Method for manufacturing dustproof photography module and dustproof photography module device

A camera module, dust-proof technology, applied in installation, image communication, camera body and other directions, can solve the problem of the impact of shooting effect, the short distance of dust from the imaging surface of the chip, etc. Poor dust effect

Active Publication Date: 2012-10-03
GUANGDONG LITE ARRAY +1
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  • Abstract
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  • Application Information

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Problems solved by technology

Therefore, the dust falls on the glass surface of the chip, and the distance between the dust and the imaging surface of the ch

Method used

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  • Method for manufacturing dustproof photography module and dustproof photography module device
  • Method for manufacturing dustproof photography module and dustproof photography module device
  • Method for manufacturing dustproof photography module and dustproof photography module device

Examples

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Example Embodiment

[0032] Example: see Figure 1 to Figure 3 , This embodiment provides a method for preparing a dustproof camera module, which includes the following steps:

[0033] (1) Prepare a lens 1, a photosensitive chip 6, and a flat printed circuit substrate 7; set the lower surface of the photosensitive chip 6 on the flat printed circuit substrate 7;

[0034] (2) Prepare a hollow sealing layer with a thickness, which is arranged on the upper surface of the photosensitive chip 6 and covers the outer peripheral part of the upper surface, and the hollow part is correspondingly arranged directly above the photosensitive area of ​​the photosensitive chip 6;

[0035] (3) Prepare a light-transmitting protective layer with a thickness of transparent material, and set it on the upper surface of the sealing layer, and cover the sealing layer completely, directly above the photosensitive area of ​​the photosensitive chip 6 Between the upper surface of the light-transmitting protective layer, an imaging ...

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Abstract

The invention discloses a method for manufacturing a dustproof photography module. The method comprises the following steps of: (1) manufacturing a lens, a light sensing chip and a planar printed circuit substrate; (2) manufacturing a hollow sealing layer with a thickness; and (3) manufacturing a light transmittance protection layer by a transparent material with a thickness, and arranging the light transmittance protection layer on the upper surface of the sealing layer, wherein the light transmittance protection layer completely covers the sealing layer; and an imaging protection region of which the perpendicular height is not less than 0.65 millimeters is formed between the position over the light sensing region of the light sensing chip and the upper surface of the light transmittance protection layer. The invention also discloses a device for implementing the method. The method and the device have the advantages that the sealing layer and the protection layer are arranged on the light sensing chip, so that an imaging distance is increased, and an image can be formed until the thickness of dust falling on the protection layer is more than 30 mu m; and the problem about dust prevention of the photography module is effectively solved.

Description

technical field [0001] The invention relates to camera technology, in particular to a method and device for preparing a dust-proof camera module. Background technique [0002] With the rapid development of science and technology, cameras have been widely used in many fields, such as notebook computers, mobile phones, medical endoscopes, real-time detection of products in industrial manufacturing, and security monitoring. [0003] CMOS Camera Module (CMOS Camera Module), referred to as CCM, is the core device used in various new-generation portable camera equipment. Compared with traditional camera systems, it has the advantages of miniaturization, low power consumption, low cost, and high image quality. [0004] The traditional high-pixel CSP process camera module is composed of photosensitive chip, lens assembly + filter, motor, motor base and flat printed circuit board. The electrical signal generated by the photosensitive chip is output through the connection point on th...

Claims

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Application Information

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IPC IPC(8): G03B17/02G03B17/12G02B7/00H04N5/225G03B30/00
Inventor 沈振权舒伟平曹后平田野童小琴卢密刘文姬
Owner GUANGDONG LITE ARRAY
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