Flexible circuit board bonding device and method for bonding flexible circuit board

A technology for flexible circuit boards and laminating equipment, which is applied in the direction of assembling printed circuits with electrical components, which can solve the problems of high cost, inconvenient operation, decreased viscosity, etc., and achieve high consistency in mass production, simplified operation difficulty, and accuracy high effect

Active Publication Date: 2013-04-03
SHENZHEN VLG WIRELESS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing FPC antenna bonding is mainly done by hand. This method is inefficient and inconvenient to operate. Fingers are easy to come into contact with the FPC adhesive, resulting in a decrease in viscosity, easy warping, wrinkling, and low efficiency , The production is consistent and unstable, and the cost is high

Method used

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  • Flexible circuit board bonding device and method for bonding flexible circuit board
  • Flexible circuit board bonding device and method for bonding flexible circuit board
  • Flexible circuit board bonding device and method for bonding flexible circuit board

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] see figure 1 , figure 1 It is a structural schematic diagram of the flexible circuit board bonding equipment provided by the present invention. Wherein, the flexible circuit board bonding equipment includes a vertical support 10 , a base 20 , an air cylinder 11 , an upper mold holder 13 , a slider 12 , a lower mold holder 21 and a power supply unit 22 .

[0025] Specifically, the vertical support 10 is fixed on the base 20, the slider 12 is installed on the vertical support 10, and the vertical support 10 is provided with a slide rail for the slider 12 to slide up and down (not ...

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Abstract

The invention discloses a flexible circuit board bonding device and a method for bonding a flexible circuit board. The flexible circuit board bonding device comprises a vertical support, a base, a sliding block capable of sliding vertically on the vertical support, an upper mould fixing seat installed on the sliding block, a cylinder installed on the vertical support and used for driving the sliding block to slide vertically, a lower mould fixing seat installed on the base and a module. The module comprises a lower mould for fixing the flexible circuit board and an upper mould for fixing a machine casing or the support, the upper mould is installed on the upper mould fixing seat, and the lower mould is installed on the lower mould fixing seat. The flexible circuit board bonding device replaces the traditional mode of manually bonding the flexible circuit board, and is high in production efficiency, high in product consistency, low in manufacture cost and strong in practicability.

Description

technical field [0001] The invention relates to the field of built-in antennas of mobile devices, in particular to a flexible circuit board bonding device and a method for bonding the flexible circuit board. Background technique [0002] With the advancement of science and technology, the rapid development of modern wireless communication technology, the appearance and volume of products are also constantly changing, the installation position of antennas is becoming more and more complicated, and the antennas of flexible circuits are more and more widely used. Because the performance of the antenna is very sensitive to the environment, the consistency of the assembly position and the assembly effect of the antenna will affect the consistency of the antenna performance. The requirements for communication equipment continue to increase, improving antenna performance and simplifying the production process are the ultimate goals of antenna optimization. [0003] The existing FP...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
Inventor 卓奇奕杨楚兵
Owner SHENZHEN VLG WIRELESS TECH
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