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A subframe and its shielding backplane

A backplane and veneer technology, used in magnetic field/electric field shielding, rack/frame structure, radiation-proof ventilation panels, etc., can solve problems such as high power consumption of equipment and damage to shielding bodies, and achieve the effect of solving the problem of large space occupation

Active Publication Date: 2016-01-27
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the rapid development of the communication industry and the increasing demand for information services, the power consumption of the current equipment is increasing. Due to the heat dissipation requirements, it is necessary to open large holes on the backplane to dissipate heat. However, opening holes on the backplane heat dissipation, it destroys the shielding body composed of the original backplane and subframe

Method used

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  • A subframe and its shielding backplane
  • A subframe and its shielding backplane
  • A subframe and its shielding backplane

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Embodiment Construction

[0025] The embodiment of the invention discloses a shielding backplane to solve the problems of heat dissipation and shielding at the same time.

[0026] The embodiment of the invention also discloses a subframe with the above-mentioned shielding backplane.

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] see Figure 1-Figure 3 , figure 1 A schematic cross-sectional structure diagram of a waveguide hole provided by an embodiment of the present invention; figure 2 Schematic diagram of the structu...

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Abstract

A back shielding plate is provided with a number of heat radiating holes, where the heat radiating holes are waveguide holes with waveguide characteristics. The heat radiating holes arranged on the back shielding plate have heat radiating function, and for they are waveguide holes with waveguide characteristics they can simultaneously make the back shielding plate installed on a plug frame possess shielding function according to the shielding attenuation characteristics of the waveguide holes to prevent electromagnetic signal interference between electronic devices. The solution of the present invention can resolve the heat radiating and the shielding problems simultaneously.

Description

technical field [0001] The invention relates to the technical field of shielding backplanes, in particular to a subframe and its shielding backplane. Background technique [0002] The subframe refers to the frame structure used to install and fix the backplane and single board. Among them, the single board refers to the combination of the circuit board and the mounting parts; the backplane refers to the connection of the single boards and provides physical channels for signal transmission between the single boards, and is usually installed in the subrack. [0003] In order to prevent the interference of electromagnetic signals between electronic devices, generally the subracks need to be shielded. At present, the backplane is usually seamlessly overlapped with the conductive cloth and the subframe to form a shield or realize partitioned shielding within the subframe. [0004] In the prior art, generally, the backplane and the subframe are used to form a shielding body for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H05K7/20H05K7/18
CPCH05K7/1439H05K7/20563H05K9/0041H05K9/0062
Inventor 叶玲戴养哩裴欢
Owner HUAWEI TECH CO LTD
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