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Working device for substrate

A technology for working devices and substrates, applied to electrical components, electrical components, etc., can solve the problems of reduced power supply efficiency, increased cost, impediment to miniaturization and light weight, etc. The effect of quantification

Active Publication Date: 2013-03-06
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in the contactless power supply using a single long and large power supply element as exemplified in Patent Documents 2 and 3, as described above, the power supply efficiency is greatly reduced.
On the other hand, in contactless power supply using a plurality of small power supply elements, a plurality of position detection mechanisms are required, and the cost increases accordingly
In addition, space for arranging multiple position detection mechanisms is required on the fixed side, which hinders miniaturization and weight reduction
Furthermore, since the power supply function of the power supply element is unstable immediately after the power supply is started, if the time to start power supply to the power supply element is delayed with respect to the approach of the moving object, the power supply function may be unstable.

Method used

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  • Working device for substrate
  • Working device for substrate

Examples

Experimental program
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Embodiment Construction

[0053] refer to Figure 1~4 The component mounting apparatus 1 of 1st Embodiment equivalent to the board|substrate working apparatus of this invention is demonstrated. figure 1 It is a perspective view which shows the whole structure of the component mounting apparatus of 1st Embodiment. As shown in the figure, the component mounting device 1 is composed of two identical devices arranged adjacently, and one set of devices will be described below. The component mounting apparatus 1 is constituted by assembling a substrate conveyance device 12 , a component supply device 13 , a component transfer device 14 , a component camera 15 , a control computer 16 , and the like on a base 11 . Such as figure 1 As shown by the XYZ coordinate axes on the upper right of the , the horizontal width direction of the component mounting machine 1 (from figure 1 The direction from the upper left to the lower right of the paper surface) is set as the X-axis direction, and the horizontal length di...

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PUM

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Abstract

The present invention relates to a working device for a substrate, and the device is low in costs, miniature and light and is provided with a non-contact power supply part for providing stable power supply function and ensuring high power supply efficiency compared with the prior art. A head driving mechanism for driving a working head comprises a track limiting mechanism; non-contact power supply components arranged along the track limiting mechanism; selection switches for independently switching electricity of each non-contact power supply component; a movable part use for maintaining the working head and arranged on the track limiting mechanism; a drive device for enabling the movable part to move along the track limiting mechanism; a non-contact power receiving component arranged on the movable part and used for receiving power from one part of the non-contact power supply component and at least supplying power for the working head or the driving device; and a power supply control part for controlling the selection switch.

Description

technical field [0001] The present invention relates to a substrate working device such as a component mounting device and a substrate inspection device that perform predetermined operations for producing a substrate on which a plurality of components are mounted. organization. Background technique [0002] There are solder printing equipment, component mounting equipment, reflow equipment, board inspection equipment, etc. as board working equipment for producing boards on which many components are mounted. Most of these devices are connected by a board transfer device to form a board production line. Among them, the component mounting apparatus generally includes a substrate transfer device for loading and unloading substrates, a component supply device for supplying components, and a component transfer device including a mounting head for mounting components and a head driving mechanism. The head drive mechanism has, for example, a ball screw feed mechanism driven by a se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
Inventor 野村壮志石浦直道神藤高广
Owner FUJI KK
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