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A balun with a laminated structure

A technology of stacked structure and metal conductor layer, applied in the field of electronics, can solve the problems of reducing device size and not finding it, and achieve the effect of reducing size

Active Publication Date: 2016-08-24
CHENGDU HONGMING & UESTC NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the planar process still has not found a design method to effectively reduce the device size

Method used

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  • A balun with a laminated structure
  • A balun with a laminated structure
  • A balun with a laminated structure

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Embodiment Construction

[0025] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0026] In recent years, with the increasing demand for low-cost, low-loss RF modules and wireless communication systems, stacked ceramic integrated circuits (MCIC), such as low-temperature co-fired ceramic (LTCC) technology, have been widely used , because the method makes full use of the three-dimensional multi-layer space, the size of the balun can be significantly reduced. According to the above process, the present invention forms a balun with a stacked structure, thereby significantly reducing the size of the balun.

[0027] In addition, the traditional balun only has the function of converting the unbalanced signal into a balanced signal and impedance transformation, but the invention combines the balun and the band-pass filter into one device, so that the balun has both the function of the balun and the band-pass The function of the fi...

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PUM

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Abstract

The invention discloses a Balun with a laminated structure. The Balun comprises an input port P1 and two output ports P2 and P3, wherein the input port P1 is connected with an input pole plate of a capacitor C1; an output pole plate of the capacitor C1 is connected with an input pole plate of a capacitor C2 and an input end of a strip line L1 through a vertical through hole; an output pole plate of the capacitor C2 is connected with an input pole plate of a capacitor C3 and a port ground 3; an output end of L1 is connected with an input end of a strip line L2 through a vertical through hole and a port ground 2; an output end of the strip line L2 is connected with an output pole plate of the capacitor C3 through a vertical through hole and is connected with an input pole plate of a capacitor C4; an output pole plate of the C4 is connected with the output port P2; an input end of a strip line L3 is connected with the port ground through a vertical through hole; an input pole plate of a capacitor C5 is connected with a port ground 1; an output end of the strip line L3 is connected with an output pole plate of the C5 through a vertical through hole and connected with an input pole plate of a capacitor C6; and an output pole plate of the C6 is connected with the output port P3. Through the invention, the size can be obviously reduced.

Description

technical field [0001] The invention belongs to the field of electronic technology, and relates to a balun adopting a laminated structure, and in particular to a balun adopting a laminated structure and having band-pass filtering performance. Background technique [0002] Balun (Balun) is a three-port device consisting of one unbalanced port and two balanced ports. The signals at the two balanced ports have the same amplitude, but are phase shifted by 180°. Many circuits require balanced input and output, which are used to reduce circuit noise and higher harmonics and improve the dynamic range of the circuit. [0003] As a key device, the balun is widely used in microwave balanced mixers, frequency multipliers, push-pull amplifiers, phase shifters, balanced modulators and dipole antennas. [0004] In the design of microwave circuits, there are many traditional balun production methods, such as high-frequency open-circuit method, magnetic ring three-wire winding, high-frequ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/10H01P5/12H01P1/20H01P1/203
Inventor 邢孟江李小珍邢孟道
Owner CHENGDU HONGMING & UESTC NEW MATERIALS