Metamorphic substrate system, method of manufacture of same, and iii-nitrides semiconductor device
A nitride semiconductor, substrate technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as poor crystallinity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0060] It now follows how to prepare a modified substrate system highly suitable for growing high-efficiency III-nitride LED devices with reduced threading dislocations.
[0061] First, the sapphire (Al 2 o 3 ) The support substrate 1 was inserted into the MOVPE reactor and thermally cleaned under flowing hydrogen. The MOVPE reactor was equipped with the following gas sources: hydrogen, nitrogen, oxygen, ammonia, and silane; and the following liquid precursor sources: trimethylgallium (TMG), trimethylindium (TMI), trimethylaluminum (TMA), and Bis(cyclopentadienyl)magnesium (Cp2Mg). After thermal cleaning the support substrate is cooled to a temperature suitable for the growth of the metamorphic transition zone, temperatures in the range of 200 to 900°C are preferred, 500°C is most preferred. The transition zone below 200°C and above 900°C will not be easy to form. Metamorphic transition zone growth can be either Al 2 o 3 Layer 4 or Al x Ga 1-x N layer 5 starts. In the...
Embodiment 2
[0074] Another illustration of how to prepare a modified substrate system highly suitable for growing high efficiency III-nitride LED devices with reduced threading dislocations now follows.
[0075] A silicon (Si) support substrate 1 was first inserted into an MOVPE reactor and thermally cleaned under flowing hydrogen. The MOVPE reactor was equipped with the following gas sources: hydrogen, nitrogen, oxygen, ammonia, and silane; and the following liquid precursor sources: trimethylgallium (TMG), trimethylindium (TMI), trimethylaluminum (TMA), and Bis(cyclopentadienyl)magnesium (Cp2Mg). After thermal cleaning the support substrate is cooled to a temperature suitable for the growth of the metamorphic transition zone, a temperature in the range of 200 to 1000°C is preferred, 900°C is most preferred. Below 200°C, the transition zone will not be easily formed. Metamorphic transition region growth can be Si layer 4 or Al x Ga 1-x N layer 5 starts. In the former case, the Si la...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 