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Method for manufacturing light-emitting element array

A technology for light-emitting elements and arrays, which is applied to electrical components, electrical solid-state devices, semiconductor devices, etc., and can solve problems such as increasing costs, increasing electrical connection lines, and disconnecting electrical connections.

Active Publication Date: 2012-07-11
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the influence of the size of the trench, for example, the depth of the trench is too deep, when the electrical connection line is formed on the side wall of the trench, there will be disconnection or poor electrical connection.
The known solution is to increase the thickness of the electrical connection line to fill the trench or completely cover the sidewall of the trench to achieve good electrical connection; but increasing the thickness of the electrical connection line also increases the production cost

Method used

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  • Method for manufacturing light-emitting element array
  • Method for manufacturing light-emitting element array
  • Method for manufacturing light-emitting element array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Such as figure 1 As shown, a wafer of light-emitting diodes 1 is provided, including a substrate 10 ; a light-emitting stack 12 is formed on the substrate 10 , wherein the light-emitting stack 12 at least includes a first semiconductor layer 122 , an active layer 124 and a second semiconductor layer 126 . Removing part of the light-emitting stack 12 to form a trench 14, wherein the trench 14 exposes part of the substrate 10, and separates the light-emitting stack 12 into a first light-emitting element 11 and a second light-emitting element 13. The removal method includes but is not limited to etch. Removing part of the second semiconductor layer 126 and light emitting layer 124 of the first light-emitting element 11 and the second light-emitting element 13 to expose part of the first semiconductor layer 122, wherein the removal method includes but not limited to inductively coupled plasma etching (Inductively Coupled Plasma; ICP). At this time, the upper surfaces of t...

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PUM

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Abstract

The invention discloses a method for manufacturing a light-emitting element array. The method comprises the steps of: providing a substrate; forming a light-emitting laminate on the substrate, wherein the light-emitting laminate comprises a first semiconductor layer located on the substrate, a light-emitting layer located on the first semiconductor layer and a second semiconductor layer located on the light-emitting layer; forming at least one channel on the substrate, and dividing the light-emitting laminate into at least one first light-emitting element and one second light-emitting element, wherein the channel exposes part of the substrate; and forming an insulation layer on the light-emitting laminate and the channel, wherein the width of the channel is not more than the doubled width of the insulation layer.

Description

[0001] This application is a divisional application of the invention patent application with the application number 200810169439.1 and the invention title "Method for Manufacturing Light-Emitting Element Array". technical field [0002] The invention relates to a method for manufacturing a light-emitting element array, in particular to a light-emitting element array with grooves closed by an insulating layer. Background technique [0003] A light emitting diode (Light Emitting Diode; LED) is a solid-state physical semiconductor element, and a light emitting diode array (LED Array) has a plurality of LEDs, which can be properly connected in series or in parallel as required. Before connecting in series or in parallel, it is necessary to form a groove to separate each LED, then form an insulating layer between the groove and the LED to electrically insulate each LED, and then form an electrical connection line on the insulating layer and electrically connect each LED. electrod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L27/15
Inventor 刘宗宪陈昭兴郭政达
Owner EPISTAR CORP