A measuring device and measuring method for measuring motion accuracy of a motion platform

Abstract

A measuring device for measuring motion precision of a motion bench comprises an illumination system, a mask bench for placing a test mask plate, a projection lens, a workpiece bench for placing a test silicon chip, a plurality of test marks and an overlay mark exposure control structure, all of which are sequentially arranged along a propagation direction of light. The plurality of test marks are distributed as a matrix on the test mask plate. Each test mark is provided with a first overlay mark and a second overlay mark disposed concentrically. The overlay mark exposure control structure is arranged between the test mask plate and the illumination system to allow the first overlay mark and the second overlay mark on the test mask plate to be sequentially exposed onto the test silicon chip through the projection lens to form a two-layer overlay marked pattern. The motion precision of the motion bench is calculated based on overlay error of the two-layer overlay marked pattern. A measuring method for measuring the motion precision of the motion bench is also disclosed at the same time. The measuring device and the measuring method eliminate a plurality of measuring error impact factors and are able to measure and assess the motion precision of the workpiece bench more accurately.

Description

technical field [0001] The invention relates to the field of photolithography machines, in particular to a measuring device and a measuring method for measuring the motion accuracy of a moving table. Background technique [0002] Lithography equipment is mainly used in the manufacture of integrated circuits IC or other micro-devices. During the manufacturing process, a complete chip usually requires multiple photolithography exposures to complete. In these exposure processes, the motion accuracy of the motion stage is an important factor affecting the registration accuracy of lithography. [0003] As a basic index requirement, the motion accuracy of the motion table is usually used as the first stage index to be measured in all overlay tests. It is generally evaluated by the method of overlay exposure, and the positioning error of the moving stage is measured by the overlay deviation of the upper and lower layers of exposure. See figure 1 , the overlay mark used in this ...

AI Technical Summary

Problems solved by technology

[0009] (3) The manufacturing error of the test mask. During the manufacturing process of the test mask, the two Box marks are respectively written into the test mask. The two overlay marks with a distance of D may have a certain offset, and the farther the distance is, the The deviation is more difficult to control

Therefore, the position residual (dx, dy) caused by the manufacture of the test mask will directly affect the measurement of the accuracy of the motion table;

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