Method for manufacturing LED (light-emitting diode) packaging retaining wall
A technology of LED packaging and manufacturing methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing production efficiency and achieve high production efficiency, low production cost, and good reliability
Inactive Publication Date: 2012-10-03
AAC ACOUSTIC TECH (SHENZHEN) CO LTD +1
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Problems solved by technology
Therefore, another lens packaging method has emerged, that is, to form a barrier wall around the LED by repeated printing to encapsulate it. However, this sealing method requires more than 10 times of printing in order to achieve a height of 150um for the barrier wall. This will greatly reduce productivity
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[0023] The present invention will be further described below in conjunction with accompanying drawing and embodiment, it should be noted that, figure 1 It is only a schematic diagram of the process flow of the method of the present invention, and simply shows a process, and has no direct connection with the shape and structure of the realized product. figure 2 and image 3 There is also no direct connection to the shape structure of the perspective view shown in .
[0024] Such as Figure 1-3 Shown, a kind of manufacturing method of LED encapsulation retaining wall, this method comprises the steps:
[0025] Step A, providing a ceramic substrate 1;
[0026] Provide a soft mold 4, the soft mold 4 is made of transparent polymer material, is provided with a plurality of model grooves 41 of predetermined shape, in this embodiment, the model groove 41 is an annular groove;
[0027] A photosensitive ceramic paste material 2 is provided.
[0028] Step B, forming several groups o...
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Abstract
The invention provides a method for manufacturing an LED (light-emitting diode) packaging retaining wall. The method comprises the following steps: providing a ceramic substrate, a soft mould and a photosensitive ceramic sizing material; forming a plurality of electrodes on the ceramic substrate; filling the photosensitive ceramic sizing material into model grooves; enabling the model grooves filled with the photosensitive ceramic sizing material to be respectively just opposite to groups of electrodes; pressing the soft mould on the ceramic substrate; solidifying the photosensitive ceramic sizing material in the model grooves through an UV (ultraviolet) hardening method to form the retaining wall while pressing the mould; solidifying the photosensitive ceramic sizing material to form the retaining wall and enabling the photosensitive ceramic sizing material to be bonded with the ceramic substrate at the same time; and removing the soft mould. Compared with the prior art, the method for manufacturing the LED packaging retaining wall is simple and high in productivity; and the production cost is lowered.
Description
【Technical field】 [0001] The invention relates to a method for manufacturing an LED package retaining wall, in particular to a method for manufacturing an LED package retaining wall applied to portable electronic products. 【Background technique】 [0002] With the continuous upgrading of electronic products, especially portable electronic products such as mobile phones, notebooks, etc., people have higher and higher requirements for their functions. They no longer only stay on the acoustic performance of communication, but also more and more pursue photography. The function of the optical performance. As a result, there are more and more LED lens devices using the camera function on portable electronic products such as mobile phones. [0003] An LED lens device in the related art includes a ceramic substrate, an LED chip placed on the ceramic substrate, and a lens unit encapsulating the LED chip. [0004] However, in the LED lens device of the related art, when the LED is p...
Claims
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IPC IPC(8): H01L33/48
CPCH01L33/0095B29C35/0805H01L2933/0033
Inventor 李忠硕金东明南舍模金荣基河宗秀
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD