CPU (Central processing unit) water-cooled radiator and application method thereof

A water-cooled radiator and radiator technology, applied in instruments, electrical digital data processing, digital data processing components and other directions, can solve the problems of large heat generation and large noise of air-cooled radiators, and achieve small temperature gradient and working noise. Small, compact effect

Inactive Publication Date: 2012-07-11
NANJING CANATAL DATA CENT ENVIRONMENTAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] Purpose of the invention: In view of the above-mentioned existing problems and deficiencies, the purpose of the present invention is to provide a CPU water-cooled radiator and its application method, thereby solving the problems of high heat generation and high noise of the air-cooled radiator when the CPU is working

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  • CPU (Central processing unit) water-cooled radiator and application method thereof
  • CPU (Central processing unit) water-cooled radiator and application method thereof
  • CPU (Central processing unit) water-cooled radiator and application method thereof

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Embodiment Construction

[0021] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0022] Such as figure 1 As shown, a CPU water-cooled radiator includes a radiator body 1, a gasket 2 and an upper cover 3. The radiator body 1 is a copper cavity, and the rectangular inner cavity of the radiator is provided with two staggered A semi-closed baffle plate makes the inner cavity form a "Z"-shaped water channel 4, and at the same time, a plurality of spoiler columns 5 are uniformly arranged in an equilateral triangle in the water channel 4, and the spoiler co...

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Abstract

The invention discloses a CPU (central processing unit) water-cooled radiator which comprises a radiator body, a sealing gasket and an upper cover, wherein the radiator body is a metal cavity in which a water channel is arranged, multiple pin fins are uniformly arranged on the water channel, and the pin fins are cylindrical objects integrated with the radiator body; and the edge of the inner cavity of the radiator body is provided with a groove for placing of the sealing gasket, the upper cover is pressed on the sealing gasket and hermetically connected with the radiator body, and the two ends of the water channel are respectively provided with a water inlet pipe and a water outlet pipe. The CPU water-cooled radiator disclosed by the invention has an extremely-high heat absorption efficiency and small noises; and the CPU water-cooled radiator is compact in structure, and effectively solves the problem of high heat density of a cabinet, and therefore, the CPU water-cooled radiator facilitates the creation of a green computer room.

Description

[0001] technical field [0002] The invention belongs to the field of radiators for electronic components, in particular to a CPU chip water-cooled radiator and an application method thereof. Background technique [0003] The development of computer technology can be described by leaps and bounds. Since Intel Corporation launched the world's first microprocessor (CPU) in 1971, the integration level of CPU has been continuously improved. At present, a single CPU has integrated nearly 1 billion transistors. In addition, more and more advanced packaging technology also doubles the heat generated by the CPU. At present, the power consumption of the chip has reached 177W. In order to popularize and apply this kind of high-frequency CPU in a large area and develop a CPU with a higher main frequency, it is necessary to solve the heat dissipation problem of the CPU. [0004] Heat dissipation is one of the most important factors affecting CPU reliability. Generally, the operating t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 孙明迪李鹏飞何进仁
Owner NANJING CANATAL DATA CENT ENVIRONMENTAL TECH CO LTD
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