Aging carrier for electronic products and aging testing method

A technology for aging testing of electronic products, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve problems such as inability to guarantee connection reliability and stability, many internal components of the carrier, and loose internal components, etc., to achieve aging The effect of detection, eliminating lead wires and eliminating solder joints

Active Publication Date: 2013-01-02
SHENZHEN XING GRAIN AUTOMATION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In this aging line, each group of carriers needs to be equipped with a CPU, and the products to be inspected are also connected to the CPU by lead wires. There are too many internal components (CPU, leads, USB interface, etc.), when the vehicle is dragged by (chain or belt), vibration will inevitably occur, and unreliable factors such as loose internal components, loose solder joints, falling off, and broken leads will increase
On the other hand, in the process of dragging and moving, the brush at the bottom of the carrier is connected to the conductive rail inside the aging cabinet. This method cannot guarantee the reliability and stability of the connection, and this method requires the carrier to be taken out of the detection cabinet. , the aging data can only be obtained by reading the CPU data with special equipment

Method used

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  • Aging carrier for electronic products and aging testing method
  • Aging carrier for electronic products and aging testing method
  • Aging carrier for electronic products and aging testing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] An electronic product burn-in device in an embodiment of the present application includes a carrier, a circuit board interface, a burn-in cabinet, and a burn-in test system (CPU). The electronic product refers to a power charger or other electronic products that require aging tests.

[0049] It is different from the existing technology in which the product to be tested is connected to the cable trough through the lead wire, and then connected to the CPU through the cable trough, please refer to Figure 7 with Figure 8In this example, the circuit board transfer interface 34 used to connect the product under test to the CPU includes a circuit board (PCB) and a soft rubber sleeve 343 . This circuit board is integrated with the input terminal 341 that is used to be connected with electronic product and the output terminal 342 that is used to be connected with burn-in test system (as being used for the CPU of burn-in test), because output terminal 342 and input terminal 34...

Embodiment 2

[0060] The difference between this embodiment and the first embodiment is that the carrier further includes the circuit board transfer interface described in the first embodiment.

Embodiment 3

[0062] The present application also provides an embodiment of an aging test method for electronic products, which includes steps:

[0063] A1. Place the electronic product to be tested in the product placement position of the carrier.

[0064] The carrier in this step can be any carrier described in Embodiment 1.

[0065] A2. Install the circuit board transfer interface with contacts or probes as output terminals on the transfer interface installation position of the carrier.

[0066] The carrier referred to in this step is the carrier mentioned in step A1, and the circuit board adapter refers to the adapter that integrates the input terminal and the output terminal on the same circuit board, which can save the lead wire and solder joint , to eliminate concerns about not being able to guarantee connection reliability. The circuit board adapter in this step may be the circuit board adapter described in Embodiment 1, or a circuit board adapter with other shapes and with contac...

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PUM

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Abstract

The invention relates to an aging carrier for electronic products and an aging testing method. The aging carrier for the electronic products comprises a base plate, a plurality of changeover port installing positions and a plurality of product placing positions. The changeover port installing positions are used for installing circuit board changeover ports and arranged on one side of the base plate. The product placing positions are used for placing the electronic products and arranged on one side of the changeover port installing positions on the base plate, and one product placing position corresponds to one changeover port installing position. The carrier is provided with corresponding changeover port installing positions and product placing positions and can locate circuit board changeover ports and the electronic products to be tested conveniently. Output terminals and input terminals on the circuit board changeover ports are assembled on one circuit board, leads are omitted, welding points are eliminated, reliability of connection is improved, and the circuit board changeover ports and an aging testing system (such as central processing unit (CPU) for aging testing) can be connected through a probe and a contact. Under driving of a driving device, automation of connection can be achieved.

Description

technical field [0001] The invention relates to an aging test of electronic products, in particular to an aging carrier of electronic products and an aging test method. Background technique [0002] Aging test is a kind of test for products to verify the performance and life of terminal products. It usually needs to design a series of reliability experiment items, the most realistic simulation of the scene of the product in actual use, and evaluate the various aspects of the product through the experimental results. aspect performance. In the prior art, there are mainly two types of aging lines for aging testing of electronic products: [0003] 1. Pure manual method, please refer to figure 1 Put the product 13 to be aged into the carrier 11, connect the output terminal 131 of the product 13 to be aged with the input terminal 14 (such as a USB interface) inside the carrier 11, and connect the input terminal 14 inside the carrier 11 The lead wires 15 are collected in the wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/00
Inventor 宾兴
Owner SHENZHEN XING GRAIN AUTOMATION CO LTD
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