Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof

Abstract

The invention discloses a single-side printed circuit board with ultrahigh heat conducting performance and a manufacturing method thereof. A metal boss used for mounting high-power electronic elements or chips is arranged on a metal substrate, circuits are arranged on other areas except the metal boss, the metal boss is integrally connected with the metal substrate, and non-conductor positions of the high-power electronic elements or chips can directly contact with the metal boss on the metal substrate. As the metal substrate is a copper substrate or aluminum substrate with heat conductivity coefficient higher than 200W/mK, the electronic elements or chips directly contact with the metal substrate, good heat conduction effect can be achieved, and radiating requirements of electronic elements or chips with power higher than 150W are met. Further, the heat transfer coefficient of an existing PCB is increased from 10W/mK to 200W/mK, stability and reliability of high-power electronic elements and high-speed computing chips are improved greatly, while service lives of the high-power electronic elements and high-speed computing chips are prolonged.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and specifically relates to a single-sided printed circuit board with ultra-high thermal conductivity and a production method. Background technique [0002] With the development of electronic products in the direction of multi-functionality, thinness and lightness, the design space of the printed circuit board (PCB) used to carry electronic products is becoming more and more dense, and the requirements for signal frequency and transmission rate are also getting higher and higher. , the power of the electronic components used and the computing speed of the chips are also increasing, and most of the electric energy of these electronic components or chips during the working period is converted into heat dissipation, which inevitably puts forward higher requirements for the heat dissipation performance of the circuit board. requirements. [0003] According to statistics, the...

AI Technical Summary

Problems solved by technology

Common metal conductors include aluminum blocks, copper blocks, etc. Due to the warping of the PCB and the uneven copper thickness of the line, there is a gap between the PCB and the metal conductor, and its heat dissipation performance is limited.

[0007] 3. Solve the gap between the PCB and the metal conductor by using a high thermal conductivity adhesive sheet to improve its heat dissipation performance (such as aluminum-based circuit board or copper-based circuit board). At present, the maximum thermal conducti

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