Structure improvement of condensation device and heat dissipation module of condensation device
A technology of condensing device and heat dissipation module, which is applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of high cost, poor heat transfer effect, and inefficient return flow of working fluid 84, etc., to achieve accelerated steam Liquid circulation, avoid heat transfer invalid area, and reduce cost
Active Publication Date: 2012-10-17
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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[0008] The aforementioned working fluid 84 is converted from a vapor state to a liquid state in the second part 832, and the liquid working fluid 84 in the second part 832 is only driven by gravity to slowly flow back into the heat-absorbing component 81, so the The middle section and rear section of the second part 832 of the pipeline assembly 83 and the bends form an invalid area, which does not help the efficiency of the return flow of the working fluid 84; therefore, the prior art has the following disadvantages:
[0009] 1. The heat transfer effect is not good;
[0010] 2. Has heat transfer invalid area;
[0011] 3. High cost
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[0046] The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.
[0047] See figure 2 The cross-sectional view of the first embodiment of the condensing device of the present invention is shown. As shown in the figure, the condensing device 1 includes: a hollow body 11;
[0048] The hollow body 11 has at least one first inlet end 111, at least one first outlet end 112, and a diversion area 113. The first inlet end 111 and the first outlet end 112 are respectively corresponding to the guide On both sides of the flow area 113, the diversion area 113 has a plurality of diversion fluids 1131. The diversion fluids 1131 are arranged at intervals and form at least one flow channel 1132 between the two diversion fluids 1131. One end of the diversion fluid 1131 corresponds to the The other end of the first inlet end 111 corresponds to the first outlet end 112.
[0049...
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The invention discloses a structure improvement of a condensation device and a heat dissipation module of the condensation device. The condensation device is characterized by comprising a hollow body provided with a first inlet end, a first outlet end and a flow guide region, wherein the flow guide region is provided with a plurality of flow guide bodies and a plurality of flow channels and is connected with the first inlet end and the first outlet end; the flow guide region is connected with a heat absorption unit through a first heat transmission unit and a second heat transmission unit to form a heat dissipation module; and due to the flow guide region, the vapor and liquid circulation in the condensation device can be accelerated, so that the heat transmission efficiency is improved.
Description
Technical field [0001] A structure improvement of a condensing device and a heat dissipation module thereof, in particular to a structure improvement of a condensing device with a structure capable of accelerating vapor-liquid circulation, and a heat dissipation module thereof. Background technique [0002] In recent years, with the vigorous development of the electronic semiconductor industry, the advancement of process technology, and the trend of market demand, electronic devices have gradually become lighter, thinner and shorter. However, in the process of gradual reduction in size, the functions and computing capabilities are It is increasing. For example, when the notebook computers and desktop computers with the highest output value in the information industry are in actual operation, there are many electronic components that generate heat. Among them, the central processing unit (CPU) generates the largest heat. The heat sink composed of the heat sink and the fan provide...
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IPC IPC(8): G06F1/20H01L23/427
Inventor 巫俊铭
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD