113 results about "High power electronics" patented technology

The invention relates to a preparation method of a diamond-copper composite heat sink with a high-heat-conduction passage. According to the method, a diamond / copper composite heat conduction framework with a bionic fractal structure is prepared through an extrusion type additive manufacturing technology, and then the diamond / copper composite heat sink with high heat conduction, high communication and high density is obtained through degreasing, sintering and infiltration processes. The problem that a complex structure is difficult to achieve through a traditional processing method is solved, meanwhile, a high-speed heat conduction channel with preferred orientation is constructed in the heat sink, and therefore the heat dissipation performance of the composite material is remarkably improved, and the composite material is suitable for heat management of high-power electronic equipment.

The invention provides an active support control method for a single-phase cascaded optical storage grid-connected system, aiming at challenges caused by fluctuation, intermittency and reverse peak regulation of photovoltaic resources in a photovoltaic energy consumption process and the problem of insufficient active support capability of a micro-grid for a large power grid under the access of high power electronic equipment. The low-voltage photovoltaic units are boosted by inverter cascading, and each photovoltaic unit is equipped with stored energy to stabilize photovoltaic fluctuation. A grid-side current source inverter is controlled by a virtual synchronous generator (VSG), so that the active support of the inverter on a large power grid frequency is ensured; other voltage source inverters adopt power factor angle droop control, and an active power compensation item is introduced, so that self-synchronization between the inverters and accurate power equalization between energy storage units are ensured. Compared with a traditional control method, the method can control active power and reactive power at the same time, has frequency supporting capacity, is low in communication cost, and provides a new solution thought for the problem of large-scale photovoltaic grid connection.

The utility model provides a tumor electric field treatment device and an electric field generating device thereof, the electric field generating device comprises a shell, an inner support erected in the shell and a plurality of circuit boards arranged on the inner support, and the inner support and the shell jointly define an accommodating cavity for accommodating part of the circuit boards and a heat dissipation bin for accommodating the other part of the circuit boards. The shell is provided with a plurality of heat dissipation holes communicated with the heat dissipation bin, and the other part of the circuit board contained in the heat dissipation bin is a high-power circuit board provided with a high-power electronic device. According to the electric field generating device of the tumor electric field treatment device, the circuit board provided with the high-power electronic device is independently arranged in the heat dissipation bin, so that other circuit boards are prevented from being influenced by heat of the circuit board provided with the high-power electronic device, and meanwhile, the heat dissipation efficiency of the circuit board provided with the high-power electronic device is also improved.

The variable VAR module utilizes an electronic inverter operating at a “boost voltage” that is only a small fraction of the full line voltage. Fo a distribution line voltage of 38 kV, a “boost voltage” of about 10% of the line voltage (i.e., 3.8 kV) is typically sufficient to boost the voltage and inject the VARs necessary to cause the power generated by load-side generation, such as a solar or wind farm, to flow into the power grid. Reducing the operating voltage of the high-power electronics by 90% produces a tremendous reduction in the cost of the power flow controller—in comparison to those operating at the full line voltage. The module also provides “four quadrant” phase angle control injecting variable VARs into the power line causing the load-side generation to flow in the desired direction while maintaining the desired voltage levels in response to monitored power line conditions.

The invention discloses a micro-channel heat exchanger topological optimization design method, which comprises the following specific steps of: 1, executing key working condition parameter sampling in a design space, constructing a topological optimization mathematical model, carrying out iterative computation, and establishing a topological optimization database comprising a topological field and corresponding temperature field, flow field and pressure field data; 2, realizing unified order reduction of a topological field and each physical field by adopting intrinsic orthogonal decomposition, and converting a complex high-dimensional structure into low-dimensional modal representation; 3, constructing a multi-task learning neural network, taking the multi-target constraint parameters as input, taking the topological field modal coefficient and each physical field modal coefficient as output, and adopting a PyTorch deep learning framework to train a topological structure generation model; and 4, a model is generated based on the trained topological structure, the high-resolution topological structure can be predicted within second-level time, and the thermal-fluid performance of the high-resolution topological structure can be synchronously fed back. The method has a remarkable calculation speed-up ratio and good engineering mobility, and an efficient solution is provided for micro-channel heat dissipation design of a high-power electronic device and a new energy system.

The invention relates to a preparation method of sulfur-containing siloxane modified epoxy resin, and belongs to the technical field of high polymer materials. The epoxy resin is prepared from the following components in parts by weight: 100 parts of epoxy resin, 8-11 parts of a reactive diluent, 7.5-9.3 parts of a siloxane modifier, 22-30 parts of ultramicro boron nitride filler, 85-93 parts of a curing agent and 1.2-1.6 parts of an accelerant through blending modification, the siloxane modifier and the epoxy resin are crosslinked and anchored, a sulfur-containing structure and a siloxane structure with chelating property are introduced into a cross-linked network, and the sulfur-containing structure and the siloxane structure act on the boron nitride filler and are strongly chelated with the metal base material, so that the pain point of insufficient heat dissipation of the epoxy resin packaging material is solved, the service life of the epoxy resin packaging material is prolonged, and the service life of the epoxy resin packaging material is prolonged. Overall optimization of cohesiveness, mechanical property and toughness is achieved through structural design, and a high-performance material solution is provided for high-power electronic packaging.

The invention discloses a preparation method of a modified graphite / copper composite heat sink material, and belongs to the technical field of metal-based composite materials. The method comprises the following steps: carrying out acid activation on crystalline flake graphite, modifying the crystalline flake graphite with a silane coupling agent, and selectively stripping to obtain graphite nanosheets; preparing copper-based alloy powder containing at least two carbides of Zr, Cr and Ti; performing graded ultrasonic-ball milling composite dispersion on the surface modified graphite powder, the copper-based alloy powder, the nano-diamond powder, the carboxyl functionalized multi-walled carbon nanotubes and the graphene oxide; gradient filling cold pressing forming and pre-sintering are carried out; performing hot pressing / spark plasma sintering, applying a magnetic field or a vibration field to realize graphite orientation, generating a carbide interface transition layer in situ, and reducing graphene oxide; and after machining, pulse electrodeposition is carried out on the copper-graphene composite coating, and surface micropores / micro textures and phase change material filling can be selectively formed. The method is suitable for efficient heat management of high-power electronic devices.

The invention relates to the technical field of semiconductors, in particular to a gallium oxide nanowire / porous gallium nitride heterojunction and a preparation method and application thereof. The method comprises the following steps: sequentially growing a GaN buffer layer, a u-GaN layer and a p-GaN layer on a substrate to obtain a base; in mixed gas of hydrogen and inert gas, performing thermal decomposition on the substrate to obtain porous gallium nitride; heating the porous gallium nitride in mixed gas of oxygen and inert gas to obtain a gallium oxide / porous gallium nitride heterojunction; spraying gold on the surface of the gallium oxide / porous gallium nitride heterojunction, and annealing the gold into gold particles in an inert atmosphere; in mixed gas of oxygen and inert gas, a gallium source is arranged beside the gallium oxide layer in the previous step for heating, and the gallium oxide nanowire / porous gallium nitride heterojunction is obtained. The prepared heterojunction has excellent carrier transport characteristics, light absorption efficiency and charge separation capability, and is suitable for the fields of solar-blind ultraviolet photoelectric detection, photocatalysis, high-sensitivity sensors, high-power electronic devices and the like.

The invention relates to an embedded micro-fluidic active heat dissipation structure based on a diamond substrate and a preparation method, and belongs to the technical field of heat dissipation. The embedded micro-fluidic active heat dissipation structure based on the diamond substrate comprises the diamond substrate and a cover plate combined on one side of the diamond substrate; a micro-fluid channel system is formed from the surface of one side, close to the cover plate, of the diamond substrate to the interior of the diamond substrate, and the micro-fluid channel system comprises an inlet manifold, a plurality of groups of jet hole arrays, a plurality of micro-channels and an outlet manifold; a fluid disturbance structure is arranged in each micro-channel in the fluid flowing direction. According to the embedded micro-fluidic active heat dissipation structure disclosed by the invention, a micro-fluidic channel system with a specific shape is constructed in the diamond substrate, and jet reinforcement, disturbance enhancement and manifold shunting design are combined, so that the ultrahigh heat dissipation capability under low energy consumption is realized, the problem that the heat dissipation efficiency of an existing silicon-based micro-channel is limited is effectively solved, and the heat dissipation efficiency of the silicon-based micro-channel is improved. And an efficient, stable and integratable thermal management scheme is provided for a high-power electronic device.

The invention provides a high-thermal-conductivity low-modulus graphene fiber heat-conducting gasket and a preparation method thereof. Graphene fibers are directionally wound and impregnated to prepare a prepreg, the prepreg is laminated and bonded to form a high-orientation fiber plate, and then the high-orientation fiber plate is directionally cut in the direction perpendicular to the fibers to obtain the heat-conducting gasket composed of continuous vertical fibers and organic silicon. The fiber is of an X-shaped crossed network structure, and is combined with an elastic silica gel matrix to form a hinge-like structure which can be highly deformed under the orientation of 0.5-10 degrees and-10--0.5 degrees, so that the compression resilience and durability are remarkably improved, and meanwhile, efficient heat conduction is kept. According to the structure, the problems of buckling, fracture and stress concentration which are easily caused by traditional vertical or random arrangement are avoided. A one-way felt impregnation lamination cutting method is adopted, the processing problem caused by high filler is solved, the fiber content can reach 85.1 wt%, and the array density is 2.4-195.9 mg / cm. The gasket has high thermal conductivity, low modulus and excellent rebound resilience, and is suitable for thermal management of high-power electronic equipment such as electronic base stations, communication radars, new energy automobiles, aerospace and the like.

The application discloses a surface modification modified lithium-rich manganese-based positive electrode material, and a preparation method thereof. The lithium-rich manganese-based positive electrode material is coated with a fast ion conductor coating layer and a spinel structure layer rich in oxygen vacancies. The spinel structure layer is in-situ generated on the surface of the lithium-rich manganese-based positive electrode material, and the fast ion conductor coating layer is coated on the surface of the spinel structure layer. The application can improve the electrical properties of the lithium-rich manganese-based positive electrode material, including improving the initial specific discharge capacity and coulombic efficiency, and improving the cycle stability and rate characteristics, so that the lithium-rich manganese-based positive electrode material can meet the development requirements of high-power electronic devices, such as electric vehicles.

The invention discloses an efficient heat transfer liquid cooling micro-channel structure based on topological optimization, which is characterized in that a multi-objective optimization mathematical model taking maximum temperature minimization and pressure drop minimization as objectives is established by constructing a multi-physics field coupling model, defining a design variable and an interpolation model, and iterative solution is carried out by adopting a filtering and projection technology; and the optimal micro-channel layout is obtained. The structure is composed of a main channel and branch micro-channels, the cross section of the main channel is designed in a gradual change mode, the branch micro-channels are distributed according to heat flux density, a smooth curved surface structure is adopted in the connecting position, heat transfer efficiency is effectively improved, flow resistance is reduced, collaborative optimization of heat dissipation performance and energy efficiency is achieved, and the structure is suitable for heat management of high-power electronic equipment.

The invention discloses a shape-stabilized phase change thermal management material, a preparation method thereof and application of the shape-stabilized phase change thermal management material as a thermal management material in a high-power electronic component, and belongs to the field of functional composites.The shape-stabilized phase change thermal management material is prepared by the steps that firstly, fresh pomelo peel is subjected to alkalization and hydrothermal pretreatment, and then ZIF-67 grows on the pretreated pomelo peel in situ; then, the obtained Pre-PP ZIF-67 is subjected to high-temperature calcination to prepare a high-graphitization heterogeneous carbon material, and finally, a phase change material is packaged in a pore channel of the high-graphitization heterogeneous carbon material by adopting a physical infiltration method to prepare the high-performance shaped phase change thermal management material. The prepared phase change heat management material has the advantages of excellent heat conductivity and heat storage performance, good adaptability and operability, lasting stability and reliability, wide application range, reusability and the like, and a new thought is provided for research and development of the high-performance phase change heat management material.

This invention discloses a high thermal conductivity aluminum-silicon / diamond composite material for electronic packaging and its preparation method, comprising: diamond surface modification; mixing silicon powder and modified diamond micropowder with a binder, followed by molding, debinding, and sintering, and then CNC machining and laser cutting to obtain a silicon preform and a diamond preform; assembling the diamond preform into a confined preform by embedding it into a groove in the silicon preform and cold pressing it for shaping; pressure impregnation of high-silicon aluminum melt in a mold, followed by pressure holding and cooling demolding. The composite material has an aluminum-silicon coating-aluminum / diamond interlayer-aluminum-silicon coating sandwich structure, with a thermal conductivity ≥525W / (m·K) and a coefficient of thermal expansion ≤5.0×10⁻⁶. ‑6 / K, interfacial bonding strength ≥280MPa, airtightness ≤5×10 ‑10 Pa·m 3 / s, dimensional tolerance ≤±0.01mm. This invention enables one-time precision molding of complex-shaped electronic packaging materials, which can be used for ultra-high power electronic packaging substrates and heat sinks.

The utility model provides a superconducting electron linear accelerator device for isotope production, which comprises an injector, a superconducting acceleration module and an irradiation target area which are arranged in sequence, and the superconducting acceleration module is connected with a low-temperature cooling system, a radio frequency driving system and a control system; the superconducting acceleration module comprises a low-beta-value Ni3Sn superconducting cavity and five standard Ni3Sn superconducting cavity modules, the low-beta-value superconducting cavity is an SRF acceleration cavity of a 2-cell cavity with beta = 0.7, and each standard superconducting cavity module consists of four SRF acceleration cavities of the 2-cell cavity with beta = 1 which are connected in series; and the input end of the standard superconducting cavity module adopts a symmetrical double-input coupler. According to the linear accelerator device provided by the utility model, the Ni3Sn superconducting cavity adopts a 2-cell and double-input coupler structure, so that the power requirement of high-power input coupling can be reduced under high flow intensity, a high-power electron beam is generated at lower cost, and efficient and economic production of isotopes is realized.

The invention relates to the technical field of single-phase immersion type liquid cooling liquid, and particularly provides single-phase immersion type composite cooling liquid for high-power electronic equipment and a preparation method, and the composite cooling liquid is composed of poly-alpha-olefin, a composite heat conduction component, a composite flame-retardant system and a functional auxiliary agent. The method comprises the following steps: mixing nano boron nitride, graphene and a silane coupling agent which accounts for 1-2% of the total mass of the nano boron nitride and the graphene, and stirring to finish surface modification; heating poly-alpha-olefin, adding the modified composite heat-conducting component, and continuously stirring at a high speed to obtain a mixture; after the heat-conducting phase is dispersed, cooling the mixture, adding a composite flame-retardant system composed of phosphate and melamine cyanurate, and stirring; adding a functional auxiliary agent, and continuously stirring until the functional auxiliary agent is completely dissolved and uniformly dispersed; the finished cooling liquid is obtained. Through collaborative optimization of all the components, the comprehensive performance of high heat conductivity, strong flame retardance, excellent chemical stability and wide material compatibility is achieved at the same time.

The invention provides a turbulence-enhanced bent flow channel liquid cooling plate and a production process thereof, and relates to the technical field of heat dissipation of electronic devices. The invention relates to a turbulence-enhanced liquid cooling plate with a bent flow channel. The liquid cooling plate comprises a substrate and a red copper pipe embedded in the substrate, four embedded grooves are formed in the surface of the substrate; the red copper pipe is embedded in the embedded groove, and the copper pipe is continuously bent to form a tandem four-channel flow channel; a plurality of horizontal-downward-lifting bending units are arranged on the straight pipe section of the copper pipe at intervals, and the bending angle of each bending unit is 30 degrees. Cooling liquid is forced to form turbulent flow through sudden change of the flow channel direction, a laminar flow boundary layer is broken, and the convection heat exchange efficiency is remarkably improved; and moreover, no built-in component is needed, the structure is stable, the processing is simple and convenient, and the heat dissipation device is suitable for high-efficiency heat dissipation of high-power electronic devices and battery modules.

Devices, systems, and methods include a conductive textile (106) comprising a plurality of conductive strands and a flexible bus (102). The flexible bus (102) includes a conductive gel (104) electrically coupled to the conductive strands and an encapsulant (108) bonded to the conductive textile (106) and configured to contain the conductive gel (104) in contact with the conductive strands. The flexible bus is configured to be electrically coupled to a power source and induce a current from the power source to the conductive strands.

The invention discloses a synergetic phase change uniform temperature type thermal buffer with overload adaptability, and relates to the technical field of aerospace thermal management and heat dissipation of high-power electronic devices. The uniform-temperature type heat buffer comprises a heat storage cavity, a heat pipe assembly, a liquid filling opening and a fractal tree rib structure arranged in the heat storage cavity. The condensation section shell, the heat storage cavity base body and the three-dimensional fractal tree rib structure of the heat pipe assembly are integrally formed through additive manufacturing, so that a continuous metal heat conduction channel is formed, and the interface heat resistance between the heat pipe assembly and the heat storage cavity is reduced. The fractal tree rib structure is of a main vein-branch-tip step-by-step bifurcated self-similar topological configuration in the direction away from the condensation section of the heat pipe assembly, is used for rapidly expanding heat from the condensation section to the phase change material in the heat storage space, and serves as a crystallization nucleation framework in the phase change material solidification process. Cooperative coupling of rapid heat transfer of the heat pipe and latent heat storage of the phase change material is achieved, the internal temperature gradient of the phase change material can be reduced, and the temperature uniformity, the cycling stability and the high-overload working condition adaptive capacity in the heat buffering process are improved.

The invention discloses a composite ceramic. The composite ceramic comprises the following raw materials in parts by weight: 50-70 parts of aluminum nitride powder, 30-40 parts of diamond powder and 3-8 parts of an organic binder. The composite ceramic has high thermal conductivity, good insulativity and controllable cost, and is particularly suitable for a heat dissipation substrate or a ceramic circuit board of a high-power electronic device.

The invention discloses a mixed wettability nanowire modified three-stage enhanced boiling heat transfer structure and a preparation method thereof, and belongs to the technical field of micro-nano processing and enhanced phase change heat transfer. According to the structure, two kinds of functional micro-column arrays, namely a micro-cylinder array modified by a super-hydrophilic nanowire and a micro-square column array modified by a super-hydrophobic nanowire, are integrated on a substrate. An efficient liquid supplementing channel is constructed through the strong capillary action, and local dryness is effectively inhibited; the latter is used as a low-superheat-degree nucleation site, rapid generation and separation of bubbles are promoted, bubble coalescence can be effectively inhibited through the millimeter-level spacing, and formation of a steam film is delayed. The two types of micro-columns are orderly distributed in space, and a bubble separation path and a liquid backflow channel are collaboratively optimized. The structure integrates the multi-scale enhanced boiling heat transfer advantages of the millimeter-scale hydrophobic nucleation interval, the micron-scale cylinder and the nano-scale linear structure, the heat transfer coefficient and the critical heat flux are improved, and the structure has important application potential in the high-heat flux heat dissipation fields of high-power electronic devices, aerospace, new energy equipment and the like.

The invention relates to a high-reliability and high-thermal-conductivity composition as well as a preparation method and application thereof. The composition is used for thermal conduction of high-power electronic equipment. The preparation method comprises the following steps: uniformly compounding and mixing a polysiloxane mixture containing silicon vinyl, a reactive treating agent with a long carbon chain and an alkoxy group, asymmetric linear polysiloxane with Si-H and Si-CH = CH2 groups on a molecular chain, a hydrogen-containing polysiloxane cross-linking agent, a Pt catalyst and heat-conducting powder to prepare the bi-component curing type heat-conducting composition; or the single-component pre-cured heat-conducting composition is prepared by uniformly compounding and mixing the branched pre-gel polysiloxane, the reactive treating agent with the long carbon chain and the alkoxy group and the heat-conducting powder. The heat conductivity coefficient of the ultrahigh heat-conducting composition exceeds 15 W / (m.K), and the ultrahigh heat-conducting composition is relatively small in abrasion to equipment, not prone to scratching a chip, excellent in construction performance, extremely low in volatile component, good in flexibility, excellent in rebound resilience, good in adhesion, not prone to pumping out and cracking, extremely good in reliability and capable of being commercially applied to efficient heat conduction and heat dissipation between a heat source of high-power electronic equipment and a radiator.

A multi-jet liquid impingement cooler for on-chip cooling is disclosed, providing an ultra-thin, compact solution for high-power electronic devices. The cooler comprises a manifold having an integrated serpentine wall structure, and laterally alternating feeding and draining nozzles. The integrated serpentine wall structure separates cool and heated coolant flow channels. The feeding nozzles direct, in jets, a cool coolant, which is delivered to the manifold, toward the electronic device for impingement cooling, and the draining nozzles remove the heated coolant from the manifold.

The invention provides a liquid cooling heat dissipation device for high-power electronic equipment and liquid cooling heat dissipation equipment. The liquid cooling heat dissipation device for the high-power electronic equipment comprises a liquid cooling heat dissipation box and a liquid cooling heat dissipation assembly, the liquid cooling heat dissipation box is provided with a liquid inlet cavity, a backflow cavity and a liquid outlet cavity which are communicated in sequence, and the liquid cooling heat dissipation box is provided with a liquid inlet and a liquid outlet; the liquid cooling heat dissipation assembly comprises a steering flow dividing piece and a double-fractal flow equalizing piece, the steering flow dividing piece and the double-fractal flow equalizing piece are both located in the liquid inlet cavity, and the steering flow dividing piece and the liquid inlet are oppositely arranged. After the cooling liquid enters the liquid cooling heat dissipation box, the steering flow dividing piece conducts flow direction conversion on the cooling liquid, so that a liquid flow channel at the liquid inlet is stable, the vortex phenomenon is avoided, and the stable cooling liquid flow speed is provided. And then the cooling liquid is subjected to two-stage precise distribution of the double-fractal flow equalizing piece, so that the flow speed of the turned cooling liquid is further stabilized, and the heat dissipation uniformity of the high-power electronic equipment is effectively improved.

The application is suitable for the field of high-power electronic device heat dissipation technology, and provides a copper-diamond-copper sandwich structure water-cooled radiator and a preparation method thereof.The main structure of the water-cooled radiator is a sandwich structure, the upper layer is copper, the middle layer is MPCVD diamond polycrystal or single crystal material, and the lower layer is copper.The lower layer of copper can have a special water-cooled channel structure to meet the purpose of liquid-cooled heat dissipation.The middle diamond layer quickly conducts the heat of the chip, and the water-cooled channel carries away the heat.The surface copper is convenient for processing when the chip is packaged.The sandwich structure is realized through AMB active brazing technology, the middle layer slurry is nano-silver active solder, which realizes low-temperature brazing and meets the high-temperature thermal cycle reliability after brazing, and the technical application has strong application value and provides strong support for the next generation of water-cooled heat dissipation.

The invention relates to the field of high-thermal-conductivity composite materials, in particular to a diamond and copper high-thermal-conductivity composite material and a preparation method thereof. The method is used for solving the problems that an existing diamond and copper high-thermal-conductivity composite material is low in density and thermal conductivity. The composite material is prepared by taking chromium-tungsten-coated diamond and aluminum nitride-coated copper powder as matrixes and adding lanthanum-magnesium-titanium-aluminum alloy powder, the diamond is firstly subjected to surface treatment, the surface of the diamond is plated with tungsten and chromium, the wettability of the diamond and copper can be enhanced through tungsten and chromium coating, the interface thermal resistance of the diamond and the copper matrixes is reduced, and the heat resistance of the diamond and the copper matrixes is improved; the surface of copper powder is coated with aluminum nitride to form a heat conduction network, lanthanum magnesium titanium aluminum alloy powder reduces the wetting angle of copper and diamond through alloying, interface gaps are filled, heat resistance is reduced, and the heat conductivity of the composite material is improved; all the components jointly improve the heat conduction performance of the composite material, and the requirements of the fields of high-power electronics, aerospace and the like for efficient heat dissipation are met.

The application discloses a flexible insulating composite heat-conducting film and a preparation method thereof. The film is composed of polyvinyl alcohol, glycerol, graphene and graphene oxide. The mass ratio of polyvinyl alcohol to glycerol is 8-10:1, the total amount of graphene and graphene oxide is 1-15 wt% of the total amount of polyvinyl alcohol and glycerol, and the amount of graphene is greater than that of graphene oxide. The synergistic effect of graphene and graphene oxide is utilized, and under the condition of low filler content, the horizontal thermal conductivity of the composite film can reach 8.27 W / (m*K), and the vertical thermal conductivity can reach 1.47 W / (m*K), which is about 20 times higher than that of pure polyvinyl alcohol film. The improvement is due to the inhibition of graphene agglomeration by graphene oxide as a surfactant, the formation of a through heat-conducting network, and the further optimization of sp2 conjugated structure through chemical reduction, which reduces the interface thermal resistance and is suitable for the thermal management of high-power electronic equipment.

The preparation method comprises the following steps that an aluminum alloy raw material is prepared, the aluminum alloy raw material is subjected to melting, refining, standing, casting, homogenization treatment, extrusion, straightening, straightening and aging treatment, and an aluminum alloy material is obtained; the surface of an aluminum alloy material is coated with a heat dissipation coating, the coating comprises a radiation cooling nano composite material, a binder, a solvent and an anti-settling agent, the radiation cooling nano composite material, the binder, the solvent and the anti-settling agent are evenly mixed through high-speed dispersion and then mixed with a curing agent to form slurry, and the surface of the aluminum alloy is coated with the slurry. According to the aluminum alloy radiator and the preparation method thereof provided by the invention, the prepared aluminum alloy radiator has high heat conductivity coefficient and high infrared emissivity. By accurately preparing the aluminum alloy raw material, the heat conductivity is improved, heat can be quickly conducted to the surface of the radiator from a heat source, the heat dissipation efficiency is greatly improved, the heat dissipation requirement of high-power electronic equipment can be met, and stable operation of the equipment is guaranteed.

The invention belongs to the technical field of high polymer materials, and particularly relates to a foam metal composite material and a preparation method and application thereof. According to the heat conduction structure with the efficient heat dissipation function, the insulating thermosetting packaging layer is arranged outside the foam metal framework, so that the foam metal framework is tightly attached to the surface of the heating element, the contact area is effectively increased, and the contact thermal resistance caused by the small foam metal contact surface is reduced. Meanwhile, pores in the foam metal and an interface area between the foam metal and the packaging layer are filled with the non-curing heat-conducting medium, so that the overall heat-conducting efficiency of a heat-conducting path is remarkably enhanced. By means of the design, interface heat transfer is optimized, the heat conduction performance of the foam metal framework is improved through the pore filling media, therefore, higher-efficiency heat dissipation is achieved, meanwhile, electrical insulating performance and structural stability are achieved, and the foam metal framework is suitable for heat management requirements of high-power electronic devices.

The utility model provides a structure of a thermoelectric separation metal substrate, and belongs to the technical field of metal substrates. The thermoelectric separation metal substrate comprises an insulating layer and a copper foil circuit layer laid on the surface of the insulating layer. The insulating layer is bonded on the substrate, four fixing blocks are arranged at four corners of the edge of the bottom of the substrate, a plurality of heat dissipation holes and a plurality of grooves are formed in the bottom of the substrate in a staggered mode, a plurality of heat dissipation fins are arranged in the grooves at equal intervals, and four airflow ports are formed between the fixing blocks and the bottom of the substrate. A boss is arranged on the surface of the substrate and used for installing an electronic element. The depth of each heat dissipation hole is two thirds of the thickness of the substrate, and the depth of each groove is one third of the thickness of the substrate. Through the thermoelectric separation structure design and the air convection heat dissipation mechanism, the heat dissipation efficiency of the metal substrate is remarkably improved, the installation stability is enhanced, and the heat dissipation structure is suitable for heat dissipation of high-power electronic devices.