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Electronic apparatus

A technology for electronic devices and circuit substrates, applied in electrical components, structural parts of electrical equipment, cooling/ventilation/heating renovation, etc., can solve the problems of not ensuring heat dissipation efficiency and high manufacturing costs

Inactive Publication Date: 2013-03-13
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cooling fan is necessary, there is a problem of high manufacturing cost
[0006] In the electronic device disclosed in Patent Document 2, a heat sink with pin-type fins is used to dissipate heat. However, there is no structure for effectively dissipating the heat dissipated from the heat sink to the outside, and a sufficiently high temperature cannot be ensured. cooling efficiency

Method used

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  • Electronic apparatus
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Embodiment Construction

[0082] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0083] In the following best mode, an electronic device according to an embodiment of the present disclosure is applied to a network communication device having a function of outputting images and videos obtained by communication to a display device such as a television receiver and displaying them on This displays the capabilities on the device.

[0084] The application scope of the electronic device according to the embodiment of the present disclosure is not limited to the network communication device. The electronic device according to this embodiment of the present disclosure can be widely applied to other various electronic devices such as recording / reproducing devices for images and videos, audio recording / reproducing devices, imaging devices, and personal computers or PDAs (Personal Data Assistants). ) Such an information processing device.

[0085] In the fo...

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PUM

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Abstract

An electronic apparatus includes: an outer casing in which an air inflow hole allowing outside air to flow into internal space and a heat releasing hole releasing air temperature of which has been increased in the internal space to the outside are formed; a circuit substrate arranged in the internal space of the outer casing and on which electronic components to be heat sources at the time of driving are mounted; and a heat sink having an attachment base attached to the circuit substrate and plural fins protruding from the attachment base, wherein the outer casing is provided with fluid guide portions positioned opposite to the plural fins of the heat sink and guiding the air with increased temperature, the fluid guide portions are inclined in directions toward the heat releasing hole and the plural fins are inclined to directions toward the heat releasing hole.

Description

technical field [0001] The present disclosure relates to technical fields related to electronic devices. In particular, the present disclosure relates to the technical field of improving heat dissipation efficiency by inclining fins of a heat sink and an air guide portion provided at an outer cabinet and guiding air whose temperature has risen. Background technique [0002] There are various electronic devices provided with a circuit substrate in an outer case in which a given wiring pattern is formed, such as a recording medium recording / reproducing device, an audio recording / reproducing device, a cellular phone device, an image Recording / reproducing devices, imaging devices, information processing devices, and network communication devices. [0003] Electronic devices with various functions are mounted on circuit substrates, and these devices generate heat when driven. Since the heat generated in the electronic device at the time of driving affects the operation in the e...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20127H05K7/20154H05K7/20145H05K7/20
Inventor 小西达成
Owner SONY CORP