Defect detecting method for utilizing graphic features to scan and manufacturing method of semiconductor chip

Abstract

The invention provides a defect detecting method for utilizing graphic features to scan and a manufacturing method of a semiconductor chip. The defect detecting method for utilizing graphic features to scan according to the invention comprises the following steps: 1) defining a repeated unit structure according to a semiconductor structure; 2) inputting a data graph of the repeated unit structure defined in the step 1) to a defect detecting program; 3) inputting a physical repeated structure of the semiconductor structure on the chip to the defect detecting program; 4) comparing the graphic features of the physical repeated structure and the data graph in the defect detecting program; and 5) detecting a defect position according to the compared difference from the step 4). The invention provides a high-precision and high-flexibility defect detecting method for detecting the defects in a same position on the repeated unit structure, such as a memory.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, more specifically, the present invention relates to a defect detection method utilizing pattern feature scanning, and in addition, the present invention also relates to a semiconductor chip manufacturing method employing the defect detection method utilizing pattern feature scanning . Background technique [0002] With the continuous improvement of integrated circuit technology, the number of devices per unit area of ​​the chip is also increasing, especially the semiconductor area such as the memory area is the place with the highest integration of devices on the chip, so the subtleties of the device structure Any change will lead to the failure of the final electrical performance. [0003] In order to be able to detect problems in time during the production process and take corresponding measures, a certain number of optical and electronic defect detection equipment will be eq...

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Problems solved by technology

[0004] However, since regular repeating devices such as memories are repeating units in physical structure, as shown in the figure above, A and B are two identical minimum memory repeating units, and the places indicated by the arrows on the figure are defective position, but there are defects at the same position of each repeat unit, and this problem on the chip cannot be detected by existing detection methods (that is, "the same defect exists at the same position of each repeat unit " this question)

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