Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof

A flat heat pipe and radial technology, which is applied in the field of flat heat pipe and manufacturing process, can solve the problems of poor boiling heat transfer performance, insufficient capillary force, and uneven arrangement of equidistant grooves, etc., and achieve excellent boiling enhancement performance, capillary Enhanced effect and simple technical means

Active Publication Date: 2012-10-03
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcomings and deficiencies of the above-mentioned prior art, provide a radial gradually widening fin structure grooved flat heat pipe and its

Method used

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  • Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof
  • Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof
  • Radial gradually-wide type fin-structure grooved panel heat pipe and processing method thereof

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Embodiment

[0033] like figure 1 , 2 , 3, 4, 5a, and 5b, the flat plate heat pipe with radially widened fin structure of the present invention includes a lower base 1, an upper cover plate 2, and a support ring 3, and the surroundings of the lower base 1 and the upper cover plate 2 Sealed connection, the lower base 1 includes a circular base 1-1 with a circular boss 1-2 on the circular base 1-1, the top surface of the circular boss 1-2 is low in the middle and the outer edge The slope 51 of the tall inner conical structure, the top surface of the circular boss 1-2 is radially distributed with V-shaped grooves 11 and ridges 12 from the center outward, and the support ring 3 is placed on the circular boss. The middle part of the top surface of the platform 1-2; the side of the support ring 3 in contact with the ridge 12 is a plane, and the surface of the support ring 3 in contact with the upper cover plate 2 is a concave-convex contact surface; the top of the circular boss 1-2 A capillary...

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Abstract

The invention discloses a radial gradually-wide type fin-structure grooved panel heat pipe and a processing method thereof. The radial gradually-wide type fin-structure grooved panel heat pipe comprises a lower base, an upper cover plate and a support ring, wherein the lower base comprises a circular substrate, the circular substrate is provided with a circular lug boss, the top surface of the circular lug boss forms an inclined surface of an inner taper structure with a low center and a high outer edge, V-shaped grooves and ridges are radially distributed on the top surface of the circular lug boss from the center to the outer edge, and the support ring is arranged in the center of the top surface of the circular lug boss; one surface of the support ring contacting with the ridges is a plane, and the surface of the support ring contacting with the upper cover plate is a concave-convex contact surface; a capillary wick is arranged in the center of the top surface of the circular lug boss, and the widths and the depths of the V-shaped grooves are gradually increased from the center to the outer edge of the circular lug boss. According to the structure, capillary action is intensified, and therefore, the capillary limit of the radial gradually-wide type fin-structure grooved panel heat pipe is greatly enhanced, larger capillary force is provided and the superficial area of boiling heat transfer is enlarged; and in addition, the invention has the advantages of simpleness, convenience and easy operation for technical means, low cost and wide application prospect.

Description

technical field [0001] The invention relates to a flat heat pipe and a manufacturing process, in particular to a radial gradually widening fin structure grooved flat heat pipe and a processing method. Background technique [0002] As the integration of electronic products increases and the system becomes more and more complex, at the same time, the packaging space of electronic chips is becoming increasingly narrow, resulting in an increase in the heat flux density of chips in the microelectronics field but a decrease in the effective heat dissipation area. The reliability of electronic components drops sharply as the temperature rises. Among all the operating failures of electronic equipment, the failures caused by temperature account for more than 55%. High heat accumulation in electronic chips creates hot spots, which also seriously affects their performance and lifespan. The traditional heat transfer method of relying on the heat transfer between the aluminum heat sink ...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 汤勇黄光汉张仕伟陆龙生付婷罗文杰
Owner SOUTH CHINA UNIV OF TECH
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