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Microcomponent alignment unit

A technology of tiny parts and configuration units, applied in the direction of electrical components, electrical components, etc., can solve the problems of increasing the quality of configuration units of tiny parts, complex composition, etc.

Active Publication Date: 2015-06-10
HIHAISUTO SEIKO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rotary head can be rotated by using a high-precision rotary drive device, but such a rotary drive device has a complicated structure, and tends to increase the mass of the minute parts placement unit

Method used

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  • Microcomponent alignment unit
  • Microcomponent alignment unit
  • Microcomponent alignment unit

Examples

Experimental program
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Embodiment Construction

[0037] The minute parts configuration unit of the present invention will be described with reference to the drawings. figure 1 It is a front view showing an example of the configuration of the micro-component arrangement unit 10 of the present invention. and figure 2 yes figure 1 The left side view of the tiny parts configuration unit 10. Additionally, the above figure 1 In the drawing, electronic components 91a to 91f, tray 92 for accommodating electronic components, ring-shaped spacers 18 mounted around shafts 13a to 13f, and frame 16 supporting and fixing elevating mechanism 15 are shown as cross-sections. In addition, the connector ( figure 2 Symbol 11) is not shown.

[0038] figure 1 as well as figure 2 The shown tiny parts configuration unit 10 includes: a lifting mechanism 15 for tiny parts, and the lifting member (such as the lifting member 15a) includes a shaft body ( Such as the shaft body 13a), and the bearing 14 that guides the lifting of the shaft b...

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PUM

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Abstract

The disclosed microcomponent alignment unit has a simple structure, making weight reduction easy. Said microcomponent alignment unit includes a microcomponent raising / lowering mechanism which comprises a plurality of microcomponent raising / lowering means, each of which comprises: a shaft, the bottom end of which is provided with a microcomponent suction nozzle that connects to a pressure-reduction mechanism; and a bearing that is provided around the shaft and guides vertical movement of the shaft. The plurality of microcomponent raising / lowering means are aligned in the width direction of the shafts such that the tip of each shaft is at the same height and the bottom of each suction nozzle is at the same height. The disclosed microcomponent alignment unit also includes: a frame that immovably supports the raising / lowering mechanism; an elastic body that engages with the shaft in each raising / lowering means and the bearings or the frame and supports the shafts such that the tips thereof are all at a prescribed height; pushing devices disposed at a separation above the tip of each shaft; an auxiliary pushing member that can be inserted into the gap between the tip of any shaft and the bottom surface of that pushing device; and an auxiliary pushing member drive mechanism that is connected to and drives the auxiliary pushing member, moving and positioning the auxiliary pushing member horizontally.

Description

technical field [0001] The present invention relates to a minute component arrangement unit which can be incorporated into an electronic component mounting device which mounts electronic components on the surface of a printed wiring board and can be used particularly effectively. Background technique [0002] Conventionally, an electronic component mounting apparatus has been used in order to mount electronic components on the surface of a printed wiring board. An electronic component mounting device generally incorporates a micro-component arranging unit having a shaft body provided with an electronic component (micro component) suction nozzle at the lower end, and a lift drive device for the shaft body. [0003] When the electronic component mounting apparatus is operated, first, the above-mentioned minute component arrangement unit is moved above the tray on which the electronic components are accommodated. The micro parts arrangement unit lowers the shaft body, absorbs ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0409H05K13/041H05K13/0413
Inventor 小关荣一
Owner HIHAISUTO SEIKO
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