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Method for manufacturing three-dimensional embossment

A technology of three-dimensional relief and embossment, which is applied in the field of making three-dimensional relief, can solve the problems of inflexible concept design and production operation, inconvenient handling of relief, and large space occupation, so as to achieve flexible and convenient design and production of relief, strong three-dimensional effect, and occupying a large area. The effect of small space

Inactive Publication Date: 2012-07-18
赵历宪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method can only be carried out for the overall relief at the position of the material, and the concept design and production operation are not flexible, and when the relief to be made is large, the floor space is large, and the relief is not easy to carry. It is very inconvenient when the completed relief needs to be placed in other positions

Method used

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  • Method for manufacturing three-dimensional embossment
  • Method for manufacturing three-dimensional embossment

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Embodiment Construction

[0017] Such as figure 1 As shown, in one embodiment of the present invention, a method for making a three-dimensional relief includes step 10, step 20 and step 30.

[0018] Step 10: Make a model of the relief element;

[0019] A relief can be composed of multiple identical or different elements, such as various animals, plants, figures, mountains, water and so on. Of course, it can also be various other content elements that make up the relief. Herein, the various content elements constituting the relief are collectively referred to as relief elements. For a relief, the relief elements can be flexibly divided according to the actual situation or the convenience of production.

[0020] In the embodiment of the present invention, firstly, a model of the relief elements constituting the relief is made. Models of these relief elements can be made of the same material, such as resin, etc.

[0021] Step 20: Bonding the model to the substrate to obtain the initial relief;

[00...

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PUM

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Abstract

The invention discloses a method for manufacturing a three-dimensional embossment. The method comprises the following steps of: manufacturing embossment element models for forming the embossment; sticking the models to a substrate to obtain an original embossment; and carrying out after-treatment on the original embossment to obtain the three-dimensional embossment. In the embodiment of the invention, the embossment element models are manufactured at first and then are stuck on the substrate to form the finished embossment through the after-treatment. The conceived, designed and manufactured embossment is more flexible and convenient, has a small occupied space and is very convenient to transport. Furthermore, each embossment element of the embossment can be entirely three-dimensional and has strong three-dimensional effects.

Description

technical field [0001] The invention relates to a method for making three-dimensional relief. Background technique [0002] The commonly used method of making reliefs is to directly sculpt on the material with tools. But this method can only be carried out for the overall relief at the position of the material, and the concept design and production operation are not flexible, and when the relief to be made is large, the floor space is large, and the relief is not easy to carry. It is very inconvenient when the completed relief needs to be placed in other positions. Contents of the invention [0003] The embodiment of the invention discloses a method for making three-dimensional reliefs which is flexible and convenient in design and convenient in transportation. [0004] The technical solutions disclosed in the embodiments of the present invention include: [0005] A method for making a three-dimensional relief is provided, which is characterized in that it comprises: ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B44C3/06
Inventor 赵历宪
Owner 赵历宪
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