Ceramic-based power type light-emitting diode and packaging method thereof
A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of reduced service life of LEDs, detachment of chips from substrates, and low light output, so as to improve the light output rate of LEDs and simplify the packaging process technology, to avoid the effect of cracking
Inactive Publication Date: 2015-04-15
SOUTH CHINA NORMAL UNIVERSITY
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Problems solved by technology
With the extensive promotion and application of LED lamps, it has gradually emerged that there are still many shortcomings in power LED technology: (1) The high operating temperature of the LED chip causes the chip to separate from the substrate. The main reason is that the chip material and the substrate Due to the different thermal expansion coefficients of the materials, the service life of the LED is reduced; (2) the light output of the power type LED is relatively low when the optical lens is at a small angle; (3) the package of the power type LED is complicated, and the main problem is that the chip and the optical lens are high temperature together Curing, affecting chip performance
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[0024] The implementation of the present invention will be further described below in conjunction with the accompanying drawings, but the implementation and protection scope of the present invention are not limited thereto.
[0025] Such as figure 1 , figure 2 , image 3 , a ceramic-based power-type light-emitting diode, which includes an optical lens 1, a copper clad layer 2, a ceramic substrate 3, a negative electrode 4, an adhesive 5, a positive electrode 6, an LED chip 7, a positive electrode bonding wire 8, and a negative electrode bonding wire 9. The copper clad layer 2 is fixed on the ceramic substrate 3, the copper clad layer 2 has a negative electrode 4 and a positive electrode 6, and the copper clad layer 2 does not cover the position on the ceramic substrate 3 for installing the LED chip 7 and the optical lens 1 , the LED chip 7 is stuck on the ceramic substrate 3; the positive pole of the LED chip 7 is connected to the positive electrode 6 through the positive e...
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The invention discloses a ceramic-based power type light-emitting diode and a packaging method thereof. The ceramic-based power type light-emitting diode comprises an optical lens, a copper-covered layer, a ceramic base plate, a negative electrode, bonding glue, a positive electrode, an LED (Light-Emitting Diode) chip, a positive electrode welding wire and a negative electrode welding wire, wherein the optical lens can reflect lights from 0-beta light extracting angles of the LED chip to an effective light extracting angle so as to improve an LED light extracting rate; and the thermal expansion coefficient of the ceramic base plate is close to the thermal expansion coefficient of the LED chip. The LED chip is adhered to the ceramic base plate through the independently-prepared optical lens; the positive electrode welding wire and the negative electrode welding wire are welded and fluorescent powder is coated; and then the optical lens is adhered to the ceramic base plate to form the simplified LED packaging method. According to the ceramic-based power type light-emitting diode and the packaging method thereof, the light extracting rate of the chip is improved; and meanwhile, a phenomenon that the ceramic-based power type light-emitting diode is cracked due to the different expansion coefficients of the chip and the base plate is avoided, and the service life of a power type LED is prolonged.
Description
technical field [0001] The invention relates to the technical field of power-type light-emitting diodes, in particular to a ceramic-based power-type light-emitting diode and a packaging method thereof. Background technique [0002] Semiconductor lighting technology is becoming more and more mature, among which light-emitting diode (LED) lamps and their applications are gradually expanding, and the market demand is also very large. Power LEDs are made of blue LED chips, YAG:Ge phosphors, substrates, etc. to make white LEDs. With the extensive promotion and application of LED lamps, it has gradually emerged that there are still many shortcomings in power LED technology: (1) The high operating temperature of the LED chip causes the chip to separate from the substrate. The main reason is that the chip material and the substrate Due to the different thermal expansion coefficients of the materials, the service life of the LED is reduced; (2) the light output of the power type LED...
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IPC IPC(8): H01L33/48H01L33/58H01L33/60
CPCH01L2224/48091H01L2224/49111H01L2924/00014
Inventor 孙慧卿郭志友张盼君解楠杨斌
Owner SOUTH CHINA NORMAL UNIVERSITY