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32results about How to "Will not cause misalignment" patented technology

Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package

The invention discloses a semiconductor package body realizing internal connection by connecting sheets. The semiconductor package body comprises a plurality of chips, a plurality of substrates, the connecting sheets and a plastic package body, wherein each chip has a plurality of top contact areas and a plurality of bottom contact areas; the substrates are used for accommodating the chips; the bottom contact areas of the chips are electrically connected with the substrates; the substrates are provided with a plurality of substrate outer pins; the connecting sheets are connected with the plurality of chips and the plurality of correspondingly distributed top contact areas of the plurality of chips so as to fix the plurality of chips; the ends of the connecting sheets are used as pins of the chips and connected with the exterior; and the plastic package body is used for packaging the chips, the substrates and the connecting sheets. In the process, one or more connecting sheets are fixedly connected with the plurality of chips and then packaged; and the connecting sheets are separated by cutting or grinding the top of the package finally. Due to the fixed connection of the connecting sheets, the influence of the dislocation of the chips on the circuit performance of the chips during manufacturing can be avoided.
Owner:重庆万国半导体科技有限公司

Locating hole structure of soft and hard multilayer circuit board and setting method of locating hole

The invention discloses a locating hole structure of a soft and hard multilayer circuit board of a circuit via hole and a setting method of a locating hole. The locating hole structure is small in positional deviation and high in precision and is punched by a common target punching machine. A top layer window hole with the hole diameter being larger than that of the locating hole is formed in a top layer plate which is arranged at the position of a to-be-drilled locating hole in the multilayer circuit board, an exposed light transmitting target ring with the hole diameter being smaller than that of the locating hole is arranged on a soft plate which is surrounded by the top layer window hole, a lightproof target is arranged at the center of the light transmitting target ring, and a bottom layer window hole with the hole diameter being smaller than that of the locating hole and capable of enabling the light transmitting target ring to be exposed is formed in a bottom layer plate corresponding to the light transmitting target ring. A soft and hard combined plate of the structure is placed on the common target punching machine, and after the target is recognized, the locating hole is subjected to target punching. The soft plate which can be seen from the top layer window hole in a downward mode is completely supported on the bottom layer plate, the rigidity of the hole peripheral wall of the locating hole can be greatly improved, and when a dowel of the target punching machine is inserted into the locating hole, the locating hole cannot be deformed or enlarged or cannot deviate.
Owner:SHENZHEN HUALIN CIRCUIT TECH

A method for semiconductor packaging by utilizing connection pieces to realize connection

The invention discloses a semiconductor package body in which inner connection is realized through connection pieces. The semiconductor package body comprises a plurality of chips, wherein each chip is provided with a plurality of top contact areas and bottom contact areas; a plurality of substrates which are used for placing the chips, the bottom contact areas of the chips being in electrical connection with the substrates, and the substrates being provided with a plurality of substrate outer pins; connection pieces, wherein the connection pieces are connected with the plurality of chips and are used for connecting with the plurality of top contact areas arranged corresponding to the plurality of chips, thereby fixing the plurality of chips, the end portions of the connection pieces being as the pins of the chips so as to connect with external circuits; and a plastic package body which is used for packaging the chips, the substrates and the connection pieces. During the production process of the semiconductor package body, the plurality of chips are fixedly connected by utilizing one or the plurality of connection pieces; then packaging is carried out; and at last, the connection pieces are separated through cutting or package body top grinding. Since the fixation connection effect of the connection pieces, the influence, due to malposition of the chips in the production process, on the circuit performance is prevented.
Owner:ALPHA & OMEGA SEMICON INT LP

A flip-type electronic chip detection fixture

The invention relates to the technical field of electronic detection equipment and particularly relates to a turnover type electronic chip detection jig. The turnover type electronic chip detection jig is characterized in that a chip containing cavity for detecting an electronic chip is formed in a jig bottom plate and a turnover pressing plate is arranged above the containing cavity; the bottom end of a rotary pressing device on the turnover pressing plate is connected with a chip pressing block pressing to the electronic chip; when the detection jig is used, the electronic chip is placed into the chip containing cavity and the chip containing cavity has the pipe position effect on the electronic chip, so as to not cause a dislocation phenomenon; the turnover pressing plate hinged with the jig bottom plate covers the electronic chip and is buckled on the jig bottom plate through a pulling buckle; and then the rotary pressing device flatly presses the chip pressing block to the electronic chip, the upper end of the electronic chip is uniformly stressed, and an electronic chip detection part is sufficiently contacted with a detection probe, so that the detection result is accurate and reliable. The detection jig disclosed by the invention also has the advantages of simplicity in operation, convenience for use and long service life.
Owner:东莞光韵达光电科技有限公司

An adjustable mobile cotton yarn support

The invention belongs to the technical field of cotton yarn processing, in particular to an adjustable moving cotton yarn supporting frame, and aims at solving the problems of poor adjusting effect onthe supporting frame and inaccurate adjusting process. The supporting frame is characterized in that a roller frame and an adjusting disc are included, reinforcing ribs are welded to the outer wall of one side of the roller frame, rollers are inserted into the outer walls of the reinforcing ribs, the outer walls of the other ends of the rollers are clamped in the inner wall of the adjusting disc,a through hole is formed in the central line of the inner wall of the roller frame, a moving frame is connected with the inner wall of the through hole through a bearing, a rotary wheel disc group isarranged on the central line of the outer wall of the moving frame, and a shaft hole is formed in the central axis of the inner wall of the adjusting disc. The supporting frame has the advantages that rollers are clamped and fixed, the rollers are not deflected in the rotary winding process and more stable when tensioning adjusting or parallel moving adjusting are conducted, the displacement between the axial center and the roller body are not caused, and the adjusting is achieved at the two ends through tensioning adjusting and parallel moving adjusting.
Owner:安徽英贯豪纺织有限公司

Novel combined trimming machine tool

The invention discloses a novel combined trimming machine tool which structurally comprises an emergency stop system, a spindle, a fixing seat, a tool rest, a variable-speed hand wheel, a tailstock, lead screw fixing seats, lead screws, a lathe, a hand wheel, a slide carriage tank, a second hand wheel and a small slide carriage. The emergency stop system is mechanically connected with the spindleand is mounted at one end of the lathe, the tailstock is mounted at the other end of the lathe, and the tool rest is perpendicularly fixed onto the tailstock and is mechanically connected with the variable-speed hand wheel. The novel combined trimming machine tool has the advantages that the novel combined trimming machine tool is provided with pulley limit mechanisms, movable touch mechanisms, auxiliary support devices, a power-off structure and a power supply circuit system, handles can rotate if the spindle falls off after rotating for excessively long time, accordingly, a motor can immediately stop rotating, objects fixed onto the motor can be prevented from being separated from the motor to injure staffs due to rotational inertia of the motor, and the safety of the staffs can be guaranteed; the problems of breakdown and difficulty in maintenance of existing emergency stop systems due to dislocation of internal structures when existing motors at the high speeds stop can be assuredly solved by the aid of the pulley limit mechanisms.
Owner:江苏伟同如自动化设备有限公司

A rotary buckle type electronic chip detection fixture

The invention relates to the technical field of electronic testing equipment, in particular to a rotating and buckling type electronic chip detection jig. A chip accommodating cavity for testing an electronic chip is disposed on a jig bottom plate. A rotating and buckling pressing plate is disposed on the chip accommodating cavity. A rotating and pressing device is arranged on the rotating and buckling pressing plate. The bottom end of the rotating and pressing device is connected with a chip pressing block for pressing the electronic chip. When the detection jig is in use, the electronic chip is placed in the chip accommodating cavity. The chip accommodating cavity plays a positioning role for the electronic chip so as to avoid malposition. The rotating and buckling pressing plate is disposed on the jig bottom plate through a rotating and buckling device in rotating and buckling mode, and then the rotating and pressing device is rotated so as to enable the chip pressing block to smoothly press towards the electronic chip. Consequently, the upper end of the electronic chip is stressed uniformly, a detected portion of the electronic chip fully contacts with a detection probe, and detection results are accurate and reliable. In addition, the rotating and buckling type electronic chip detection jig has the advantages of being simple in structure, convenient to use and long in service life.
Owner:东莞光韵达光电科技有限公司

Semiconductor package connected by tabs

The invention discloses a semiconductor package for internal connection with connecting sheets, comprising: a plurality of chips, each of which has a plurality of top contact areas and bottom contact areas; a plurality of substrates for placing the The chip, the bottom contact area of ​​the chip is electrically connected to the substrate, and the substrate is provided with a plurality of external pins of the substrate; the connecting piece, the connecting piece is connected to a plurality of chips, and is used to connect a plurality of chips correspondingly arranged a plurality of top contact areas, thereby fixing the plurality of chips, and the ends of the connecting sheets are connected to the outside as the pins of the chips; a plastic package is used for packaging chips, substrates, and connecting sheets. The present invention In the process of manufacturing, multiple chips are fixedly connected through one or more connecting pieces, then packaged, and finally the connecting pieces are separated by cutting or grinding on the top of the package. Due to the fixed connection function of the connecting pieces, the present invention avoids the need for chips to be processed in the process. Misalignment during the process affects the circuit performance of the chip.
Owner:ALPHA & OMEGA SEMICON INT LP

Vacuum glass integral support article preparation device

The invention discloses a vacuum glass integral support article preparation device. The vacuum glass integral support article preparation device is used for preparing and forming a plurality of support articles on a side of a glass plate and comprises two roll shafts and a transport mechanism. The two roll shafts are used for being matched with each other to roll the glass plate, the transport mechanism is used for horizontally feeding the glass plate into spaces between the two roll shafts, the two roll shafts are horizontally arranged and are aligned with each other along the vertical directions, the lower roll shaft is provided with smooth cylindrical roll surfaces and is used for rolling planes at the bottom of the glass plate, a plurality of forming grooves which are matched with thesupport articles are formed in cylindrical roll surfaces of the upper roll shaft, the upper roll shaft is used for rolling planes on the top of the glass plate and forming the multiple support articles on the planes, the two roll shafts are mounted on two pairs of bearing blocks, the same pair of bearing block is positioned on two sides of the glass plate, every two corresponding bearing blocks positioned on the same side of the glass plate are mounted in the same support frame, an adjusting mechanism for adjusting the distance of the two corresponding bearing blocks along the vertical directions is mounted on each support frame, and the two adjusting mechanisms are matched with each other, so that the distance of the two roll shafts along the vertical directions can be adjusted.
Owner:HENAN UNIV OF SCI & TECH

Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package

The invention discloses a semiconductor package body realizing internal connection by connecting sheets. The semiconductor package body comprises a plurality of chips, a plurality of substrates, the connecting sheets and a plastic package body, wherein each chip has a plurality of top contact areas and a plurality of bottom contact areas; the substrates are used for accommodating the chips; the bottom contact areas of the chips are electrically connected with the substrates; the substrates are provided with a plurality of substrate outer pins; the connecting sheets are connected with the plurality of chips and the plurality of correspondingly distributed top contact areas of the plurality of chips so as to fix the plurality of chips; the ends of the connecting sheets are used as pins of the chips and connected with the exterior; and the plastic package body is used for packaging the chips, the substrates and the connecting sheets. In the process, one or more connecting sheets are fixedly connected with the plurality of chips and then packaged; and the connecting sheets are separated by cutting or grinding the top of the package finally. Due to the fixed connection of the connecting sheets, the influence of the dislocation of the chips on the circuit performance of the chips during manufacturing can be avoided.
Owner:重庆万国半导体科技有限公司

Method of semiconductor package realizing connection by bonding tab

The invention discloses a semiconductor package for internal connection with connecting sheets, comprising: a plurality of chips, each of which has a plurality of top contact areas and bottom contact areas; a plurality of substrates for placing the The chip, the bottom contact area of ​​the chip is electrically connected to the substrate, and the substrate is provided with a plurality of external pins of the substrate; the connecting piece, the connecting piece is connected to a plurality of chips, and is used to connect a plurality of chips correspondingly arranged a plurality of top contact areas, thereby fixing the plurality of chips, and the ends of the connecting sheets are connected to the outside as the pins of the chips; a plastic package is used for packaging chips, substrates, and connecting sheets. The present invention In the process of manufacturing, multiple chips are fixedly connected through one or more connecting pieces, then packaged, and finally the connecting pieces are separated by cutting or grinding on the top of the package. Due to the fixed connection function of the connecting pieces, the present invention avoids the need for chips to be processed in the process. Misalignment during the process affects the circuit performance of the chip.
Owner:ALPHA & OMEGA SEMICON INT LP

Cloth bag frame with dust collecting bag capable of being popped automatically

The invention relates to a cloth bag frame with a dust collecting bag capable of being popped automatically, which comprises a shell, a sliding button, a supporting lock, a plug board frame, a plug board, a rotating board and a torsion spring, wherein the shell comprises a panel, side surrounding boards, a front surrounding board, a handle and a bracket arranged at the upper edge of a notch at the inner side of the front surrounding board; the sliding button is connected with the upper surface of the back part of the shell; the supporting lock is connected with the lower surface of the back part of the shell and is internally provided with a compression spring; the plug board frame is arranged in a central mounting hole of the shell; the plug board is inserted into the plug board frame and is provided with a cloth bag; the rotating board is connected with the front part of the inner side of the shell; and the torsion spring is connected with the rotating board. A connection board which is connected with the left side surrounding board and the right side surrounding board is arranged behind the mounting hole in the middle of the shell; two long through holes are formed in the middle of the connection board; a shifting sheet which protrudes downward is arranged at the inner side surface of the shell below the connection board; each of the two sides of the bracket at the inner side of the shell is provided with a supporting axle hole; and each of the two sides at the inner side of the front part of the shell is provided with an axle hole. The invention has the advantages that when the dust collecting bag is taken out, the plug board does not need to be extracted manually, the dust collecting bag can be popped automatically from the cloth bag frame, thus the dust leakage is avoided, and hands can not be dirtied.
Owner:LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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