Heat insulation/heat dissipation sheet and intra-device structure

Abstract

The invention provides a heat insulation / heat dissipation sheet and an intra-device structure. The purpose of the present invention is to efficiently dissipate heat generated from a heat generating component of an electronic device, a battery, a heat generating machine component or the like each having the heat generating component mounted on a circuit board or the like, while simultaneously preventing a component to be protected, which is adjacent to the heat generating component, from being heated and thereby being deteriorated in the performance, by suppressing transmission of the heat to the component to be protected. Therefore, specifically disclosed is a heat insulation / heat dissipation sheet, which is arranged between a heat generating component and a component to be protected that is adjacent to the heat generating component for the purpose of connecting the components with each other, and in which an adhesive layer or a heat conductive adhesive layer, a heat conductive layer, an adhesive layer or a heat insulating adhesive layer, a heat insulating layer, and an adhesive layer or a heat insulating adhesive layer are laminated in this order. In addition, an intra-device structure is obtained by bonding the heat conductive layer-side adhesive layer of the heat insulation / heat dissipation sheet to a heat generating component, while bonding the heat insulating layer-side adhesive layer to a component to be protected.

Description

technical field [0001] The present invention relates to a heat insulating heat sink and a device structure using the heat insulating heat sink. Efficiently dissipate heat generated by heat-generating components and secondary batteries in general devices other than equipment, and suppress heat conduction to components, equipment, and devices adjacent to heat-generating components. Background technique [0002] In electronic devices such as home appliances and mobile phones, heat dissipation measures to dissipate heat generated inside are becoming more and more important for improving product reliability. However, in recent years, the miniaturization of equipment has progressed, and components have been arranged at high density in a small space. Therefore, it is difficult to secure a space for disposing a heat dissipation member such as a heat sink, and the heat generated by a heat generating component such as an IC element in the CPU may be directly dissipated to the case th...

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to secure a space for installing heat-dissipating components such as a radiator, and sometimes the heat generated by heat-generating components such as IC elements in the CPU is directly released to the housing via the heat-conducting member.

In this case, there is a problem that the outside of the case is locally heated due to the heat of the heat-generating component being conducted to the outside of the case, or burns are caused due to prolonged contact with the human body.

In addition, there is such a problem that with high-density mounting, components that are sensitive to heat, control ICs of other systems, etc. are in the vicinity of heat-generating components, and receive heat from adjacent heat-generating components, causing adverse effects such as malfunction and life reduction

[0011] Also, in Patent Document 3, there is no description as to how much the heat of the heat-generating component can be reduced and how much the heat conduction to the case can be suppressed, and there are many uncertainties about the effect.

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