Aligning signal acquisition system and aligning method used in mask aligning

A signal acquisition system and mask alignment technology, which is applied in the direction of photolithography, optics, instruments, etc. on the pattern surface, and can solve the problems of not being able to find the vertical alignment position

Active Publication Date: 2013-03-27
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, only the horizontal alignment position can be obtained, but not the vertical alignment position

Method used

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  • Aligning signal acquisition system and aligning method used in mask aligning
  • Aligning signal acquisition system and aligning method used in mask aligning
  • Aligning signal acquisition system and aligning method used in mask aligning

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Embodiment Construction

[0033] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0034] The invention discloses an alignment signal acquisition system for mask alignment, which is used to determine the position of a workpiece stage relative to a mask stage, comprising: an illumination unit for providing a laser pulse; a mask stage unit composed of It consists of a mask table, a mask table position measurement module, and a mask table control module. The mask table control module moves the mask on the mask table according to the mask table position data obtained by the mask table position measurement module. mark; the projection objective lens is used to image the mask mark; the workpiece table unit is composed of a workpiece table, a workpiece table position measurement module and a workpiece table control module, and the workpiece table control module is based on the workpiece obtained by the workpiece table position measu...

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Abstract

The invention discloses a signal acquisition and signal processing system used in mask aligning. The signal acquisition system comprises an illumination unit used for providing a laser pulse, a mask table, a projection lens unit used for imaging the mask mark, a work bench unit, a light intensity acquisition unit used for acquiring the light intensity signal of a two-dimensional spatial image formed by the mask mark image scanning over a work bench mark, an aligning operation control unit used for receiving and processing information from the mask table unit, the work bench unit and the light intensity acquisition unit, for acquiring a piece of aligning information. The signal processing system provided by the invention is a fitting mathematical model based on parameters comprising maximal light intensity, horizontal aligning position, vertical aligning position, image width and height of two-dimensional spatial image, and the like. Iterative fitting is carried out with a Marquardt iterative algorithm, such that the aligning position, the maximal light intensity value, and the image width and height of the two-dimensional spatial image are obtained.

Description

technical field [0001] The present invention relates to a photolithographic device in the field of integrated circuit and / or other micro device manufacturing, and in particular to an alignment signal acquisition system and an alignment method for mask alignment used in photolithographic equipment. Background technique [0002] Lithography machine is the most critical equipment in the process of integrated circuit processing. Alignment is one of the main processes of the lithography machine. The relative positional relationship between them is determined by special marks on the mask, mask stage, silicon wafer, and silicon wafer stage, so that the mask pattern can be accurately imaged on the silicon On-chip for overlay accuracy. Overlay accuracy is one of the main technical indicators of projection lithography machines. Alignment can be divided into mask alignment and silicon wafer alignment. Mask alignment realizes the relative positional relationship between the mask and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00
Inventor 陈小娟李运锋赵正栋赵新
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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