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Winding belt

A technology of tape and tape, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as drop, damage to the structure and function of semiconductor packaging, and inability to use

Inactive Publication Date: 2012-07-11
POWERTECH TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the solder balls may still be damaged or dropped by colliding with the tape and reel body during transportation, thereby causing the function of the entire ball grid array semiconductor package structure to be damaged and unusable

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0036] Figure 1A A schematic top view of a tape according to an embodiment of the present invention is drawn, and Figure 1B draw out Figure 1A A schematic cross-sectional view of the tape in A-A line. in addition, Figure 1C then draw Figure 1B A schematic cross-sectional view of a reel used to carry a semiconductor package structure. Please refer to Figure 1A and Figure 1B As shown, the reel 100a has at least one containing space (containing space) 102, and each containing space 102 can accommodate one shown in Figure 1C The semiconductor package structure 200 in. Such as Figure 1C As shown, in this embodiment, the semiconductor package structure 200 is, for example, a ball grid array semiconductor package structure, which has a bottom surface 210, a side surface 220 surrounding the bottom surface 210, and a plurality of solder balls 230 arranged in an array on the bottom surface 220. composed of a ball grid array. However, in other unillustrated embodiments, m...

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PUM

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Abstract

The invention relates to a winding belt, which is used for supporting at least a semiconductor packaging structure and comprises a belt body, a support board and a lateral wall. The belt body is provided with at least one opening. The support board is used for supporting the semiconductor packaging structure and is provided with a plurality of containing portions. The lateral wall surrounds the support board and is connected between the belt body and the support board. When the semiconductor packaging structure penetrates through an opening to be supported on the support board, the lateral face of the semiconductor packaging structure abuts against the lateral wall, and a plurality of welding balls configured on the bottom face of the semiconductor packaging structure are contained in the containing portion. Therefore, the welding balls can be protected from being contacted with the support board and damaged.

Description

technical field [0001] The present invention relates to a tape, and more particularly to a tape for carrying a semiconductor package structure. Background technique [0002] With the development of technology, the width and pitch of wires in integrated circuits (ICs) are shrinking day by day to meet the ever-increasing computing requirements of electronic devices. Moreover, in order to cope with the ever-increasing high integration in integrated circuits, a ball grid array (BGA) semiconductor packaging structure has been developed. [0003] For the ball grid array semiconductor package structure, the solder balls arranged in an array on the bottom of the semiconductor package structure are very easy to be damaged or dropped due to collision during transportation. In this way, the function of the entire ball grid array semiconductor package structure may be damaged and cannot be used. Therefore, before the BGA semiconductor package structure is shipped, it is usually proper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 詹焜智郭建玄邓木森
Owner POWERTECH TECHNOLOGY