Cutting method for free-space photoisolator chip body

Abstract

The invention discloses a cutting method for a free-space photoisolator chip body. The free-space photoisolator chip body comprises a first plane as a light emitting surface of light and a second plane perpendicular to the first plane. The cutting method is characterized in that the cutting method comprises the following steps : A, cutting the chip body in the direction parallel to the second plane by using a blade and cutting the chip body into a plurality of chip strips; B, turning various chip strips into 90 degrees or 270 degrees by using long sides of the chip strips as axes; C, rotating each blade or each chip strip around the axis perpendicular to the second plane at an angle of 6 to 10 degrees; and D, cutting the chip strips in the direction perpendicular to the second plane by using the blade to form a plurality of rhombohedrons. According to the cutting method disclosed by the invention, the utilization rate of a photoisolator chip material can be effectively increased while the chip with low reflection of the photoisolator is obtained.

Description

technical field [0001] The invention relates to a processing method of an optical device, in particular to a cutting method of an optical isolator chip body. Background technique [0002] Semiconductor lasers are very sensitive to reflected light. When the intensity of reflected light reaches a certain level, it will cause instability in the work of the light source, resulting in frequency drift, amplitude changes, etc., which will affect the normal operation of the semiconductor laser. In order to avoid the reflected light from affecting the light source If the device is affected, an optical isolator must be used to suppress the reflected light to ensure the stable operation of the laser. [0003] In order to solve the above problems, most semiconductor lasers use an optical isolator to protect the laser, but the isolator itself will also bring reflections, so the Chinese invention patent application 201110185228.9 discloses that the first optical sheet in the optical isola...

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Problems solved by technology

[0004] Different from this, in order to solve the same problem, the existing technology adopts the route of processing the chip body of the optical isolator, and processes the chip body of the optical isolator into a rhombus to avoid the influence of reflected light on the light source, and usually The approach taken in the case is, if figure 1 As shown, the free-space optical isolator chip body 1 includes a first plane 2 as the incident surface of light and a second plane 3 perpendicular to the first plane, and a wedge 4 is added below the optical isolator chip body 1, but, Since the blade in this method does not cut vertically into the isolator chip body, it must be cut with a thick blade to ensure the success of the cut. However, a thick blade will result in a larger cutting groove, and the cutting groove has a greater impact on the optical isolator. The chip body causes a certain loss, which in turn reduces the utilization rate of raw materials

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