gold, they are not compatible with other materials. Compared with metal, there is a tendency to deteriorate the adhesion

Method used

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  • Urethane resin composition, cured object, and photosemiconductor device using cured object
  • Urethane resin composition, cured object, and photosemiconductor device using cured object
  • Urethane resin composition, cured object, and photosemiconductor device using cured object

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0255] 9.7 parts by mass of polyol (A1) was added to 27.1 parts by mass of isocyanate (B1) and 24.4 parts by mass of isocyanate (B2), and reacted at 80°C for 6 hours under a nitrogen atmosphere to prepare a prepolymer with residual isocyanate groups. things. 0.05 parts by mass of zinc stearate (C1) was added as a curing catalyst to the prepolymer in which isocyanate groups remained, and an isocyanate component B liquid was prepared.

[0256] Separately, 0.1 part by mass of antioxidant (D1) was added to 38.7 parts by mass of polyol (A1), and heated and stirred at 80° C. for 1 hour under a nitrogen atmosphere to prepare a transparent and uniform polyol component A liquid.

[0257] 61.25 parts by mass of the above liquid A and 38.8 parts by mass of the above liquid B were mixed and stirred at room temperature until they became transparent and uniform, thereby preparing a resin composition.

Embodiment 2

[0259] 4.5 parts by mass of polyol (A2) was added to 54.6 parts by mass of isocyanate (B3), and it was made to react at 80 degreeC for 6 hours in nitrogen atmosphere, and the prepolymer which remained isocyanate group was prepared. 0.05 parts by mass of zinc stearate (C1) was added to the prepolymer of this remaining isocyanate group to prepare an isocyanate component B liquid.

[0260] Separately, 0.1 part by mass of antioxidant (D1) was added to 40.9 parts by mass of polyol (A1), and heated and stirred at 80° C. for 1 hour under a nitrogen atmosphere to prepare a transparent and uniform polyol component A liquid.

[0261] 41 parts by mass of the above liquid A and 59.2 parts by mass of the above liquid B were mixed and stirred at room temperature until they became transparent and uniform, thereby preparing a resin composition.

Embodiment 3

[0263] 8.1 parts by mass of polyol (A2) was added to 18.1 parts by mass of polyol (A1), followed by heating and stirring to prepare a polyol component A liquid.

[0264] 1.5 parts by mass of polyol (A2) and 15.2 parts by mass of isocyanate (B1) were mixed, heated and stirred at 100° C. for 3 hours in a nitrogen atmosphere, and a prepolymer in which isocyanate groups remained was prepared. After mixing 16.7 parts by mass of the prepolymer with remaining isocyanate groups, 15.9 parts by mass of isocyanate (B4), 41.2 parts by mass of isocyanate (B5), and 0.1 part by mass of antioxidant (D1), butyl acetate was distilled off to obtain a uniform resin solution.

[0265] 0.05 mass part of zinc stearate (C1) was added as a catalyst to this resin solution, it heated and stirred, and the isocyanate component B liquid was prepared.

[0266] The above liquid A and the above liquid B were mixed and stirred at room temperature until they became transparent and homogeneous, thereby preparin...

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Abstract

Provided is a urethane resin composition obtained by a method comprising: a step for melting and mixing isocyanate (B), antioxidant (C), release agent (D), and dispersant (E) to obtain a molten mixture; and a step for mixing the molten mixture and a polyol (A). The release agent (D) is a compound represented by general formula (1); R1- COOH, the dispersant (E) is a compound represented by general formula (2) having a weight-average molecular weight Mw of 16,000 or less; and the dispersant (E) content of the urethane resin composition is between 0.1 and 5.0 mass%.

Description

technical field [0001] The present invention relates to a polyurethane resin composition, a cured body, and an optical semiconductor device using the cured body. Background technique [0002] Polyurethane resins are widely used in industrial fields and daily life fields due to their excellent mechanical properties such as toughness and strength. Among them, polyurethane resins using aliphatic isocyanate and alicyclic isocyanate have high transparency up to the near-ultraviolet region and are excellent in coloring resistance, so they are used in coating applications and optical applications requiring weather resistance. [0003] As a molding method of a cured body of polyurethane resin, there is known a casting molding method in which a solution containing an isocyanate and a solution containing a polyol are mixed and poured into a mold for thermal curing, and then taken out from the mold after cooling; Casting while pressurizing the mixed solution and curing it in a short p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/22C08G18/65H01L23/29H01L23/31H01L33/56C08K5/09C08L75/04
CPCC08G2120/00H01L33/56H01L23/3107C08G18/664C08G18/8022H01L2224/48247C08G18/3876C08G18/4277C08G18/758C08G18/792H01L2224/48091H01L2224/73265C08G18/289H01L23/293H01L2924/00014C08G18/22C08K5/09C08L75/04H01L23/29
Inventor 富山健男铃木健司水谷真人田中祥子吉田明弘小林真悟小谷勇人福田典宏多田勋生
Owner RESONAC CORPORATION
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