Multi-modal combined type energy collector based on flexible polymer piezoelectric materials
An energy harvester, piezoelectric material technology, applied in piezoelectric effect/electrostrictive or magnetostrictive motors, electromechanical devices, electrical components, etc., can solve the problem of high resonant frequency
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Embodiment 1
[0046] Example 1 is d 31 with d 33 Modal composite piezoelectric energy harvester, the structure of the device mainly includes: PVDF film, PVDF cantilever beam, quality block, copper support column. The vibration in the external environment will cause the PVDF cantilever beam to vibrate, resulting in d 31 modal output; at the same time, the end mass vibrates with the PVDF cantilever beam and knocks the PVDF film on the lower substrate to generate d 33 Modal output. Since the device does not contain an electromagnetic module, the preparation steps of the inductance coil can be omitted, and the quality block at the end of the PVDF cantilever beam can also be replaced by other materials. The specific preparation steps are as follows:
[0047] (1) Prepare a PVDF film and PVDF cantilever beam with a thickness of 100 μm and metal aluminum electrodes;
[0048] (2) Place the PVDF film on the lower substrate;
[0049] (3) Build copper pillars to support the PVDF cantilever beam an...
Embodiment 2
[0055] Example 2 in d 31 with d 33 On the basis of the modal compound piezoelectric energy harvester, an electromagnetic module is added. The structure of the device mainly includes: PVDF film, PVDF cantilever beam, mass block, copper support column and MEMS planar inductance coil. When the external vibration makes the PVDF cantilever beam vibrate, in addition to generating piezoelectric output, the magnetic flux in the inductor coil will change to generate electromagnetic output. The specific preparation steps are as follows:
[0056] (1) Preparation and wafer cleaning;
[0057] (2) Oxidation and growth of 300nm SiO on both sides of the silicon wafer 2 Insulation;
[0058] (3) Sputtering 30nm Ti seed layer and 300nm Cu seed layer;
[0059] (4) Spin-coat positive resist with a thickness of 10 μm, and photolithography;
[0060] (5) Electroplated planar spiral Cu coil with a height of 10 μm;
[0061] (6) Remove photoresist;
[0062] (7) Remove the Ti / Cu seed layer;
[00...
Embodiment 3
[0072] Example 3 is in d 31 with d 33 On the basis of the modal composite piezoelectric energy harvester, a PVDF film is also added to the upper substrate, that is, the MEMS planar inductance coil in Example 2 is replaced by a PVDF film. The structure of the device mainly includes: PVDF film, PVDF cantilever beam, quality block, copper support column. The external vibration causes the PVDF cantilever beam to vibrate, resulting in d 31 modal output; at the same time, the terminal mass knocks the PVDF film on the upper and lower substrates, resulting in d 33 Modal output. Its concrete preparation steps are as follows:
[0073] (1) Prepare a PVDF film with a thickness of 100 μm and a metal aluminum electrode and a PVDF cantilever
[0074] beam;
[0075] (2) Place the PVDF film on the upper and lower substrates;
[0076] (3) Build copper pillars to support the PVDF cantilever beam and the upper substrate;
[0077] (4) Place the PVDF cantilever beam on the copper support, a...
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