Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon slice automatic slice counting device based on electronic balance

A technology of electronic balances and silicon wafers, used in measuring devices, instruments, weighing, etc.

Active Publication Date: 2013-04-10
ZHEJIANG COWIN ELECTRONICS
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the actual production process, especially in the shipment inspection process, the check of the number of pieces is very important. The traditional manual spotting cannot meet the high requirements of the existing production for product quality. The photoelectric spotting machine is used in the semiconductor silicon wafer manufacturing industry. Apps have inherent flaws that cannot be avoided

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon slice automatic slice counting device based on electronic balance
  • Silicon slice automatic slice counting device based on electronic balance
  • Silicon slice automatic slice counting device based on electronic balance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The actual use steps of the present invention: (with 285-290, 3-inch circular silicon wafers, 211pcs waiting for confirmation. According to the principle, the single maximum count n=56.)

[0042] 1. Turn on the switch of the device, and place the basket containing silicon wafers on the balance.

[0043] 2. When the display is stable, click Tare.

[0044] 3. Place the test weight on the basket and confirm that the weight display is consistent with the weight identification.

[0045] 4. Enter the silicon wafer thickness 285-290, and select "3 inches", "wafer".

[0046] 5. Put the wafers to be counted into the basket in batches, and click "Accumulate".

[0047] 6. If too many pieces are put in at one time, it will display "Exceeded" and will not be included in the cumulative number of pieces.

[0048] 7. Repeat steps 5-6 to get the final total number of pieces. Get "over", "56", "55", "over", "55", "45", respectively.

[0049] 8. "Accumulated number of pieces" display...

Embodiment 2

[0052] Shipment inspection, N14, 295-300 microns, 501pcs, wafers, 1pcs filter paper every 50pcs interval, of which 1 knife silicon wafer is 51pcs, the final inspection uses the device of the present invention for full inspection, and the final inspection requires 500pcs / box, 50pcs / Knife.

[0053] The inspection is as follows:

[0054] Testing frequency

[0055] 7

Embodiment 3

[0057] 5-inch single reference surface, asymmetric chamfered silicon wafer, thickness 525-530 microns. The number of slices is unknown, and the number of slices is calculated using the device and method of the present invention.

[0058] 1. Input the upper and lower lines of the thickness to get the single maximum count value n=104pcs.

[0059] 2. Select the size "5 inches", "single reference plane", and press "cumulative" to count.

[0060] 3. Divided into multiple counts, respectively "52", "46", "68", "42", "45", a total of 253pcs.

[0061] 4. Checked by manual counting method, it is 253pcs, which is consistent with the result of the counting device.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a silicon slice automatic slice counting device based on an electronic balance. The silicon slice automatic counting device based on the electronic balance comprises the electronic balance which comprises an input and display panel. An internal signal processing device is arranged inside the electronic balance. A numerical value input device, a silicon slice thickness choosing and display device, a silicon specification choosing device a silicon slice size choosing device and a counting result display device are arranged on the input and display panel. After information is input by the input and display panel and processed by the internal signal processing device, silicon slice counting result is displayed. The silicon slice automatic counting device based on the electronic balance is developed based on a common electronic balance, slice number is counted by the utilization of an intrinsic physical property between weight and density, slicing counting of silicon slices can be achieved with high efficiency, and the silicon slice automatic counting device based on the electronic balance has the advantages of being convenient to use, practical and cheap.

Description

technical field [0001] The invention belongs to the field of semiconductor silicon wafer processing and manufacturing in the integrated circuit support industry, and in particular relates to an electronic balance-based automatic silicon wafer counting device, which is suitable for weighing and counting semiconductor silicon wafers. Background technique [0002] The semiconductor silicon wafer manufacturing industry belongs to the integrated circuit support industry. It has always been a key support industry and a strategic emerging industry. However, the statistics of the number of semiconductor silicon wafers have long been completed by manual spotting. Manual spotting is inevitable. Data errors will occur. In the semiconductor industry, which is an extremely rigorous field of production, the number of chips will greatly affect the product image; it will also have an adverse effect on the traceability of production data; loss. [0003] Photovoltaic industry is a rapidly de...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01G19/42
Inventor 孙新利
Owner ZHEJIANG COWIN ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products