Liquid-cooled fully sealed high-efficiency radiating electronic cabinet

A fully enclosed, chassis technology, applied in refrigerators, cooling/ventilation/heating transformation, compressors, etc., can solve the problems of low power, bulky, bulky, etc., and achieve low cost, high heat exchange efficiency, and small volume Effect

Inactive Publication Date: 2009-12-23
沈国忠
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This heat dissipation method has great limitations. One is that it is bulky and heavy; the other is that the power is small. For example, a digital TV transponder adopts a cast alumin

Method used

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  • Liquid-cooled fully sealed high-efficiency radiating electronic cabinet
  • Liquid-cooled fully sealed high-efficiency radiating electronic cabinet
  • Liquid-cooled fully sealed high-efficiency radiating electronic cabinet

Examples

Experimental program
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Embodiment Construction

[0028] The invention provides a heat dissipation method and a heat dissipation device for a fully enclosed electronic chassis that needs to be waterproof, moisture-proof, dustproof and electromagnetic shielding. The method and device adopt a mutually independent design method for the fully enclosed electronic chassis host and the external radiator chassis , In order to realize the full enclosure of the electronic chassis host; the heating electronic components are fixed on the inner radiator inside the host, the inner radiator is made of high thermal conductivity metal materials such as aluminum, copper, etc., and the heat generated is inside the inner radiator The circulating liquid cooling is exported to the outer radiator for cooling, in order to achieve the purpose of efficient heat dissipation.

[0029] The liquid-solid phase point of the cooling liquid in the circulating liquid cooling device is not lower than minus 20°C, and the boiling point is not lower than 90°C. So as t...

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Abstract

The invention relates to radiating technology applied to fully sealed electronic cabinets, in particular to a radiating method and a radiating device applied to high power electronic equipment required to be fully sealed in outdoor severe environment. The invention adopts a cooling liquid circular cooling device; cooling liquid absorbs heat generated when power elements work through a liquid-cooled radiator arranged in a mainframe; a recycle liquid pump conveys the cooling liquid having absorbed the heat into a high-efficiency radiator outside the mainframe; and a fan of the high-efficiency radiator performs enforced air cooling on the cooling liquid so as to achieve the aim of high-efficiency radiating, wherein the mainframe adopts a fully sealed cabinet structure so as to achieve the waterproof, dampproof, dustproof and electromagnetic shielding aims. The device adopting the radiating technology has the advantages of high power, small volume, easy control of temperature, low noise, low cost, high heat exchange efficiency and the like.

Description

Technical field [0001] The present invention relates to a heat dissipation technology and a heat dissipation device for a chassis used in electronic equipment that needs to be fully enclosed, in particular to a waterproof, moisture-proof, dust-proof and electromagnetic shielding chassis for high-power electronic equipment in outdoor or other harsh environments Heat dissipation method and heat dissipation device using the method. Background technique: [0002] With the rapid development of digital TV, mobile communications and other markets and technologies, electronic equipment that works outdoors or in other harsh environments has attracted more and more attention from users, such as medium and low power transmitters, transponders, base stations, and repeaters. Wait. Working outdoors can be closer to the required coverage area, reducing the power requirements of the equipment, without building a computer room, greatly reducing networking costs, reducing electromagnetic pollution...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K5/06H05K9/00F25B1/00
CPCH05K7/20609
Inventor 沈国忠
Owner 沈国忠
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