Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board

A flexible circuit board and flexible circuit technology, which is applied in the electronic field, can solve the problems of tearing glue, losing the protective effect of glue, and not tight pasting, etc., to achieve the effect of protecting golden fingers and tearing glue conveniently and quickly

Active Publication Date: 2012-07-18
KUSN YIFUDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The usual method is to apply glue on the surface of the gold fingers for protection, but it is very troublesome to remove the glue, especially for flexible circuit boards with hollow gold fingers. Strong, when the glue is torn off, the gold finger line is easily stuck by the stickiness of the glue, pulled and deformed, or even broken; if the stickiness of the glue is weak, the sticking will not be tight, and the protective effect of the glue will be lost

Method used

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  • Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board
  • Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board
  • Adhesive adhering structure and adhesive adhering method for hollowed-out goldfinger of flexible circuit board

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0020] Such as figure 1 As shown, there is a hollow area 22 between the terminals 21 in the gold finger area 2 on the flexible circuit board 1 , and such hollow gold fingers are more likely to be pulled and deformed. Therefore, if figure 2 , image 3 As shown, the gluing method of this technical solution is to firstly cover the gold finger area 2 with a cushion layer 3 , the cushion layer 3 is an ordinary partition without glue, which can completely cover the gold finger area 2 . An adhesive layer 4 is pasted on the cushion layer 3 , the area of ​​the adhesive layer 4 is larger than that of the cushion layer 3 , and the cushion layer 3 can be covered entirely under it, and pasted on the flex...

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Abstract

The invention discloses an adhesive adhering structure and an adhesive adhering method for a hollowed-out goldfinger of a flexible circuit board. Hollowed-out areas are formed among all terminal in a goldfinger area, and a cushion layer covers on the entire goldfinger area; and an adhesive layer covers the goldfinger area by being spaced by the cushion layer and is adhered onto the flexible circuit board or a part on which the adhesive layer can be adhered. According to the adhesive adhering structure and the adhesive adhering method for the hollowed-out goldfinger of the flexible circuit board, disclosed by the invention, adhesive adhering and adhesive stripping are more convenient and quicker and are free from the limitation from adhesiveness, the goldfinger cannot be pulled through stripping when the adhesiveness is high, a chemical liquid cannot permeate to influence an adherence part when the adhesiveness is low, and thus, the goldfinger is protected effectively.

Description

technical field [0001] The invention relates to a flexible circuit board hollow gold finger glue sticking structure and a glue sticking method, belonging to the field of electronic technology. Background technique [0002] The gold finger on the flexible circuit board is mainly used as the outlet of the external connection of the circuit board. The gold with superior conductivity and oxidation resistance is used for partial electroplating or chemical immersion gold on the gold finger. Very important. In order not to affect the properties of the gold fingers, the gold fingers must be protected during some process steps. The usual method is to apply glue on the surface of the gold fingers for protection, but it is very troublesome to remove the glue, especially for flexible circuit boards with hollow gold fingers. Strong, when the glue is torn off, the gold finger thread is easily stuck by the stickiness of the glue, pulled and deformed, or even broken; if the stickiness of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/00
Inventor 杨术钊陆申林袁井刚李稳刘燕华
Owner KUSN YIFUDA ELECTRONICS
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