Die for pre-plastic package of a lead frame and encapsulation structure
A technology of encapsulation structure and lead frame, which can be used in measurement devices, coatings, instruments, etc., can solve the problems of wire bonding reliability decline, and achieve the effect of high reliability
Active Publication Date: 2012-10-31
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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- Application Information
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Problems solved by technology
[0007] The technical problem to be solved by the present invention is to prevent the reliability of wire bonding from being reduced due to the pre-molding process
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[0031] The following introduces some of the multiple possible embodiments of the present invention, which are intended to provide a basic understanding of the present invention, and are not intended to confirm the key or decisive elements of the present invention or limit the scope of protection. It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, those of ordinary skill in the art can propose other alternative implementations. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solutions of the present invention, and should not be regarded as all of the present invention or as a limitation or limitation to the technical solutions of the present invention.
[0032] In this article, the orientation terms of "up" and "down" are defined by the relative position between the lead frame and the packaged sensor chip. With respect ...
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Abstract
The invention provides a die for pre-plastic package of a lead frame and an encapsulation structure and belongs to the technical field of encapsulation of a sensor chip. The die is used for carrying out pre-plastic package on the lead frame of encapsulating the sensor chip and comprises an upper die body and a lower die body, wherein the upper die body is arranged at one side of the lead frame; the lower die frame is arranged at the second side opposite to the first side; a pit is arranged at the position corresponding to an inner pin of the lead frame on the surface of the die contacting with the first lateral surface of the lead frame, so that the lead frame extrudes towards the pit under the action of pressure in pre-plastic package, so as to form a corresponding convex baffle block. The encapsulation structure is molded by the die in pre-plastic package, and the inner pin of the lead frame is provided with the baffle block, which is formed by extruding towards the pit under the action of pressure in pre-plastic package and used as a bonding area. Therefore, the surface of the baffle block used as the bonding area is not easily polluted, and the reliability of bonding the lead is high.
Description
Technical field [0001] The invention belongs to the technical field of sensor chip packaging, and relates to a mold for pre-plasticizing a lead frame of a sensor chip and a packaging structure pre-plasticized by the mold. Background technique [0002] In IC packaging technology, the packaging form and packaging process need to be selected according to the circuit function requirements of different circuit chips. Among them, the packaging process usually includes a wire bonding process and a plastic packaging process. In the traditional packaging process, wire bonding is generally performed first, and then the bonded chip and part of the lead frame are plastic-encapsulated to realize the fixation of the package. However, for sensor chips (for example, MEMS pressure sensor chips), the packaging process is different from the traditional packaging process. First, the plastic housing is pre-fabricated by pre-molding, and then wire bonding is performed. In this way, the sensor chip c...
Claims
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Login to View More IPC IPC(8): B29C45/26H01L23/495
CPCH01L2224/32245G01L19/00H01L21/565B29C45/14655G01L19/142H01L2224/73265H01L2224/48247H01L23/3107G01L19/0084G01L19/0038H01L2924/1461
Inventor 张政林张小健
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH