A kind of encapsulation structure and encapsulation method thereof

Abstract

The invention provides a packaging structure and a packaging method for a packaging part. The packaging structure comprises a hollow frame, a first packaging base, a second packaging base and the packaging part, wherein the hollow frame comprises an upper surface and a lower surface, the first packaging base is located above the hollow frame and is bonded with the upper surface in a sealing mode, the second packaging base is located below the hollow frame and is bonded with the lower surface in a sealing mode, the packaging part comprises a substrate and a component, the component is located above the substrate, any one of the hollow frame, the first packaging base and the second packaging base is bonded with the substrate, a closed cavity is formed by the hollow frame, the first packaging base and the second packaging base, and the packaging part is contained inside the closed cavity. Compared with the prior art, the packaging structure has the advantages that a packaged chip which comprises the component and the substrate can be completely packaged in the closed cavity, so that the pressure difference between the upper surface of the packaged chip and the lower surface of the packaged chip is avoided, the packaged chip is free of deformation during packaging, and the component performance of the packaged chip is not affected.

Description

technical field [0001] The invention relates to a packaging technology for packaging components, in particular to a packaging structure and a packaging method for the packaging components. Background technique [0002] With the development of Micro Electro Mechanical System (MEMS, Micro Electro Mechanical System) technology, the application of MEMS chips in various fields is becoming more and more extensive. Therefore, the packaging technology of MEMS chips has also become an important factor to ensure the performance of MEMS devices. Technology, for example, the vacuum packaging of MEMS devices, especially MEMS sensors, greatly affects its final performance, reliability and service life. [0003] figure 1 A MEMS package structure in the prior art is shown. refer to figure 1 , the package structure includes a packaged chip 101, a package substrate 102 and a package body 107, wherein the package body 107 is used to package the packaged chip 101, and the package body 107 is...

AI Technical Summary

Problems solved by technology

However, this packaging method can only package one chip at a time, the cost of materials is high, and the volume after packaging is relatively large

Other commonly used packaging methods in the prior art, including the above methods, all need to go through more than one bonding or sealing process, and the process is complicated

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