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A plug-in mechanism, a plug-in frame containing the plug-in mechanism, and a finished board

A plug-in mechanism and frame-inserting technology, which is applied in card reinforcement boards, support structure installation, printed circuit board sockets, etc., can solve problems such as unbalanced installation of buckle boards, uneven strength of studs, and instability

Active Publication Date: 2015-07-29
泰州市海通资产管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. It is easy to cause the strength of the studs at each corner to be different, resulting in unbalanced or unreliable installation of the gusset, which will cause local deformation or even breakage of the gusset;
[0006] 2. It takes a lot of force to separate the connector when disassembling the gusset, which may easily cause damage to the gusset
[0007] 3. Additional tools such as a screwdriver are required to disassemble the gusset, which takes a long time to replace and cannot be installed without screws.

Method used

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  • A plug-in mechanism, a plug-in frame containing the plug-in mechanism, and a finished board
  • A plug-in mechanism, a plug-in frame containing the plug-in mechanism, and a finished board
  • A plug-in mechanism, a plug-in frame containing the plug-in mechanism, and a finished board

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see figure 1 , the embodiment of the present invention provides a plug-in mechanism 100, a plug frame 1 and a finished board 2 including the plug-in mechanism 100, because the embodiment of the plug-in mechanism 100 is included in the embodiment of the plug-in frame 1, and the plug-in frame 2 The embodiments are included in the embodiments of the finished board 2 , so the embodiments of the plugging mechanism 100 and the subrack 1 will not be described ...

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Abstract

Embodiments of the present invention disclose a plug-in mechanism, a subrack including the plug-in mechanism, and a finished board, and relate to a power mechanism, so as to implement fast and reliable plug-in and plug-out by using a lever assistance effect, and a gearing effect of a parallelogram mechanism. The plug-in mechanism provided by an embodiment of the present invention is configured to be disposed between a sub-carrier frame and a parent carrier frame to implement plug-in and plug-out of the sub-carrier frame in the parent carrier frame, and the plug-in mechanism includes a driving part and a gearing part.

Description

technical field [0001] The invention relates to a power mechanism, in particular to a plug-in mechanism, a plug-in frame containing the plug-in mechanism and a finished board. Background technique [0002] With the increasing performance requirements of high-end servers, the number of central processing unit (Central Processing Unit, referred to as CPU) and dual-inline-memory-modules (referred to as DIMM) in a single node is increasing. more and more. Since the size of the chassis has limitations on the size of the printed circuit board (PCB), increasing the hardware density has become the direction of the industry's efforts. One of the existing methods is to arrange the CPU and DIMM on the basis of the traditional single-layer motherboard. The combination of the main board and the daughter board is to arrange the CPU and DIMM on the main board and the daughter board, and then connect the main board and the daughter board through connectors. [0003] The installation metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/14G06F1/18
CPCG06F1/185H05K7/1487H05K7/1461H05K7/1488H05K7/1431
Inventor 吴定强王冬立李尧
Owner 泰州市海通资产管理有限公司