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High heat-conducting insulating silicon rubber and preparation method thereof

A technology of insulating silicon and high thermal conductivity, which is applied in the field of silicone rubber and its preparation, can solve problems such as low thermal conductivity, inability to meet the heat dissipation requirements of high-power electronic devices, and poor performance of thermal interface materials, so as to improve thermal conductivity and meet The effect of heat dissipation and application requirements

Active Publication Date: 2012-08-01
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance of thermal interface materials prepared by filling different thermally conductive fillers varies greatly. The thermal conductivity of existing thermal interface materials is not high, at 1-2W / m·K, which cannot meet the heat dissipation requirements of high-power electronic devices.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1. Preparation of modified thermally conductive filler

[0020] Mix 400 parts of needle-like ZnO of 1 μm, 100 parts of flaky BN of 5 μm and 100 parts of columnar AlN of particle size 0.5 μm with silane coupling agent A151 in a high-speed mixer to obtain modified thermally conductive fillers, silane coupling agent The amount of A151 added is 0.5-1% of the mass of each thermal conductive filler.

[0021] 2. Mixing

[0022] Mix the modified thermally conductive filler prepared in step 1 and 100 parts of dimethyl vinyl silicone rubber on a mixer evenly, and then add 2,5-dimethyl-2 , 5-bis(tert-butylperoxy)hexane, thinly passed 8 times, mixed evenly, and left at room temperature for 8h to obtain a mixed rubber.

[0023] 3. Vulcanization

[0024] Vulcanize the mixed rubber obtained in step 2 at 180°C and 7MPa for 10 minutes, then cool and mold at room temperature and 5MPa for 5 minutes; finally, perform secondary vulcanization at 200°C for 3 hours under blast conditions, a...

Embodiment 2

[0027] 1. Preparation of modified thermally conductive filler

[0028] Mix 400 parts of needle-like ZnO of 1 μm, 100 parts of flaky BN of 5 μm and 100 parts of columnar AlN of particle size of 1 μm with silane coupling agent KH550 in a high-speed mixer to obtain modified thermally conductive filler, silane coupling agent KH550 The amount added is 0.5-1% of the mass of each thermal conductive filler.

[0029] 2. Mixing

[0030] Mix the modified thermally conductive filler prepared in step 1 and 100 parts of dimethyl vinyl silicone rubber on a mixer evenly, and then add 2,5-dimethyl-2 , 5-bis(tert-butylperoxy)hexane, thinly passed 8 times, mixed evenly, and left at room temperature for 8h to obtain a mixed rubber.

[0031] 3. Vulcanization

[0032] Vulcanize the mixed rubber obtained in step 2 at 180°C and 7MPa for 10 minutes, then cool and mold at room temperature and 5MPa for 5 minutes; finally, perform secondary vulcanization at 200°C for 3 hours under blast conditions, an...

Embodiment 3

[0035] 1. Preparation of modified thermally conductive filler

[0036] 400 parts of 1 μm acicular ZnO, 100 parts of 5 μm flake BN, 50 parts of 0.5 μm columnar AlN and 50 parts of 5 μm spherical Al 2 o 3 The silane coupling agent A151 is uniformly mixed in a high-speed mixer to obtain a modified thermally conductive filler, and the amount of the silane coupling agent A151 added is 0.5-1% of the mass of each thermally conductive filler.

[0037] 2. Mixing

[0038] Mix the modified thermally conductive filler prepared in step 1 and 100 parts of dimethyl vinyl silicone rubber on a mixer evenly, and then add 2,5-dimethyl-2 , 5-bis(tert-butylperoxy)hexane, thinly passed 8 times, mixed evenly, and left at room temperature for 8h to obtain a mixed rubber.

[0039] 3. Vulcanization

[0040] Vulcanize the mixed rubber obtained in step 2 at 180°C and 7MPa for 10 minutes, then cool and mold at room temperature and 5MPa for 5 minutes; finally, perform secondary vulcanization at 200°C f...

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PUM

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Abstract

The invention discloses high heat-conducting insulating silicon rubber and a preparation method thereof. Dimethyl vinyl silicon rubber is used as base rubber; 2,5-dimentyl-2,5-di (peroxy-tert-butyl) hexane is used as a curing agent; needle-like ZnO, spherical Al2O3, flaky BN and columnar AIN are used as heat-conducting fillers; and the fillers are closely accumulated by reasonably matching the heat-conducting fillers in different forms and with different particle diameters to form a large quantity of heat-conducting passages. The silicon rubber has high heat resistance and is not deformed after long-term use, the heat conductivity reaches 3.8W / m.K (ASTM D 5470, Hot Disk method), the strength is 5MPa, the volume resistivity is 1,014 omega.cm, the Shore hardness is 50 to 70, and the siliconrubber can meet the heat dissipation and insulating requirements of various high-power electronic devices.

Description

1. Technical field [0001] The invention relates to a silicone rubber and a preparation method thereof, in particular to a high thermal conductivity insulating silicone rubber and a preparation method thereof, which are mainly used in various high-power electronic devices. 2. Background technology [0002] Thermally conductive fillers are SiO 2 , SiC, AlN, Al 2 o 3 , ZnO and other metal oxides and metal materials. The performance of thermal interface materials prepared by filling different thermally conductive fillers varies greatly. The thermal conductivity of existing thermal interface materials is not high, at 1-2W / m·K, which cannot meet the heat dissipation requirements of high-power electronic devices. 3. Contents of the invention [0003] The invention aims to provide a high thermal conductivity insulating silicone rubber and a preparation method thereof. The technical problem to be solved is to improve the thermal conductivity of the silicone rubber to meet the he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K13/06C08K7/18
Inventor 徐卫兵白仁斗罗小霞胡伟周正发任凤梅
Owner HEFEI UNIV OF TECH
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