Structure improvement of condensation device and heat dissipation module of condensation device
A condensing device and heat dissipation module technology, applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of high cost, poor heat transfer effect, and inefficient return of working fluid 84, etc., to achieve accelerated steam Liquid circulation, avoid heat transfer invalid area, and reduce cost
Active Publication Date: 2015-02-18
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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Problems solved by technology
[0008] The aforementioned working fluid 84 is converted from a vapor state to a liquid state in the second part 832, and the liquid working fluid 84 in the second part 832 is only driven by gravity to slowly flow back into the heat-absorbing component 81, so the The middle section and rear section of the second part 832 of the pipeline assembly 83 and the bends form an invalid area, which does not help the efficiency of the return flow of the working fluid 84; therefore, the prior art has the following disadvantages:
[0009] 1. The heat transfer effect is not good;
[0010] 2. Has heat transfer invalid area;
[0011] 3. High cost
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[0046] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.
[0047] see figure 2 The sectional view of the first embodiment of the condensing device of the present invention is shown. As shown in the figure, the condensing device 1 includes: a hollow body 11;
[0048] The hollow body 11 has at least one first inlet port 111, at least one first outlet port 112 and a diversion area 113, and the first inlet port 111 and the first outlet port 112 are respectively arranged in the guide region. On both sides of the flow area 113, the flow guide area 113 has a plurality of guide bodies 1131, the guide bodies 1131 are arranged at intervals and at least one flow channel 1132 is formed between two guide bodies 1131, and one end of the guide body 1131 corresponds to the The first inlet port 111 is described, and the other end corresponds to the first...
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The invention discloses a structure improvement of a condensation device and a heat dissipation module of the condensation device. The condensation device is characterized by comprising a hollow body provided with a first inlet end, a first outlet end and a flow guide region, wherein the flow guide region is provided with a plurality of flow guide bodies and a plurality of flow channels and is connected with the first inlet end and the first outlet end; the flow guide region is connected with a heat absorption unit through a first heat transmission unit and a second heat transmission unit to form a heat dissipation module; and due to the flow guide region, the vapor and liquid circulation in the condensation device can be accelerated, so that the heat transmission efficiency is improved.
Description
technical field [0001] An improvement in the structure of a condensing device and a heat dissipation module thereof, in particular to an improvement in the structure of a condensing device and a heat dissipation module thereof in which a structure capable of accelerating vapor-liquid circulation is arranged in the condensing device. Background technique [0002] In recent years, with the vigorous development of the electronic semiconductor industry, the progress of process technology, and under the trend of market demand, electronic equipment has gradually moved towards thinner and smaller shapes. It is unabated. For example, in the actual operation of notebook computers and desktop computers with the highest output value in the information industry, many electronic components generate heat, among which the CPU (Central Processing Unit) generates the most heat. The heat sink composed of the heat sink and the fan provides heat dissipation function and plays an important role...
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IPC IPC(8): G06F1/20H01L23/427
Inventor 巫俊铭
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD