A balun with a laminated structure
A technology of stacked structure and metal conductor layer, applied in the field of electronics, can solve the problems of reducing device size and not finding it, and achieve the effect of reducing size
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0025] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0026] In recent years, with the increasing demand for low-cost, low-loss RF modules and wireless communication systems, stacked ceramic integrated circuits (MCIC), such as low-temperature co-fired ceramic (LTCC) technology, have been widely used , because the method makes full use of the three-dimensional multi-layer space, the size of the balun can be significantly reduced. According to the above process, the present invention forms a balun with a stacked structure, thereby significantly reducing the size of the balun.
[0027] In addition, the traditional balun only has the function of converting the unbalanced signal into a balanced signal and impedance transformation, but the invention combines the balun and the band-pass filter into one device, so that the balun has both the function of the balun and the band-pass The function of the fi...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 