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Z-axis lifting mechanism with stress state balancing function

A technology of stress state and lifting mechanism, which is applied in the direction of mechanical equipment, conveyor objects, belts/chains/gears, etc., can solve the problems of short service life of ball guide rails, large and micro deformation of ball guide rails, complex processing technology of columns, etc., to achieve Strong load capacity, correction of unstable center of gravity, stable center of gravity

Inactive Publication Date: 2014-03-05
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the Z-axis drive lifting mechanism of the existing silicon wafer transfer robot has poor structural stress state, large microscopic deformation of the ball guide rail, short service life of the ball guide rail, complicated column processing technology, and low yield. Low, unstable center of gravity, prone to overturning of the host, difficult to adjust during assembly, provide a Z-axis lifting mechanism that can balance the force state

Method used

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  • Z-axis lifting mechanism with stress state balancing function
  • Z-axis lifting mechanism with stress state balancing function
  • Z-axis lifting mechanism with stress state balancing function

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specific Embodiment approach 1

[0007] Specific implementation mode one: combine Figure 1 to Figure 8 Describe this embodiment, which includes a lower mounting base 1, a Z-axis drive assembly 2, a pretensioner support mechanism 3, a synchronous tooth transmission belt 7, a nut transmission mechanism 8, an upper mounting cover 9, two connecting plates 6 and Three screw drives 4, see image 3 with Figure 4 : Z-axis driving device assembly 2 includes Z-axis motor base 10, encoder positioning tube 12, encoder 14, Z-axis servo motor 15, friction brake 17, synchronous transmission driving gear 19 and connecting plate 20, the Z-axis servo The upper end of the motor 15 shaft is an output shaft 15-1, and the lower end is a motor shaft 15-2, and the Z-axis servo motor 15 is installed in the Z-axis motor seat 10 by a screw 16, and the output shaft 15-1 of the Z-axis servo motor 15- 1 is located outside the Z-axis motor base 10, and the upper end of the output shaft 15-1 is provided with a transmission external toot...

specific Embodiment approach 2

[0008] Specific implementation mode two: combination Image 6 Describe this embodiment, each pretensioner mechanism 38 of this embodiment includes a pretensioner shaft 39, a pretensioner 41, a shaft circlip 42 and two pretensioner bearings 40, the pretensioner 41 A preload wheel bearing 40 is respectively installed at the upper and lower recesses of the inner cavity, the preload wheel 41 is installed on the preload wheel shaft 39, and the shaft circlip 42 is installed on the upper end of the preload wheel shaft 39 exposed on the preload wheel 41 upper end surface. In the groove, the circlip 42 for the shaft is used to fix the relative position of the pretensioner bearing 40 . Other components and connections are the same as those in the first embodiment.

[0009] The working principle of the present invention is: when the Z-axis servo motor 15 was running, the encoder 14 installed on the motor shaft 15-2 at the lower end of the Z-axis servo motor 15 started to work, and fed b...

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Abstract

Disclosed is a Z-axis lifting mechanism capable of balancing a stressed state, which relates to the field of manufacturing semiconductor silicon wafer transport robots, to solve the problems of poor stressed state in structures and ball guide rails having relatively large microscopic deformation in existing Z-axis driven lifting mechanisms. An upper mounting cover is arranged as directly opposed to a lower mounting base; a Z-axis driving device assembly is connected to the lower mounting base; a pre-tensioning wheel support encases the Z-axis driving device assembly; the pre-tensioning wheel support is connected to the lower mounting base; three screw drive mechanisms are uniformly distributed in the same circle between the upper mounting cover and the lower mounting base. A central end of a synchronous toothed drive belt encases a synchrodrive driving gear; three outer side ends of the synchronous toothed drive belt encase three synchrodrive driven gears, respectively. Three ball nuts are connected by threads to the three driving screws. A lower deep groove ball bearing is mounted in a lower bearing mounting hole in the lower mounting base, and an upper deep groove ball bearing is mounted in an upper bearing mounting hole. The present invention is for use on a silicon wafer transport robot.

Description

technical field [0001] The invention relates to the manufacturing field of a semiconductor silicon wafer transmission robot, in particular to a Z-axis transmission lifting mechanism on a silicon wafer transmission robot. Background technique [0002] In the Z-axis transmission lifting mechanism of the silicon wafer transfer robot, the column type Z-axis transmission lifting mechanism is mostly used, that is, the ball guide rail is used as the movement reference of the Z-axis lifting, and the ball guide rail is installed on the reference surface of the column. But there is following shortcoming in this transmission mechanism: the one, the stressed state of structure is bad. The force direction of the column-type Z-axis transmission lifting mechanism is along the motion axis of the ball guide rail, and the best force direction of the guide rail is in the vertical direction to the plane of the ball guide rail; The block is transmitted to the ball guide rail in the form of a ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677F16H37/02F16H25/22
CPCF16H2025/2053F16H25/20F16H37/02F16H25/22F16H2025/2096F16H25/2204
Inventor 刘延杰吴明月荣伟彬孙立宁
Owner HARBIN INST OF TECH
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