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Separate hardware injective envelope injection mold

An injection mold and separate technology, which is applied in the field of separate metal injection molds, can solve the problems of increasing the defective rate of the final product, leaking terminals and encapsulation of products, and easily colliding terminals, etc., to improve efficiency and yield, improve Product yield, the effect of improving yield

Active Publication Date: 2014-09-10
SHANGHAI VEI SHENG AUTO PARTS MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. When the packaged product is shot, the glue flow is easy to move the position of the hardware terminal, and there are phenomena such as product leaking terminal and glue wrapping
[0004] 2. After the hardware terminals are arranged neatly, when the mold is closed, the mold slider is easy to collide with the terminals and deform it, which increases the defective rate of the final product

Method used

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  • Separate hardware injective envelope injection mold
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Embodiment Construction

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and those skilled in the art can obtain other structures according to these drawings without creative effort.

[0017] as attached figure 1 Shown is the overall structure schematic diagram of the mold of the present embodiment, figure 2 It is a schematic diagram of the structure of the upper and lower sliders clamping the hardware terminal in this embodiment. It is a separate metal injection molding injection mold, including an upper mold 1, a lower mold 2 matched with it, and placed on the upper mold 1 and the lower mold 2. The metal terminal 7 in the mold cavity, the upper mold 1 and the lower mo...

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Abstract

The invention discloses a separate hardware injective envelope injection mold, which comprises an upper mold, a lower mold matched with the upper mold, and hardware terminals arranged in a mold cavity enclosed by the upper and lower molds. An injection runner is formed in each of the upper and lower molds. A lower sliding block capable of sliding is correspondingly arranged on the lower mold. An upper sliding block is correspondingly arranged on the upper mold, and can be clamped with the lower sliding block in a sliding way. Floating sinking positioning pins for positioning the hardware terminals are arranged in the upper mold, and can move up and down in the upper mold. According to the separate hardware injective envelope injection mold, the floating sinking positioning pins are added to pre-position the hardware terminals, so that the hardware terminals cannot be displaced, and the yield is improved; and by adopting the structures of the upper and lower sliding blocks, the hardware terminals can be quickly arranged, and are difficultly deformed, so that the efficiency and the yield are improved.

Description

technical field [0001] The invention relates to an injection mold, in particular to a separate type hardware injection mold. Background technique [0002] The structure of the existing metal injection package injection mold is composed of an upper mold, a lower mold, a thimble and a slide block. During production, put the hardware terminal into the cavity of the mold, then put the upper and lower molds together, and inject glue into the cavity of the mold to form a packaged product. The existing mold has two major disadvantages: [0003] 1. When the packaged product is shot, the glue flow will easily move the position of the hardware terminal, and the phenomenon of product leakage and glue wrapping will occur. [0004] 2. After the hardware terminals are arranged neatly, when the mold is closed, the mold slider is easy to collide with the terminals and deform them, which increases the defect rate of the final product. [0005] Therefore, there is an urgent need in this fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/26
Inventor 尤山泉陶良军林东峰齐照山胡提涛
Owner SHANGHAI VEI SHENG AUTO PARTS MFG CO LTD