A single-side polishing process for solar monocrystalline silicon cells

Abstract

The invention discloses a single-side polishing process of a solar monocrystalline silicon battery and aims at solving problems that silicon chips are too thin due to the fact that thickness reduction of monocrystalline silicon chips is over-large by means of double-side polishing, reaction of chained single-side alkaline polishing solutions is difficult to control, chained acid polishing is severe in pollution, and wastewater treatment is difficult. The single-side polishing process comprises three main steps of a former process, a back-side polishing and silk-screen printing and sintering, and the single-side polishing process has the advantages that the polishing solutions are free from metal ion pollution, thickness reduction of the silicon chips is low, an etching process is not required, the polishing solutions are convenient to adjust, and costs of devices are low.

Description

technical field [0001] The invention relates to the technical field of solar cell production, in particular to a single-side polishing process for solar monocrystalline silicon cells. Background technique [0002] In the production of conventional solar crystalline silicon cells, the back surface is generally treated by texturing or polishing. The back polishing has attracted the attention of various companies because of the following advantages: 1) The reflectivity of the back surface is increased, which improves the long-wavelength light on the cell. 2) Improving the back contact, the aluminum powder particles in the conductive aluminum paste used on the back of the battery in the conventional battery process are about 5-20 μm, and the size of the pyramid texture formed after the silicon wafer is textured is 1-5μm, when the aluminum powder is in contact with the back of the battery, due to the overhead effect of the pyramid, the contact area is small. If the back is change...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that double-sided polishing is too large for the thinning of single crystal silicon wafers, resulting in too thin silicon wafers; the problem of difficult control of the reaction of the chain-type single-sided alkali polishing polishing solution; the chain-type acid polishing has large pollution and waste water To deal with difficult problems, provide a single-sided polishing process for solar monocrystalline silicon cells, which has the advantages of no metal ion pollution in the polishing solution, low silicon wafer thinning, convenient adjustment of the polishing solution, and low equipment cost

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