Method and device for profile forming of packaging substrate

A packaging substrate and shape technology, which is applied in the field of packaging substrate shape forming methods and devices, can solve problems such as weak force, deviation of a single packaging substrate, and the size of a single packaging substrate cannot meet the requirements, and achieve the effect of improving the yield rate

Active Publication Date: 2014-03-26
深圳广芯封装基板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since a single package substrate is generally small in size, it cannot be positioned independently, and the board is thin and soft. If you only rely on the peripheral four-corner positioning holes of the backing plate to locate the package substrate to be processed, when the machine is milling the board, the peripheral four-corner positioning holes are right for the single The force of each package substrate is very weak, and the cutting force of the machine will act on a single package substrate, which will easily cause the deviation of a single package substrate, so that the size of the milled single package substrate cannot meet the requirements

Method used

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  • Method and device for profile forming of packaging substrate
  • Method and device for profile forming of packaging substrate
  • Method and device for profile forming of packaging substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Such as figure 1 As shown, a packaging substrate shape forming method, including:

[0028] 101. Fix the packaging substrate between the backing board and the tool board, the packaging substrate is composed of several single packaging substrates connected.

[0029] Specifically, such as figure 2 As shown, positioning holes can be set at the four corners of the backing plate 201, the package substrate 202, and the tool plate 203, and these three boards are stacked on the milling table from bottom to top, and fixed with pins 204, that is, the package substrate passes through the positioning The pin is fixed between the backing plate and the tool plate.

[0030] Preferably, the tool plate 203 is a hard tool plate used for milling. The hard tool board is conducive to pressing the package substrate when milling the edge groove, and can make the force of the milling cutter retract on the tool board.

[0031] Of course, the size of the tool plate 203 is the same as that of...

Embodiment 2

[0035] Such as image 3 As shown, a packaging substrate shape forming method, including:

[0036] 301. Fix the packaging substrate between the backing board and the tool board, the packaging substrate is composed of several single packaging substrates connected.

[0037] Specifically, the package substrate can be fixed between the backing plate and the tool plate through positioning pins, the tool plate is a hard tool plate used for milling, and the size of the tool plate is the same as that of the package substrate.

[0038] This is the same as step 101 in Embodiment 1, and will not be repeated here.

[0039] 302. Mill the wide side groove of the single package substrate according to the line where the single package substrate is located.

[0040] Specifically, after the package substrate is fixed between the backing plate and the tool plate, the milling wide-side slot program in the machine is called, and the wide-side slot is milled according to the line where the single ...

Embodiment 3

[0052] The present invention also provides a corresponding packaging substrate shape forming device, which includes: a backing plate, a tool plate and a milling cutter. An encapsulation substrate is fixed between the backing plate and the tool plate, and the encapsulation substrate is composed of several single encapsulation substrates connected together. The milling cutter is arranged above the tool board, and is used for milling grooves on the packaging substrate fixed between the backing board and the tool board, so as to obtain a shape-shaped single packaging substrate.

[0053] Since the package substrate is fixed between the backing plate and the tool plate, when milling the wide and long sides of a single package substrate, the force of the milling cutter will not cause the deviation of the single package substrate, so that a satisfactory shape can be obtained. A single package substrate with size requirements. The milling cutter here can be installed on the milling ma...

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Abstract

The invention discloses a method for profile forming of a packaging substrate. The method includes: fixing the packaging substrate between a base plate and a tool plate, wherein the packaging substrate is formed by a plurality of packaging substrate bodies in connecting mode; and conducting edge-slot milling for each packaging substrate body after the packaging substrate is fixed so as to obtain packaging substrate bodies with formed profiles. The invention further provides a corresponding device. The packaging substrate is fixed vertically and cutter retracting acting force of a milling cutter is acted on the tool plate during edge-slot milling, so that deviation of the packaging substrate bodies caused by the cutter retracting acting force is avoided, and accordingly the packaging substrate bodies meeting profile size requirements are obtained.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a method and device for shaping the shape of a packaging substrate. Background technique [0002] With the continuous development of electronic product production technology, the requirements for packaging substrates are also getting higher and higher. At present, there is a requirement for packaging substrates to be assembled in a single form. The existing method of processing the shape of a single substrate for this requirement is mainly to arrange the substrates to be processed with a number of single packaging substrates arranged on the backing plate. Rely on the positioning holes at the four corners of the backing plate for positioning, and then cut out a single package substrate with a milling cutter. However, since a single package substrate is generally small in size, it cannot be positioned independently, and the board is thin and soft. If you only rely on the peripher...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23C3/28B23Q3/00H01L21/48
Inventor 杨家雄高成志魏松
Owner 深圳广芯封装基板有限公司
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