Thermal management for solid state high-power electronics

a technology for solid-state high-power electronics and heat management, applied in semiconductor lasers, semiconductor/solid-state device details, lighting and heating apparatus, etc., can solve the problems of reducing device reliability, limiting the performance of further enhancements, and reducing the cooling requirements of the new generation of heat-generating components (hgc), so as to achieve the effect of small power and suitable for large-volume production
US20120273164A1Inactive Publication Date: 2012-11-01VETROVEC JAN
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
VETROVEC JAN
Publication Date
2012-11-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention is for an apparatus and method for removal of waste heat from heat-generating components including high-power solid-state analog electronics such as being developed for hybrid-electric vehicles, solid-state digital electronics, light-emitting diodes for solid-state lighting, semiconductor laser diodes, photo-voltaic cells, anodes for x-ray tubes, and solids-state laser crystals. Liquid coolant is flowed in one or more closed channels having a substantially constant radius of curvature. Suitable coolants include liquid metals and liquids with low vapor pressure. The former may be flowed by magneto-hydrodynamic effect or by electromagnetic induction. The latter may be flowed by magnetic forces. Alternatively, an arbitrary liquid coolant may be used and flowed by an impeller operated by electromagnetic induction or by magnetic forces. The coolant may be flowed at very high velocity to produce very high heat transfer rates and allow for heat removal at very high flux.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority from U.S. provisional patent applications U.S. Ser. No. 61 / 463,040, filed on Feb. 12, 2011 and entitled “Thermal Management for Solid State High-Power Electronics,” and U.S. Ser. No. 61 / 463,210, filed on Feb. 14, 2011 and entitled “Thermal Management for Solid State High-Power Electronics,” the entire contents of all of which are hereby expressly incorporated by reference This patent application is a continuation-in-part patent application of: U.S. Ser. No. 12 / 290,195 filed on Oct. 28, 2008 and entitled HEAT TRANSFER DEVICE; U.S. Ser. No. 12 / 584,490 filed on Sep. 5, 2009 and entitled HEAT TRANSFER DEVICE; and U.S. Ser. No. 12 / 932,585 filed on Feb. 28, 2011 and entitled THERMAL INTERFACE DEVICE; the entire contents of all of which are hereby expressly incorporated by reference.FIELD OF THE INVENTION

[0002] This invention relates generally to a removal of heat from heat-generating component and more specifical...

Claims

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