134 results about "High power electronics" patented technology

The invention relates to the technical field of heat dissipation of electronic devices, in particular to a multi-objective optimization method for a microchannel heat sink turbulent flow structure based on nanofluid. The multi-objective optimization method comprises the steps that integrated computational fluid mechanics simulation, a response surface method and an NSGA-II algorithm are matched; the system solves the problems that in the prior art, research on the synergistic effect of a nanofluid and a turbulent flow structure is insufficient, and multi-objective optimization efficiency is low, firstly, a three-dimensional numerical model is constructed based on ANSYS, and heat transfer and pressure drop characteristics under different parameters are simulated and quantified; secondly, establishing a mathematical model of an input parameter and an output target by adopting a response surface method, and revealing a multi-parameter coupling rule; and finally, performing multi-objective optimization on the synergistic effect by using an NSGA-II algorithm, obtaining a Pareto optimal solution set, and realizing the optimal balance of the heat dissipation performance and the voltage drop. By adopting the technical scheme, through combination of numerical simulation and experimental verification, the optimization efficiency is remarkably improved, and the optimization cost is reduced. And a solution with theoretical preciseness and engineering practicability is provided for thermal management of high-power electronic devices.

The utility model discloses a heat dissipation device for preventing fluid medium leakage and electronic equipment, the heat dissipation device is suitable for heat dissipation of high-power electronic components, the heat dissipation device comprises a heat dissipation base and a plurality of heat dissipation fins, the heat dissipation base is internally provided with a cavity used for accommodating fluid medium, the heat dissipation base is provided with two surfaces arranged on opposite sides, and the heat dissipation fins are arranged in the cavity. One surface is used for being in contact with a heating element, the other surface is provided with a mounting through groove communicated with the cavity, and the periphery of an opening of the mounting through groove is chamfered to form an annular flow guide face surrounding the mounting through groove; flow channels are arranged in the cooling fins, and flow channel connector parts are arranged on the cooling fins and correspond to outlets and inlets of the flow channels respectively. The flow channel connector part is inserted into the mounting through groove, an annular gap is formed between the peripheral surface of the flow channel connector part and the annular flow guide surface, and a whole circle of welding flux is formed in the annular gap, so that the peripheral surface of the flow channel connector part and the annular flow guide surface are sealed, welded and fixed. The problem that the hidden danger of working fluid medium leakage easily exists at the welding position in the prior art is effectively solved.

The invention relates to the field of electronic thermal management. The invention provides an electric field driven liquid metal heat dissipation plate and application thereof.The heat dissipation plate comprises a heat dissipation plate body, a closed pipeline, a first electrode plate, a second electrode plate and a power module, the closed pipeline is located in the heat dissipation plate body, liquid metal is arranged in the closed pipeline, and the first electrode plate and the second electrode plate are arranged outside the closed pipeline; the power supply module is arranged along the closed pipeline and is electrically connected with the first electrode plate and the second electrode plate. The heat dissipation plate is applied to thermal management of high-power electronic equipment or vehicles. Through combination of high thermal conductivity of the liquid metal and electric field driven flowing, the liquid metal actively flows under the action of an electric field, heat of a high-temperature area is conveyed to a low-temperature area, overall thermal diffusion is accelerated, the heat dissipation efficiency is improved, and the requirement for efficient and stable thermal management in a high-heat-flux scene is met.

The invention relates to a preparation method of a diamond-copper composite heat sink with a high-heat-conduction passage. According to the method, a diamond / copper composite heat conduction framework with a bionic fractal structure is prepared through an extrusion type additive manufacturing technology, and then the diamond / copper composite heat sink with high heat conduction, high communication and high density is obtained through degreasing, sintering and infiltration processes. The problem that a complex structure is difficult to achieve through a traditional processing method is solved, meanwhile, a high-speed heat conduction channel with preferred orientation is constructed in the heat sink, and therefore the heat dissipation performance of the composite material is remarkably improved, and the composite material is suitable for heat management of high-power electronic equipment.

The invention relates to a high-thermal-conductivity all-carbon-series heat-conducting gasket and a preparation method and application thereof, in particular to a high-thermal-conductivity all-carbon-series heat-conducting gasket based on a shearing force field and low magnetic field double-field orientation technology and a preparation method thereof, belongs to the technical field of preparation of electronic functional materials, and is mainly used for thermal management of high-power electronic components such as chips, LEDs and 5G equipment. The high-thermal-conductivity all-carbon-series heat-conducting gasket comprises the following raw materials in parts by weight: 100 parts of organic silica gel, 200-500 parts of pitch-based carbon fibers, 80-230 parts of spherical heat-conducting filler and 300-700 parts of a diluent, and the all-carbon-series heat-conducting gasket is oriented in the direction of a magnetic field by utilizing the synergistic effect of a shear force field and the magnetic field. The process has the characteristics of high production efficiency, low cost and easiness in industrial production, and can ensure that a highly-oriented and tightly-arranged heat-conducting network structure is formed in the composite material. The technical breakthrough is of great significance in promoting the practical application of the high-performance thermal interface material.

The invention relates to the technical field of nanometer materials and heat management, in particular to a preparation method of a carbon nanofiber heating film with a nanometer mortise and tenon joint structure, a two-stage mortise and tenon joint structure is formed through metal catalysis in-situ growth of carbon nanotubes, and a three-dimensional interpenetrating network between fibers is achieved. The method specifically comprises the following steps: preparing a polymer precursor fiber membrane containing transition metal salt by adopting a free surface electrostatic spinning technology, performing pre-oxidation, and performing melamine-assisted high-temperature carbonization to catalyze and grow a pod-shaped carbon nano tube branch on the surface of a carbon nano fiber to form a mortise and tenon type mechanical interlocking and chemical bonding synergistic interface. According to the structure, the contact area between fibers is increased, the heat conductivity coefficient in the thickness direction and the transverse conductivity are improved, and meanwhile, the mechanical strength is high. No insulating adhesive is introduced, the process is compatible with an existing production line, and the method can be widely applied to the fields of high-power electronic heat dissipation, flexible device heat management and energy.

The invention provides an active support control method for a single-phase cascaded optical storage grid-connected system, aiming at challenges caused by fluctuation, intermittency and reverse peak regulation of photovoltaic resources in a photovoltaic energy consumption process and the problem of insufficient active support capability of a micro-grid for a large power grid under the access of high power electronic equipment. The low-voltage photovoltaic units are boosted by inverter cascading, and each photovoltaic unit is equipped with stored energy to stabilize photovoltaic fluctuation. A grid-side current source inverter is controlled by a virtual synchronous generator (VSG), so that the active support of the inverter on a large power grid frequency is ensured; other voltage source inverters adopt power factor angle droop control, and an active power compensation item is introduced, so that self-synchronization between the inverters and accurate power equalization between energy storage units are ensured. Compared with a traditional control method, the method can control active power and reactive power at the same time, has frequency supporting capacity, is low in communication cost, and provides a new solution thought for the problem of large-scale photovoltaic grid connection.

The utility model provides a tumor electric field treatment device and an electric field generating device thereof, the electric field generating device comprises a shell, an inner support erected in the shell and a plurality of circuit boards arranged on the inner support, and the inner support and the shell jointly define an accommodating cavity for accommodating part of the circuit boards and a heat dissipation bin for accommodating the other part of the circuit boards. The shell is provided with a plurality of heat dissipation holes communicated with the heat dissipation bin, and the other part of the circuit board contained in the heat dissipation bin is a high-power circuit board provided with a high-power electronic device. According to the electric field generating device of the tumor electric field treatment device, the circuit board provided with the high-power electronic device is independently arranged in the heat dissipation bin, so that other circuit boards are prevented from being influenced by heat of the circuit board provided with the high-power electronic device, and meanwhile, the heat dissipation efficiency of the circuit board provided with the high-power electronic device is also improved.

The invention is suitable for the technical field of heat dissipation of high-power electronic devices, and provides a copper-diamond-copper sandwich structure water-cooling radiator and a preparation method thereof.The main body structure of the water-cooling radiator is of a sandwich structure, the upper layer is copper, the middle layer is an MPCVD diamond polycrystalline or single crystal material, and the lower layer is copper; furthermore, the lower-layer copper can be of a special water cooling channel structure, and the purpose of liquid cooling heat dissipation is achieved. The middle diamond layer plays a role in rapidly guiding out heat of the chip, and the heat is taken away by the water cooling channel for heat dissipation. And the surface layer copper is convenient for processing during chip packaging. The sandwich structure is achieved through the AMB active brazing technology, the slurry of the middle layer is the nano-silver active solder, low-temperature brazing is achieved, the high-temperature thermal cycle reliability after welding is met, the technology has high application value, and powerful support is provided for next-generation water cooling heat dissipation.

The variable VAR module utilizes an electronic inverter operating at a “boost voltage” that is only a small fraction of the full line voltage. Fo a distribution line voltage of 38 kV, a “boost voltage” of about 10% of the line voltage (i.e., 3.8 kV) is typically sufficient to boost the voltage and inject the VARs necessary to cause the power generated by load-side generation, such as a solar or wind farm, to flow into the power grid. Reducing the operating voltage of the high-power electronics by 90% produces a tremendous reduction in the cost of the power flow controller—in comparison to those operating at the full line voltage. The module also provides “four quadrant” phase angle control injecting variable VARs into the power line causing the load-side generation to flow in the desired direction while maintaining the desired voltage levels in response to monitored power line conditions.

The invention discloses a micro-channel heat exchanger topological optimization design method, which comprises the following specific steps of: 1, executing key working condition parameter sampling in a design space, constructing a topological optimization mathematical model, carrying out iterative computation, and establishing a topological optimization database comprising a topological field and corresponding temperature field, flow field and pressure field data; 2, realizing unified order reduction of a topological field and each physical field by adopting intrinsic orthogonal decomposition, and converting a complex high-dimensional structure into low-dimensional modal representation; 3, constructing a multi-task learning neural network, taking the multi-target constraint parameters as input, taking the topological field modal coefficient and each physical field modal coefficient as output, and adopting a PyTorch deep learning framework to train a topological structure generation model; and 4, a model is generated based on the trained topological structure, the high-resolution topological structure can be predicted within second-level time, and the thermal-fluid performance of the high-resolution topological structure can be synchronously fed back. The method has a remarkable calculation speed-up ratio and good engineering mobility, and an efficient solution is provided for micro-channel heat dissipation design of a high-power electronic device and a new energy system.

The invention provides a self-adaptive intelligent heat dissipation plate based on a multi-layer composite phase change material and a spiral flow channel, and relates to the field of heat management. The intelligent heat dissipation plate based on self-adaption of the multi-layer composite phase-change material and the spiral flow channel comprises the multi-layer composite phase-change material, the spiral fractal flow channel, an intelligent regulation and control system and a modular unit, the multi-layer composite phase-change material is composed of at least three nanometer modified materials with different phase-change temperatures, and the temperature range covers-20 DEG C to 150 DEG C. According to the multi-layer composite phase change material and spiral flow channel self-adaptive intelligent heat dissipation plate, through the design of the multi-layer composite phase change material and the spiral flow channel and an intelligent regulation and control system, efficient heat dissipation and dynamic temperature adaptation are achieved, and the multi-layer composite phase change material and spiral flow channel self-adaptive intelligent heat dissipation plate is suitable for high-power electronic equipment, new energy batteries, aerospace equipment and other scenes; the heat dissipation efficiency is improved by 40%-60% compared with that of a traditional phase change heat dissipation plate, and the temperature uniformity is improved by 50%; adaptability: supporting a wide temperature range from-40 DEG C to 200 DEG C, and adapting to multiple industry scenes; energy consumption: the power consumption of an AI regulation and control system is less than 5W, and the energy is saved by 30% compared with that of a fixed flow channel.

The invention relates to a preparation method of sulfur-containing siloxane modified epoxy resin, and belongs to the technical field of high polymer materials. The epoxy resin is prepared from the following components in parts by weight: 100 parts of epoxy resin, 8-11 parts of a reactive diluent, 7.5-9.3 parts of a siloxane modifier, 22-30 parts of ultramicro boron nitride filler, 85-93 parts of a curing agent and 1.2-1.6 parts of an accelerant through blending modification, the siloxane modifier and the epoxy resin are crosslinked and anchored, a sulfur-containing structure and a siloxane structure with chelating property are introduced into a cross-linked network, and the sulfur-containing structure and the siloxane structure act on the boron nitride filler and are strongly chelated with the metal base material, so that the pain point of insufficient heat dissipation of the epoxy resin packaging material is solved, the service life of the epoxy resin packaging material is prolonged, and the service life of the epoxy resin packaging material is prolonged. Overall optimization of cohesiveness, mechanical property and toughness is achieved through structural design, and a high-performance material solution is provided for high-power electronic packaging.

The invention discloses a preparation method of a modified graphite / copper composite heat sink material, and belongs to the technical field of metal-based composite materials. The method comprises the following steps: carrying out acid activation on crystalline flake graphite, modifying the crystalline flake graphite with a silane coupling agent, and selectively stripping to obtain graphite nanosheets; preparing copper-based alloy powder containing at least two carbides of Zr, Cr and Ti; performing graded ultrasonic-ball milling composite dispersion on the surface modified graphite powder, the copper-based alloy powder, the nano-diamond powder, the carboxyl functionalized multi-walled carbon nanotubes and the graphene oxide; gradient filling cold pressing forming and pre-sintering are carried out; performing hot pressing / spark plasma sintering, applying a magnetic field or a vibration field to realize graphite orientation, generating a carbide interface transition layer in situ, and reducing graphene oxide; and after machining, pulse electrodeposition is carried out on the copper-graphene composite coating, and surface micropores / micro textures and phase change material filling can be selectively formed. The method is suitable for efficient heat management of high-power electronic devices.

The invention provides a heat-conducting insulating electromagnetic shielding composite material and a preparation method and application thereof, and belongs to the technical field of heat management. The composite material comprises a matrix Kevlar 1414 and a heat-conducting filler carbon nano tube, the Kevlar 1414 and the carbon nano tube are placed in a concentrated sulfuric acid medium, ultrasonic and mechanical stirring is carried out until uniform dispersion is achieved, a composite heat-conducting film is formed after drying and hot pressing, the in-plane heat conductivity of the composite heat-conducting film is 9.6 W / m.K to 23.8 W / m.K, and the in-plane heat conductivity of the composite heat-conducting film is 23.6 W / m.K to 23.8 W / m.K. The composite material can be used for heat dissipation of high-temperature electronic devices under extreme conditions, especially for COB lamp beads with the heat emission reaching 180 DEG C or above and the color temperature being 6000K. The Pi-Pi anchoring effect between the multi-walled carbon nanotubes and the Kevlar 1414 enhances the acting force at the interface of the matrix and the heat-conducting filler, so that the heat-conducting composite film has high heat conductivity, good machinability, high temperature resistance, flexibility, insulativity and electromagnetic shielding performance, and is suitable for application requirements of heat dissipation of highly-integrated and high-power electronic devices.

The invention relates to the technical field of semiconductors, in particular to a gallium oxide nanowire / porous gallium nitride heterojunction and a preparation method and application thereof. The method comprises the following steps: sequentially growing a GaN buffer layer, a u-GaN layer and a p-GaN layer on a substrate to obtain a base; in mixed gas of hydrogen and inert gas, performing thermal decomposition on the substrate to obtain porous gallium nitride; heating the porous gallium nitride in mixed gas of oxygen and inert gas to obtain a gallium oxide / porous gallium nitride heterojunction; spraying gold on the surface of the gallium oxide / porous gallium nitride heterojunction, and annealing the gold into gold particles in an inert atmosphere; in mixed gas of oxygen and inert gas, a gallium source is arranged beside the gallium oxide layer in the previous step for heating, and the gallium oxide nanowire / porous gallium nitride heterojunction is obtained. The prepared heterojunction has excellent carrier transport characteristics, light absorption efficiency and charge separation capability, and is suitable for the fields of solar-blind ultraviolet photoelectric detection, photocatalysis, high-sensitivity sensors, high-power electronic devices and the like.

The invention relates to an embedded micro-fluidic active heat dissipation structure based on a diamond substrate and a preparation method, and belongs to the technical field of heat dissipation. The embedded micro-fluidic active heat dissipation structure based on the diamond substrate comprises the diamond substrate and a cover plate combined on one side of the diamond substrate; a micro-fluid channel system is formed from the surface of one side, close to the cover plate, of the diamond substrate to the interior of the diamond substrate, and the micro-fluid channel system comprises an inlet manifold, a plurality of groups of jet hole arrays, a plurality of micro-channels and an outlet manifold; a fluid disturbance structure is arranged in each micro-channel in the fluid flowing direction. According to the embedded micro-fluidic active heat dissipation structure disclosed by the invention, a micro-fluidic channel system with a specific shape is constructed in the diamond substrate, and jet reinforcement, disturbance enhancement and manifold shunting design are combined, so that the ultrahigh heat dissipation capability under low energy consumption is realized, the problem that the heat dissipation efficiency of an existing silicon-based micro-channel is limited is effectively solved, and the heat dissipation efficiency of the silicon-based micro-channel is improved. And an efficient, stable and integratable thermal management scheme is provided for a high-power electronic device.

The invention provides a high-thermal-conductivity low-modulus graphene fiber heat-conducting gasket and a preparation method thereof. Graphene fibers are directionally wound and impregnated to prepare a prepreg, the prepreg is laminated and bonded to form a high-orientation fiber plate, and then the high-orientation fiber plate is directionally cut in the direction perpendicular to the fibers to obtain the heat-conducting gasket composed of continuous vertical fibers and organic silicon. The fiber is of an X-shaped crossed network structure, and is combined with an elastic silica gel matrix to form a hinge-like structure which can be highly deformed under the orientation of 0.5-10 degrees and-10--0.5 degrees, so that the compression resilience and durability are remarkably improved, and meanwhile, efficient heat conduction is kept. According to the structure, the problems of buckling, fracture and stress concentration which are easily caused by traditional vertical or random arrangement are avoided. A one-way felt impregnation lamination cutting method is adopted, the processing problem caused by high filler is solved, the fiber content can reach 85.1 wt%, and the array density is 2.4-195.9 mg / cm. The gasket has high thermal conductivity, low modulus and excellent rebound resilience, and is suitable for thermal management of high-power electronic equipment such as electronic base stations, communication radars, new energy automobiles, aerospace and the like.

The invention provides a power module and a gate control circuit. The power module provided by the invention comprises more than two bridge arm groups which are connected in parallel, the power module has a first conduction mode and a second conduction mode, and in the first conduction mode, the more than two bridge arm groups are conducted; and in the second conduction mode, one part of the more than two bridge arm groups is conducted, and the other part of the more than two bridge arm groups is turned off. According to the invention, the integration level of the power electronics can be improved, the power electronics are miniaturized, the power density is improved, and the production cost is reduced.

The application discloses a surface modification modified lithium-rich manganese-based positive electrode material, and a preparation method thereof. The lithium-rich manganese-based positive electrode material is coated with a fast ion conductor coating layer and a spinel structure layer rich in oxygen vacancies. The spinel structure layer is in-situ generated on the surface of the lithium-rich manganese-based positive electrode material, and the fast ion conductor coating layer is coated on the surface of the spinel structure layer. The application can improve the electrical properties of the lithium-rich manganese-based positive electrode material, including improving the initial specific discharge capacity and coulombic efficiency, and improving the cycle stability and rate characteristics, so that the lithium-rich manganese-based positive electrode material can meet the development requirements of high-power electronic devices, such as electric vehicles.

The invention discloses an efficient heat transfer liquid cooling micro-channel structure based on topological optimization, which is characterized in that a multi-objective optimization mathematical model taking maximum temperature minimization and pressure drop minimization as objectives is established by constructing a multi-physics field coupling model, defining a design variable and an interpolation model, and iterative solution is carried out by adopting a filtering and projection technology; and the optimal micro-channel layout is obtained. The structure is composed of a main channel and branch micro-channels, the cross section of the main channel is designed in a gradual change mode, the branch micro-channels are distributed according to heat flux density, a smooth curved surface structure is adopted in the connecting position, heat transfer efficiency is effectively improved, flow resistance is reduced, collaborative optimization of heat dissipation performance and energy efficiency is achieved, and the structure is suitable for heat management of high-power electronic equipment.

The invention discloses a shape-stabilized phase change thermal management material, a preparation method thereof and application of the shape-stabilized phase change thermal management material as a thermal management material in a high-power electronic component, and belongs to the field of functional composites.The shape-stabilized phase change thermal management material is prepared by the steps that firstly, fresh pomelo peel is subjected to alkalization and hydrothermal pretreatment, and then ZIF-67 grows on the pretreated pomelo peel in situ; then, the obtained Pre-PP ZIF-67 is subjected to high-temperature calcination to prepare a high-graphitization heterogeneous carbon material, and finally, a phase change material is packaged in a pore channel of the high-graphitization heterogeneous carbon material by adopting a physical infiltration method to prepare the high-performance shaped phase change thermal management material. The prepared phase change heat management material has the advantages of excellent heat conductivity and heat storage performance, good adaptability and operability, lasting stability and reliability, wide application range, reusability and the like, and a new thought is provided for research and development of the high-performance phase change heat management material.

This invention discloses a high thermal conductivity aluminum-silicon / diamond composite material for electronic packaging and its preparation method, comprising: diamond surface modification; mixing silicon powder and modified diamond micropowder with a binder, followed by molding, debinding, and sintering, and then CNC machining and laser cutting to obtain a silicon preform and a diamond preform; assembling the diamond preform into a confined preform by embedding it into a groove in the silicon preform and cold pressing it for shaping; pressure impregnation of high-silicon aluminum melt in a mold, followed by pressure holding and cooling demolding. The composite material has an aluminum-silicon coating-aluminum / diamond interlayer-aluminum-silicon coating sandwich structure, with a thermal conductivity ≥525W / (m·K) and a coefficient of thermal expansion ≤5.0×10⁻⁶. ‑6 / K, interfacial bonding strength ≥280MPa, airtightness ≤5×10 ‑10 Pa·m 3 / s, dimensional tolerance ≤±0.01mm. This invention enables one-time precision molding of complex-shaped electronic packaging materials, which can be used for ultra-high power electronic packaging substrates and heat sinks.

The utility model provides a superconducting electron linear accelerator device for isotope production, which comprises an injector, a superconducting acceleration module and an irradiation target area which are arranged in sequence, and the superconducting acceleration module is connected with a low-temperature cooling system, a radio frequency driving system and a control system; the superconducting acceleration module comprises a low-beta-value Ni3Sn superconducting cavity and five standard Ni3Sn superconducting cavity modules, the low-beta-value superconducting cavity is an SRF acceleration cavity of a 2-cell cavity with beta = 0.7, and each standard superconducting cavity module consists of four SRF acceleration cavities of the 2-cell cavity with beta = 1 which are connected in series; and the input end of the standard superconducting cavity module adopts a symmetrical double-input coupler. According to the linear accelerator device provided by the utility model, the Ni3Sn superconducting cavity adopts a 2-cell and double-input coupler structure, so that the power requirement of high-power input coupling can be reduced under high flow intensity, a high-power electron beam is generated at lower cost, and efficient and economic production of isotopes is realized.

The invention relates to the technical field of single-phase immersion type liquid cooling liquid, and particularly provides single-phase immersion type composite cooling liquid for high-power electronic equipment and a preparation method, and the composite cooling liquid is composed of poly-alpha-olefin, a composite heat conduction component, a composite flame-retardant system and a functional auxiliary agent. The method comprises the following steps: mixing nano boron nitride, graphene and a silane coupling agent which accounts for 1-2% of the total mass of the nano boron nitride and the graphene, and stirring to finish surface modification; heating poly-alpha-olefin, adding the modified composite heat-conducting component, and continuously stirring at a high speed to obtain a mixture; after the heat-conducting phase is dispersed, cooling the mixture, adding a composite flame-retardant system composed of phosphate and melamine cyanurate, and stirring; adding a functional auxiliary agent, and continuously stirring until the functional auxiliary agent is completely dissolved and uniformly dispersed; the finished cooling liquid is obtained. Through collaborative optimization of all the components, the comprehensive performance of high heat conductivity, strong flame retardance, excellent chemical stability and wide material compatibility is achieved at the same time.

The invention provides a turbulence-enhanced bent flow channel liquid cooling plate and a production process thereof, and relates to the technical field of heat dissipation of electronic devices. The invention relates to a turbulence-enhanced liquid cooling plate with a bent flow channel. The liquid cooling plate comprises a substrate and a red copper pipe embedded in the substrate, four embedded grooves are formed in the surface of the substrate; the red copper pipe is embedded in the embedded groove, and the copper pipe is continuously bent to form a tandem four-channel flow channel; a plurality of horizontal-downward-lifting bending units are arranged on the straight pipe section of the copper pipe at intervals, and the bending angle of each bending unit is 30 degrees. Cooling liquid is forced to form turbulent flow through sudden change of the flow channel direction, a laminar flow boundary layer is broken, and the convection heat exchange efficiency is remarkably improved; and moreover, no built-in component is needed, the structure is stable, the processing is simple and convenient, and the heat dissipation device is suitable for high-efficiency heat dissipation of high-power electronic devices and battery modules.

The invention relates to a uniform-temperature needle type radiator which comprises a copper substrate and a radiating part located above the copper substrate, a radiating structure is arranged on the radiating part, the radiating structure is of an all-aluminum structure close to a cooling medium inlet, and the radiating structure is of an aluminum-clad copper structure with the higher copper content closer to an outlet. The copper-containing part of the heat dissipation structure and the copper substrate are integrally formed. The heat dissipation effect can be enhanced by increasing the copper content ratio in the front and rear heat dissipation structures, so that the heat conduction performance of the heat dissipation structures is increased in a gradient manner along with the temperature change, the overall heat distribution is more uniform, the local heat resistance is reduced, the balance of high heat exchange performance and light weight is achieved, and the service life is prolonged. The method is especially suitable for an efficient thermal management system of a high-power electronic component.

Devices, systems, and methods include a conductive textile (106) comprising a plurality of conductive strands and a flexible bus (102). The flexible bus (102) includes a conductive gel (104) electrically coupled to the conductive strands and an encapsulant (108) bonded to the conductive textile (106) and configured to contain the conductive gel (104) in contact with the conductive strands. The flexible bus is configured to be electrically coupled to a power source and induce a current from the power source to the conductive strands.

The invention discloses a synergetic phase change uniform temperature type thermal buffer with overload adaptability, and relates to the technical field of aerospace thermal management and heat dissipation of high-power electronic devices. The uniform-temperature type heat buffer comprises a heat storage cavity, a heat pipe assembly, a liquid filling opening and a fractal tree rib structure arranged in the heat storage cavity. The condensation section shell, the heat storage cavity base body and the three-dimensional fractal tree rib structure of the heat pipe assembly are integrally formed through additive manufacturing, so that a continuous metal heat conduction channel is formed, and the interface heat resistance between the heat pipe assembly and the heat storage cavity is reduced. The fractal tree rib structure is of a main vein-branch-tip step-by-step bifurcated self-similar topological configuration in the direction away from the condensation section of the heat pipe assembly, is used for rapidly expanding heat from the condensation section to the phase change material in the heat storage space, and serves as a crystallization nucleation framework in the phase change material solidification process. Cooperative coupling of rapid heat transfer of the heat pipe and latent heat storage of the phase change material is achieved, the internal temperature gradient of the phase change material can be reduced, and the temperature uniformity, the cycling stability and the high-overload working condition adaptive capacity in the heat buffering process are improved.

The invention discloses a composite ceramic. The composite ceramic comprises the following raw materials in parts by weight: 50-70 parts of aluminum nitride powder, 30-40 parts of diamond powder and 3-8 parts of an organic binder. The composite ceramic has high thermal conductivity, good insulativity and controllable cost, and is particularly suitable for a heat dissipation substrate or a ceramic circuit board of a high-power electronic device.