Modified resin composition and preparation method and application thereof

A modified resin and composition technology, applied in the field of smart IC cards and three-dimensional circuits, can solve problems not specifically mentioned, and achieve the effect of small minimum spacing and uniform wiring

Inactive Publication Date: 2012-08-22
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It should be mentioned that none of these patents specifically mentioned that the corresponding processes or technologies or products can be applied to film products

Method used

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  • Modified resin composition and preparation method and application thereof
  • Modified resin composition and preparation method and application thereof
  • Modified resin composition and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] According to the material ratio in Table 1, mix resin matrix PA10T, laser sensitive additive copper-manganese type additive (iron oxide doped), other additive toughening agent 1%, and nucleating agent 1% in proportion, and then put it into the main feed The hopper is extruded from the extruder, and the pellets are obtained by air-cooling and pelletizing, and then the film is prepared by extrusion, co-extrusion or lamination.

Embodiment 2

[0052] According to the material ratio in Table 1, mix the resin matrix PA9T, laser sensitive additive copper-manganese type additive, other additives toughening agent 1%, and nucleating agent 1% in proportion, and then put it into the main feeding hopper from the extrusion Extruded in the machine, air-cooled and cut into pellets to obtain pellets, and then prepared into films by extrusion, co-extrusion or lamination.

Embodiment 3

[0054] According to the material ratio in Table 1, mix the resin matrix PA10T+PA610, laser-sensitive additive copper-manganese type additive, other additive toughening agent 1%, and nucleating agent 1% in proportion, and then put it into the main feeding hopper from Extruded in an extruder, air-cooled and cut into pellets to obtain pellets, and then prepared into films by extrusion, co-extrusion or lamination.

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Abstract

The invention discloses a modified resin composition, which includes the following components of, by weight, 35% to 95% of polyamide, 4% to 15% laser sensitive additives and 1% to 60% of other additives, and the added weight of the total content is 100%. The chemical general formula of the laser sensitive additives is XY2O4, and the laser sensitive additives are of isometric crystal system with the axial length a=b=c and the axial angle alpha=beta=gamma=90 degrees; a tetrahedral atom is a metal atom from an IIIA group, an IB group, an IIB group, a VIB group, a VIIB group and a VIII group of periodic table of the elements, wherein the metal atom includes one of chromium, manganese, iron, cobalt, nickel, copper, zinc, palladium and aluminum, preferably one of transition metal chromium, manganese, copper and metal palladium; and an octahedral atom is a metal atom from an IIIA group, an IB group, an IIB group, a VIB group, a VIIB group and a VIII group of periodic table of the elements, wherein the metal atom includes one of chromium, manganese, iron, cobalt, nickel, copper, zinc, palladium and aluminum, preferably one of transition metal chromium, manganese, copper and metal palladium. The modified resin composition has the advantages of being high in processing temperature and small in space among metal wires.

Description

technical field [0001] The invention relates to a modified resin composition, which is mainly used in the fields of smart IC cards and three-dimensional circuits. Background technique [0002] Selectively depositing a metal film on the resin matrix can not only maintain the insulation of the resin matrix, but also make the part have the conductivity of the metal film at the same time. There are two ways to achieve the above purpose: the first solution is to press the metal patch that has been formed into a circuit on the resin matrix to make a part by stamping; the second solution is to first add the laser-sensitive additive Resin is injection molded into parts, and then through laser forming process and electroless electroless plating, the metal in the chemical potion is selectively deposited on the area scanned by the laser to form a circuit metal film with conductive function. [0003] When making a three-dimensional circuit, the bonding force between the metal patch and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08K3/22
Inventor 严峡姜苏俊刘奇祥宁凯军蔡彤旻宁方林
Owner KINGFA SCI & TECH CO LTD
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