Preparation method and application of high thermal and electrical conductivity adhesive

A conductive adhesive, high thermal conductivity technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problem of not meeting the heat dissipation requirements of high-power density packaging systems, poor particle interface overlap, poor density of conductive adhesives, etc. problems, achieve the effects of reducing microscopic interface defects, excellent electrical and thermal conductivity, and efficient thermal conduction pathways

Active Publication Date: 2018-06-01
KUNMING INST OF PRECIOUS METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional conductive adhesives have poor density and poor overlap between particle interfaces, failing to form an effective thermal conduction network in contact with each other. Therefore, traditional conductive adhesives can only be used in packaging systems with low power density at present, and cannot meet the requirements for high power density. Package system heat dissipation requirements

Method used

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  • Preparation method and application of high thermal and electrical conductivity adhesive
  • Preparation method and application of high thermal and electrical conductivity adhesive
  • Preparation method and application of high thermal and electrical conductivity adhesive

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preparation example Construction

[0034] The preparation method of the conductive and thermally conductive adhesive of the embodiment of the present invention comprises the following steps:

[0035]The preparation of a high thermal conductivity conductive adhesive comprises the following steps: mixing and dispersing silver powder, an organic carrier and organic bentonite to prepare a conductive paste. Specifically, it consists of the following raw materials in mass percent: 44-56wt% flake silver powder, 25-35wt% organic silver complex, 15-25wt% organic carrier. Novolac epoxy resin and silicone resin obtained by modifying 24-44wt% hyperbranched polymer are dissolved in 52-73wt% terpineol, butyl carbitol, dimethylformamide, diethylene glycol butyl ether acetic acid In one or more mixed solvents of ester, tributyl citrate, cyclohexylisobornyl, tert-butyl methyl ether, DBE, stir in a water bath at a constant temperature of 65-75°C for 2-3 hours, and cool to room temperature after the dissolution is complete , add...

Embodiment 1

[0037] Take the reaction bottle, add 8 parts of silver oxalate and 45 parts of ethylenediamine to 5 times of carbitol acetate, stir and dissolve with magnetic force to obtain an organic silver complex.

[0038] Novolac epoxy resin obtained by modification of 30wt% hyperbranched polymer, silicone resin is added to 68wt% dimethyl glutarate, DBE mixed solvent according to (W:W=1:1) (V:V=1 : 1), stirring in a water bath at a constant temperature of 65°C for 3 hours, cooling to room temperature after the dissolution is complete, adding 2wt% dicyandiamide containing a small amount of catalyst PPTS, dispersing for 2 hours at a high speed, and ultrasonically dispersing for 50 minutes to obtain a uniformly dispersed organic carrier.

[0039] Take raw materials by the following mass percentages: 75wt% sheet powder (tap density 5.6g / cm 3 , average particle size 6.1um, specific surface area 1.5m 2 / g), 13wt% organic silver complex, 12wt% organic vehicle; the organic vehicle and flake sil...

Embodiment 2

[0041] Take the reaction bottle, add 10 parts of silver lactate, silver citrate (W:W=1:2) and 25 parts of sec-butylamine, 2,4-dimethylaniline (V:V=2:1) ​​to 8 times In a mixed solvent of butyl carbitol and tetrahydrofuran (V:V=2:1), the organic silver complex was obtained by magnetically stirring and dissolving.

[0042] Novolac epoxy resin obtained by 32wt% hyperbranched polymer modification, silicone resin is added in 65wt% terpineol, diethylene glycol butyl ether acetate mixed solvent according to (W:W=2:1) ​​(V : V=3:1), stirring in a water bath at a constant temperature of 70°C for 2.5 hours, cooling to room temperature after complete dissolution, adding 3wt% amino resin containing a small amount of catalyst TSOH, dispersing at high speed for 1 hour, and ultrasonically dispersing for 40 minutes to obtain uniform dispersion organic carrier.

[0043] Take the raw material by the following mass percentage: 70wt% sheet powder (tap density 5.9g / cm 3 , average particle size 5...

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Abstract

The invention discloses a preparation method and application of a high thermal and electrical conductivity adhesive. The heat transfer between a high-frequency, high-heat and high-density electronic chip and a heat sink is satisfied, and the reliability and the stability of the service of high-power electronic components are improved. A conductive filler used in the high thermal and electrical conductivity adhesive provided by the invention is nano-silver heat-reduced from flake silver powder and an organic silver complex. The high thermal and electrical conductivity adhesive is prepared fromthe following raw materials by mass percent: 65 to 75 wt% of flake silver, 13 to 22 wt% of organic silver complex, and 12 to 18 wt% of organic carrier. The preparation method and application of the high thermal and electrical conductivity adhesive disclosed by the invention have the advantages that an organic silver complex solution is adopted to effectively regulate and control the viscosity of aslurry, the microscopic interface defects caused by the flake silver as a 'framework' are overcome, the phonon transmission efficiency is improved, and a more efficient thermal conductivity path is constructed; on the other hand, during heat curing, the organic silver complex undergoes in-situ reduction sintering while resin is cured by heating, an effective link between a substrate and a chip can be achieved, and a high-thermal-conductivity structure can be constructed.

Description

technical field [0001] The invention relates to the technical field of thermal management materials, and relates to a preparation method and application of a high thermal conductivity conductive adhesive. Background technique [0002] Traditional conductive adhesives have poor density and poor overlap between particle interfaces, failing to form an effective thermal conduction network in contact with each other. Therefore, traditional conductive adhesives can only be used in packaging systems with low power density at present, and cannot meet the requirements for high power density. Package system heat dissipation requirements. [0003] Metal elemental silver has good thermal and electrical conductivity properties, which can greatly improve the comprehensive performance of thermal and conductive adhesives compared with non-metallic thermal and conductive phases. However, it is a major challenge to uniformly disperse these silver nanoparticles with high surface free energy a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J183/04C09J163/00C09J11/04
CPCC08K2003/0806C08K2201/001C08K2201/011C08L2205/03C09J9/02C09J11/04C09J163/00C09J183/04C08L63/00C08L67/00C08K7/00C08K3/08C08L83/04
Inventor 李俊鹏王成陈家林李文琳刘继松黄宇宽古天鹏王珂冯清福
Owner KUNMING INST OF PRECIOUS METALS
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