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Method and apparatus for de-embedding

A technology of de-embedding and soldering pads, applied in the direction of measuring devices, instruments, electrical components, etc., can solve the problems that cannot fully meet the requirements

Active Publication Date: 2016-06-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, while existing de-embedding methods are generally adequate for their intended purposes, they are not fully satisfactory in every respect

Method used

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  • Method and apparatus for de-embedding
  • Method and apparatus for de-embedding
  • Method and apparatus for de-embedding

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Embodiment Construction

[0044] It should be understood that the following disclosure provides many different embodiments, or examples, for implementing various features of the invention. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are merely examples and not intended to be limiting. Furthermore, the following description of a first component being formed over a second component may include embodiments where the first and second components are formed in direct contact, and may also include that additional components may be formed sandwiched between the first and second components. An embodiment such that the first and second parts are not in direct contact. Various features are arbitrarily drawn in different scales for simplicity and clarity.

[0045] figure 1 A flow chart of a method 11 of de-embedding according to various aspects of the present disclosure is shown. refer to figure 1 , the method 11 begins at block 1...

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Abstract

Disclosed are a de-embedding device and a de-embedding method. The de-embedding device includes: a test structure, including a device under test (DUT) embedded in the test structure; and a plurality of dummy test structures, including an open dummy structure, a distributed open dummy structure and a short dummy structure. The distributed open dummy structure may include a first signal transmission line connected to the left signal test pad and a second signal transmission line connected to the right signal test pad, the first and second signal transmission lines having a total number of signal transmission lines greater than that of the open dummy structure. The total length of the long and short, and the inherent transmission characteristics of the DUT can be obtained from the pseudo-test structure and the transmission parameters of the test structure.

Description

technical field [0001] The present disclosure relates generally to semiconductor devices, and more particularly, to methods and apparatus for de-embedding. Background technique [0002] An integrated circuit (IC) formed on a semiconductor substrate includes a plurality of active and passive devices such as resistors, inductors, capacitors, transistors, amplifiers, and the like. Such components are manufactured to design specifications that define the desired physical / electrical properties (eg, resistance, inductance, capacitance, gain, etc.) that the component will exhibit. While it is desirable to verify that each component manufactured complies with its characteristic design specifications, typically the corresponding component cannot be easily inspected after integration into a circuit. Therefore, "independent" replicas of each IC component are fabricated on a wafer, fabricated using the same process and utilizing the same physical / electrical characteristics as the IC co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L21/66
CPCH01L22/34H01L2924/0002Y10T29/49004H01L2924/00G01R31/26G01R31/3187G01R31/282
Inventor 卓秀英
Owner TAIWAN SEMICON MFG CO LTD